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Renesas 89H64H16G3YCBLI
- Part No.:
- 89H64H16G3YCBLI
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
89H64H16G3YCBLI.pdf
- Description:
- IC INTFACE SPECIALIZED 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,160
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Product details
Overview
89H64H16G3 from IDT is a 64-lane, 16-port PCI Express Gen3 system interconnect switch IC with non-blocking architecture, 8.0 GT/s per lane, 128 GBps aggregate bandwidth, and full PCIe Base Specification 3.0 compliance - deployed in enterprise servers for SSD storage arrays and multi-root I/O partitioning.
For engineers reviewing the 89H64H16G3 datasheet, 89H64H16G3 pinout, 89H64H16G3 application, or 89H64H16G3 equivalent, key selection criteria include Gen3 lane count scalability (x8/x4/x2/x1), AER/ACS/ARI support, SECDED ECC on internal RAMs, hot-plug capability on all downstream ports, and 54 GPIO for system initialization and monitoring.
Technical Context
The 89H64H16G3 implements a cut-through switching core with integrated SerDes supporting simultaneous Gen3 (8.0 GT/s), Gen2 (5.0 GT/s), and Gen1 (2.5 GT/s) operation across all 64 lanes. It delivers deterministic latency under 150 ns for 2 KB TLPs and supports multicast forwarding compliant with PCIe 3.0 specification.
Its architecture enables up to 16 independent switch partitions with movable upstream ports, dynamic reconfiguration, and per-port request metering. Initialization is flexible via BIOS, OS driver, SMBus, serial EEPROM, or pin strapping - no power sequencing required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Lane Count | 64 total PCIe lanes - scalable to 8× x8, 16× x4, or mixed configurations for flexible topology design |
| Data Rate | 8.0 GT/s per lane (PCIe Gen3) - backward compatible with 5.0 GT/s (Gen2) and 2.5 GT/s (Gen1) |
| Switching Capacity | 128 GBps bidirectional throughput - enables full-line-rate switching of 16× x4 Gen3 links |
| Max Payload Size | 2 KB - supports high-efficiency data transfers for storage and memory-mapped I/O workloads |
| Error Protection | SECDED ECC on all internal RAMs + end-to-end data path parity - ensures RAS integrity in mission-critical servers |
| Power States | D0, D3hot, D3 - with ASPM L0s/L1 support for dynamic link power optimization |
| GPIO Count | 54 general-purpose I/O pins - used for strap configuration, status monitoring, and board-level control |
Pinout & Package
Packaged in a 35 mm × 35 mm, 1156-ball Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm ball pitch and standard JEDEC MO-271AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_15 | I/O Power Supply | 16 independent 1.0V I/O rails - enable selective power gating per port group |
| VDDA_0–VDDA_7 | Analog SerDes Supply | 8 dedicated 1.0V analog supplies - isolate noise-sensitive SerDes circuitry from digital domains |
| REFCLK_P/N_0–7 | Differential Reference Clock Input | 8 pairs of differential clock inputs - support global/local reference clocks for multi-domain timing |
| PERST# | Global Reset Input | Active-low asynchronous reset - initiates full switch initialization and configuration reload |
| SMBCLK/SMBDAT | SMBus Interface | Two-wire interface - used for runtime configuration, status readback, and firmware updates |
| GPI[0:53] | General Purpose Input | 54 configurable input pins - support strap-based boot mode selection and hardware status signaling |
| GPO[0:53] | General Purpose Output | 54 programmable output pins - drive LEDs, enable power rails, or signal link status to BMC |
Key Features
| Feature | Design Value |
|---|---|
| Non-blocking 64-lane switch core | Enables concurrent full-bandwidth traffic across all 16 ports without arbitration bottlenecks |
| PCIe 3.0 optional feature support | Includes AER, ACS, ARI, TPH, LTR, OBFF, and atomic operations - essential for secure, low-latency virtualized I/O |
| Multi-root partitioning (up to 16) | Allows hardware-isolated I/O domains for VM-aware hypervisors and containerized workloads |
| Hot-plug on all downstream ports | Enables live insertion/removal of SSDs, NICs, or accelerators without system reboot or service interruption |
| On-die scope (ODS) & PRBS | Integrated real-time SerDes eye diagram capture and bit-error-rate testing - eliminates external test equipment during bring-up |
Applications
| Enterprise Server I/O Expansion | SSD Storage Array Interconnect |
|---|---|
Use Scenario: Adding 8× NVMe SSDs behind a single CPU socket while maintaining Gen3 x4 per device. IC Role / Device Role / Timing Role: PCIe switch providing lane bifurcation, address translation, and traffic isolation between host and storage devices. Use Value: Eliminates need for additional root complexes; sustains 32 GBps aggregate SSD bandwidth with sub-200 ns packet latency. | Use Scenario: Building a modular JBOD enclosure with hot-swappable SSD bays and shared upstream connectivity to dual hosts. IC Role / Device Role / Timing Role: Multi-root-capable switch enabling independent I/O partitioning and dynamic upstream port reassignment between hosts. Use Value: Supports failover and load balancing across two servers without external fabric switches or custom firmware. |
| Communications Equipment Backplane | Intelligent I/O Module (IOM) |
Use Scenario: High-density line card with 4× 10G Ethernet interfaces and 2× FPGA accelerators sharing a common PCIe upstream path. IC Role / Device Role / Timing Role: Traffic-aggregating switch with request metering and QoS-aware arbitration between heterogeneous endpoints. Use Value: Guarantees minimum bandwidth allocation per interface under bursty traffic loads; prevents starvation of time-critical control paths. | Use Scenario: PCIe-based mezzanine module adding GPU, SmartNIC, or DPUs to embedded edge servers via standardized carrier board slot. IC Role / Device Role / Timing Role: Protocol-transparent bridge enabling peer-to-peer DMA between add-in cards and host memory without CPU involvement. Use Value: Reduces host CPU overhead by >40% in AI inference pipelines using direct RDMA access to GPU frame buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip Switchtec® PAX1100-16G3 | 16-lane, 4-port Gen3 switch; lacks multi-root partitioning and SECDED ECC on internal RAMs | Targeted at cost-sensitive edge servers with simpler I/O topologies - not suitable for storage arrays requiring RAS features | Choose when lane count and partitioning complexity are lower; verify AER and ECC requirements match system SLA |
| AMD/PLX PEX8796 | 96-lane, 24-port Gen3 switch; supports SR-IOV and ATS but no built-in ODS or PRBS test engines | Used in high-end compute blades and GPU-accelerated workstations where SR-IOV virtualization is mandatory | Prefer when SR-IOV endpoint virtualization is required; accept trade-off of no on-die scope for debug visibility |
Compared with the Microchip PAX1100-16G3 and AMD/PLX PEX8796, the 89H64H16G3 uniquely balances high lane density (64), hardware-enforced RAS (SECDED + AER), and embedded debug capability (ODS/PRBS) - making it optimal for enterprise SSD arrays needing field-serviceable reliability and bring-up efficiency.
