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Renesas 89H64H16G3YCBL

Part No.:
89H64H16G3YCBL
Manufacturer:
Renesas
Category:
Specialized
Package:
1156-BBGA, FCBGA
Datasheet:
Aetrix89H64H16G3YCBL.pdf
Description:
IC INTFACE SPECIALIZED 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,942

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Product details

Overview

The 89H64H16G3 from IDT is a 64-lane, 16-port PCI Express Gen3 system interconnect switch with non-blocking cut-through architecture, 8.0 GT/s per lane, 128 GBps aggregate bandwidth, and support for up to 16 independent switch partitions - deployed in enterprise servers for PCIe expansion, SSD storage arrays, and multi-root I/O consolidation.

For engineers reviewing the 89H64H16G3 datasheet, 89H64H16G3 pinout, 89H64H16G3 application, or 89H64H16G3 equivalent, key selection criteria include Gen3 compliance, partitioned multi-root support, SECDED ECC on internal RAMs, hot-plug capability on all downstream ports, and FCBGA-1156 package compatibility with high-density server PCB layouts.

Technical Context

The 89H64H16G3 implements a full Gen3-compliant PCIe switch core with DL/Transaction Layer and SerDes supporting x8/x4/x2/x1 link widths across all 16 ports. It delivers deterministic low-latency cut-through forwarding and supports multicast per PCIe 3.0 specification.

Its architecture enables dynamic reconfiguration of switch partitions, movable upstream port assignment, and autonomous per-port link width/speed negotiation - all without power sequencing requirements and with dual clock input options (global/local reference).

Key Specifications

ParameterValue and Actual Design Meaning
PCIe GenerationGen3 compliant (8.0 GT/s per lane), backward compatible with Gen2/Gen1
Total Lanes / Ports64 lanes configurable as up to 16 × x4 or 8 × x8 ports
Switching Capacity128 GBps (1024 Gbps) non-blocking aggregate bandwidth
Partition SupportUp to 16 fully independent, dynamically reconfigurable switch partitions
Error ProtectionSECDED ECC on all internal RAMs + end-to-end data path parity
Power StatesSupports D0, D3hot, D3, and Active State Power Management (ASPM)
Hot-PlugSupported on all downstream switch ports with INTx/MSI interrupt on link transition

Pinout & Package

Packaged in a 35 mm × 35 mm 1156-ball Fine-Pitch Chip Array Ball Grid Array (FCBGA) with 0.8 mm ball pitch and standard thermal pad configuration.

Pin/TerminalCircuit RoleDesign Meaning
VDDA_1P0Analog 1.0 V supplyProvides clean power to SerDes analog circuitry; requires dedicated low-noise filtering
REFCLK_P/NDifferential reference clock inputAccepts 100 MHz differential clock for SerDes PLL; supports global or local port-specific sourcing
PERST#PCIe reset signalActive-low asynchronous reset controlling initialization sequence and error recovery
CLKREQ#PCIe clock requestEnables ASPM L1 entry by signaling clock gating request to upstream device
GPI[53:0]General-purpose I/O54 configurable GPIOs usable for status monitoring, board-level control, or debug signaling

Key Features

FeatureDesign Value
Non-blocking cut-through architectureReduces packet latency to ≤150 ns for x16 Gen3 TLPs, enabling real-time I/O consolidation
Multi-root partitioning (up to 16)Enables hardware-isolated PCIe domains for VM-aware servers or secure multi-tenant storage controllers
Advanced Error Reporting (AER)Per-port AER registers capture detailed TLP-level errors for root complex diagnostics and firmware recovery
Automatic lane reversal & width negotiationEliminates manual trace routing constraints and supports mixed-width topologies without BIOS intervention
On-die scope (ODS) + PRBS generator/checkerEnables in-system SerDes eye diagram analysis and link integrity validation without external test equipment

Applications

Enterprise Server I/O ExpansionSSD Storage Array Interconnect

Use Scenario: Adding PCIe slots and NVMe drive bays to 2U/4U rack servers while maintaining Gen3 bandwidth across all endpoints.

IC Role / Device Role / Timing Role: System interconnect switch managing traffic between CPU, memory, and up to 16 downstream PCIe endpoints.

Use Value: Enables 128 GBps non-blocking fan-out from dual CPUs to multiple NVMe SSDs and network adapters without protocol translation overhead.

Use Scenario: Building scalable JBOD or RAID-N storage enclosures with direct-attached PCIe SSDs and host-side failover.

IC Role / Device Role / Timing Role: High-reliability PCIe fabric controller routing peer-to-peer traffic between SSDs and host controllers.

Use Value: Supports hot-plug SSD replacement and SECDED ECC-protected internal routing - critical for enterprise-grade storage uptime.

Multi-Root I/O Virtualization (MR-IOV)Intelligent I/O Module (IOM)

Use Scenario: Partitioning PCIe resources across virtual machines in cloud infrastructure with strict isolation and QoS guarantees.

IC Role / Device Role / Timing Role: Hardware-enforced PCIe domain separator implementing ACS, ARI, and dynamic partition reconfiguration.

Use Value: Delivers certified hardware isolation between tenants - meeting SR-IOV and MR-IOV compliance requirements without software hypervisor bottlenecks.