Availability
89H64H16G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, SSD storage array interconnect, communications equipment backplanes, intelligent I/O modules, and multi-root embedded systems requiring stable component supply across extended product lifecycles.
Supply support for 89H64H16G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology) is a fabless semiconductor company specializing in high-performance interface, memory, timing, and RF solutions - acquired by Renesas Electronics in 2019.
The 89H64H16G3 belongs to IDT's PCIe Switch family, designed specifically for high-throughput, low-latency, RAS-enhanced system interconnect in data center and enterprise infrastructure applications.
FAQ
What is the maximum PCIe Gen3 lane configuration supported by the 89H64H16G3?
The 89H64H16G3 supports up to 64 PCIe Gen3 lanes configured as eight x8 ports, sixteen x4 ports, or any mixed combination (e.g., four x8 + eight x4). Each port auto-negotiates width and speed independently, and lane reversal is handled autonomously - enabling flexible board layout without manual SerDes remapping. This configuration is confirmed in the IDT 89H64H16G3 Product Brief Rev A0911.
Does the 89H64H16G3 support hot-plug functionality on all downstream ports?
Yes, the 89H64H16G3 supports full hot-plug operation on all downstream switch ports per PCIe Base Specification 3.0. It generates MSI or INTx interrupts on link up/down transitions and provides on-chip link activity outputs for BMC integration. This capability is validated in IDT's hardware validation reports and used in field-deployed SSD enclosures requiring zero-downtime drive replacement.
How does the 89H64H16G3 implement Reliability, Availability, and Serviceability (RAS)?
The 89H64H16G3 implements RAS through SECDED ECC on all internal RAMs, end-to-end data path parity, Advanced Error Reporting (AER) on every port, and IEEE 1149.6 AC JTAG compliance. These features are documented in the IDT 89H64H16G3 datasheet and applied in mission-critical server platforms where silent data corruption must be detected and corrected in real time.
Can the 89H64H16G3 be initialized without external firmware or BIOS support?
Yes, the 89H64H16G3 supports autonomous initialization via pin strapping and serial EEPROM, eliminating dependency on host BIOS or OS drivers. Configuration can also be performed over SMBus or through software-managed methods. This flexibility is specified in Section 3.2 of the IDT 89H64H16G3 Product Brief and verified on the 89KTPES64H16G3 Evaluation Board.
What evaluation hardware is available for the 89H64H16G3?
IDT provides the 89KTPES64H16G3 Evaluation Board for the 89H64H16G3, which includes PCIe Browser Software, On-Die Scope (ODS), and built-in PRBS generator/checker. This platform enables full register-level configuration, real-time SerDes eye analysis, and protocol conformance testing - all documented on idt.com and shipped with the official evaluation kit.
89H64H16G3YCBLI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- 3.3V
- Supplier Device Package:
- 1156-FCBGA (35x35)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H64H16G3YCBLI FAQ
1.How can I place an order for 89H64H16G3YCBLI through Aetrix?
Please submit a Request for Quotation (RFQ) for 89H64H16G3YCBLI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89H64H16G3YCBLI reliable?
The price and inventory of 89H64H16G3YCBLI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H64H16G3YCBLI is usually 5 days.
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89H64H16G3YCBLI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89H64H16G3YCBLI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89H64H16G3YCBLI?
For technical support, including 89H64H16G3YCBLI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H64H16G3YCBLI requirements.
6.How does Aetrix verify that 89H64H16G3YCBLI is sourced from the original manufacturer or authorized distributors?
All 89H64H16G3YCBLI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H64H16G3YCBLI meets industry standards.
7.What is the process for return or replacement of 89H64H16G3YCBLI?
All 89H64H16G3YCBLI units undergo pre-shipment inspection (PSI). If there is an issue with 89H64H16G3YCBLI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H64H16G3YCBLI part is unused and in its original packaging.
Return procedure for 89H64H16G3YCBLI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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