Use Scenario: Integrating modular I/O subsystems (e.g., FPGA accelerators, SmartNICs) into chassis-based telecom or edge compute platforms.

IC Role / Device Role / Timing Role: Programmable PCIe interconnect hub providing flexible upstream/downstream topology mapping and crosslink support.

Use Value: Allows field-upgradable I/O modules via standardized PCIe interfaces while preserving legacy backplane signal integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen3 switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Microchip Switchtec® PAX161616-lane, 16-port Gen3 switch with integrated DMA engine and SR-IOV acceleration; lacks multi-root partitioningOptimized for accelerator offload and virtualized GPU workloads, not multi-domain server partitioningChoose when DMA coherency and SR-IOV hardware assist outweigh need for 16 independent partitions
AMD/PLX PE874764-lane, 16-port Gen3 switch with identical partition count but no SECDED ECC on internal RAMs; older silicon revisionUsed in legacy enterprise storage systems where RAS features are less critical than costChoose only if lifecycle continuity for existing designs is required and ECC protection is handled externally

Compared with the Microchip PAX1616 and AMD/PLX PE8747, the 89H64H16G3 uniquely combines 16 hardware-isolated partitions, SECDED ECC on all internal RAMs, and autonomous lane reversal - making it the only option qualified for new multi-root, high-availability server and storage platforms requiring concurrent fault containment and Gen3 throughput.

Availability

The 89H64H16G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, SSD storage array interconnect, and intelligent I/O module applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 89H64H16G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) is a fabless semiconductor company specializing in high-performance interface, memory, timing, and RF solutions - acquired by Renesas Electronics in 2019.

The 89H64H16G3 belongs to IDT's PCIe Switch family, engineered specifically for high-throughput, low-latency, multi-root-capable system interconnect in enterprise and datacenter infrastructure.

FAQ

What PCIe generation and lane configurations does the 89H64H16G3 support?

The 89H64H16G3 supports PCIe Gen3 (8.0 GT/s), Gen2 (5.0 GT/s), and Gen1 (2.5 GT/s) operation. It provides 64 total lanes configurable as up to 16 × x4 ports or 8 × x8 ports, with automatic per-port link width and speed negotiation. Each SerDes lane operates independently, enabling mixed-width topologies without manual configuration.

Does the 89H64H16G3 support multi-root I/O virtualization (MR-IOV)?

Yes, the 89H64H16G3 supports up to 16 fully independent switch partitions with configurable downstream device numbering and dynamic reconfiguration. It implements Access Control Services (ACS), Alternative Routing ID (ARI), and movable upstream ports - all required for hardware-enforced MR-IOV compliance in virtualized server environments.

What reliability features are implemented in the 89H64H16G3?

The 89H64H16G3 includes SECDED ECC protection on all internal RAMs, end-to-end data path parity, Advanced Error Reporting (AER) on every port, ECRC support, and IEEE 1149.1/1149.6 JTAG compliance. These features enable robust error detection, containment, and diagnostic visibility in mission-critical server and storage applications using the 89H64H16G3.

Is hot-plug supported on all ports of the 89H64H16G3?

Yes, hot-plug is supported on all downstream switch ports of the 89H64H16G3. The device generates INTx or MSI interrupts on link up/down transitions and provides on-chip link activity/status outputs - enabling OS- and firmware-level hot-plug event handling without external logic. Upstream port hot-plug is not supported.

What evaluation hardware is available for the 89H64H16G3?

IDT provides the 89KTPES64H16G3 Evaluation Board for the 89H64H16G3, bundled with PCIe Browser Software, On-Die Scope (ODS), and built-in PRBS generator/checker. This platform enables full register-level configuration, link training analysis, and real-time traffic monitoring - accelerating bring-up and validation of systems using the 89H64H16G3.

89H64H16G3YCBL Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Applications:
Switch Interfacing
Interface:
PCI Express
Voltage - Supply:
3.3V
Supplier Device Package:
1156-FCBGA (35x35)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

89H64H16G3YCBL FAQ

1.How can I place an order for 89H64H16G3YCBL through Aetrix?

Please submit a Request for Quotation (RFQ) for 89H64H16G3YCBL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 89H64H16G3YCBL reliable?

The price and inventory of 89H64H16G3YCBL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H64H16G3YCBL is usually 5 days.

3.What payment methods are accepted for 89H64H16G3YCBL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89H64H16G3YCBL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 89H64H16G3YCBL?

89H64H16G3YCBL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89H64H16G3YCBL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89H64H16G3YCBL?

For technical support, including 89H64H16G3YCBL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H64H16G3YCBL requirements.

6.How does Aetrix verify that 89H64H16G3YCBL is sourced from the original manufacturer or authorized distributors?

All 89H64H16G3YCBL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H64H16G3YCBL meets industry standards.

7.What is the process for return or replacement of 89H64H16G3YCBL?

All 89H64H16G3YCBL units undergo pre-shipment inspection (PSI). If there is an issue with 89H64H16G3YCBL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89H64H16G3YCBL part is unused and in its original packaging.

Return procedure for 89H64H16G3YCBL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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