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Renesas 89HPES12N3A2ZCBCI8

Part No.:
89HPES12N3A2ZCBCI8
Manufacturer:
Renesas
Category:
Specialized
Package:
324-BGA
Datasheet:
Aetrix89HPES12N3A2ZCBCI8.pdf
Description:
IC INTFACE SPECIALIZED 324CABGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,977

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Product details

Overview

89HPES12N3A2ZCBCI8 from IDT is a 12-lane, 3-port PCI Express 1.1 switch IC designed for high-throughput I/O expansion in servers and storage systems. It delivers 2.5 Gbps per lane, supports x4 upstream and dual x4 downstream ports, implements cut-through switching with ≤150 ns latency, and integrates twelve embedded SerDes with on-chip packet buffering.

For engineers reviewing the 89HPES12N3A2ZCBCI8 datasheet, 89HPES12N3A2ZCBCI8 pinout, 89HPES12N3A2ZCBCI8 application, or 89HPES12N3A2ZCBCI8 equivalent, key selection criteria include PCIe 1.1 compliance, configurable link widths (x1/x2/x4), SMBus-configurable operation, RAS features (ECRC, hot-plug support), and thermal performance in 19×19 mm BGA packaging.

Technical Context

The 89HPES12N3A2ZCBCI8 implements a layered PCI Express architecture compliant with Base Specification Revision 1.1, featuring separate Transaction, Data Link, and Physical layers across all three ports. Its switch core supports eight traffic classes and one virtual channel, enabling prioritized routing of memory-mapped and I/O transactions between upstream and downstream domains.

It employs a low-latency cut-through forwarding mode with internal end-to-end parity protection on all TLPs and supports native PCI Express hot-plug via SMBus-managed I/O expanders. Configuration is loaded from external serial EEPROM using its dual SMBus interface - one master for initialization, one slave for runtime register access.

Key Specifications

Parameter Value and Actual Design Meaning
PCIe Generation Gen 1 (2.5 Gbps per lane), fully compliant with PCIe Base Spec 1.1
Lane Count & Topology 12 total lanes: one x4 upstream port (Port 0), two x4 downstream ports (Ports 2 and 4)
Switch Architecture Cut-through mode with ≤150 ns latency; store-and-forward also supported
Max Payload Size 2048 bytes - enables efficient large-block transfers in storage and server backplanes
Traffic Management Eight traffic classes (TCs) and one virtual channel (VC) for QoS-aware bandwidth allocation
Power Management Supports D0, D3hot, D3cold states per PCI-PM 1.1; unused SerDes automatically disabled
Thermal Dissipation Max 2.6 W at 70°C ambient; θJA(eff) = 15.1°C/W with 1 m/s airflow - no heatsink required in standard PCIe cards

Pinout & Package

Packaged in a 19×19 mm, 324-ball BGA (BCG324) with 1.0 mm ball pitch. Pinout includes dedicated differential PCIe lanes (PE0/PE2/PE4 RP/TN pairs), dual SMBus interfaces (master/slave), eight GPIOs with alternate functions (e.g., P2RSTN, IOEXPINTN0), JTAG test pins, reference clock inputs (PEREFCLKP/N, REFCLKM), and five power domains (VDDCORE, VDDIO, VDDPE, VDDAPE, VTTPE).

Pin/Terminal Circuit Role Design Meaning
PE0RP[3:0]/PE0RN[3:0] Upstream Port 0 Receive Differential Pair Accepts PCIe 2.5 Gbps serial data from host/root complex; CML input with AC coupling
PE2TP[3:0]/PE2TN[3:0] Downstream Port 2 Transmit Differential Pair Drives PCIe 2.5 Gbps serial data to endpoint device; CML output with de-emphasis control
SSMBCLK / SSMBDAT Slave SMBus Interface Enables full read/write access to all internal configuration registers by external controller
MSMBCLK / MSMBDAT Master SMBus Interface Loads default configuration from external EEPROM post-reset; controls Hot-Plug I/O expanders
GPIO[0] / GPIO[1] Configurable General Purpose I/O Software-selectable as outputs for downstream port reset (P2RSTN/P4RSTN) or inputs for Hot-Plug interrupts
JTAG_TCK / TDI / TDO / TMS IEEE 1149.1 Boundary Scan Interface Supports production testing, debug, and in-system programming without requiring functional operation

Key Features

Feature Design Value
Integrated SerDes Twelve 2.5 Gbps embedded SerDes with 8B/10B encoding - eliminates need for external transceivers
Automatic Lane Negotiation Per-port link width auto-negotiation (x1/x2/x4) and automatic lane reversal/polarity inversion simplify board layout
RAS Support End-to-end parity on all TLPs + ECRC + Advanced Error Reporting - ensures data integrity in mission-critical servers
Hot-Plug Enablement SMBus-controlled Hot-Plug I/O expander interface - compatible with standard PC/server motherboard implementations
No External Components On-chip frame buffer, scheduler, and logic layers eliminate discrete buffers, FIFOs, or glue logic

Applications

Server I/O Expansion Enterprise Storage Backplane

Use Scenario: Adding multiple PCIe slots or NVMe drives behind a single CPU root port in 1U/2U rack servers.

IC Role / Device Role / Timing Role: Acts as a transparent, low-latency PCIe switch fabric connecting CPU to downstream endpoints.

Use Value: Enables x4 upstream bandwidth sharing across two x4 downstream ports while maintaining Gen 1 timing compliance and error reporting.

Use Scenario: Interconnecting SAS/SATA controllers, RAID ASICs, and flash modules in modular storage enclosures.

IC Role / Device Role / Timing Role: Provides deterministic packet switching between storage processors and drive bays with eight traffic class prioritization.

Use Value: Supports concurrent I/O streams with guaranteed latency bounds and ECRC-protected data paths for enterprise-grade reliability.

Communications Network Card Industrial Embedded Computing

Use Scenario: Building multi-function NICs with dual 10GbE controllers, crypto accelerators, and FPGA co-processors on a single add-in card.

IC Role / Device Role / Timing Role: Serves as a PCIe interconnect hub managing bandwidth allocation and hot-plug events across heterogeneous peripherals.

Use Value: Delivers simultaneous x4 connectivity to four endpoints with SMBus-managed configuration and interrupt handling.

Use Scenario: Enabling scalable I/O in ruggedized COM-HPC or VPX modules where space-constrained BGA packaging and thermal efficiency are critical.

IC Role / Device Role / Timing Role: Functions as a fixed-configuration PCIe bridge supporting legacy INTx emulation and bus locking for real-time OS compatibility.

Use Value: Operates reliably from –40°C to +85°C with no heatsink required, meeting industrial thermal and longevity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCI Express switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
89HPES12N3AG2ZBBCI8 Same die, different BGA package: 17×17 mm 256-ball (BCG256) vs. 19×19 mm 324-ball (BCG324); identical electrical specs and pin mapping subset Targeted at space-constrained designs where smaller footprint and lower ball count reduce PCB layer count and routing complexity Select when board area is constrained and thermal load permits reduced copper pour; verify mechanical clearance for smaller package
89HPES8N3A2ZBBCI8 8-lane variant (x4 upstream + x2/x4 downstream); same architecture, SerDes, and firmware but fewer PCIe lanes and reduced buffer depth Suitable for cost-sensitive embedded or client applications requiring only moderate I/O expansion bandwidth Choose for lower-power, lower-cost deployments where full 12-lane capacity is unnecessary; not pin-compatible

Compared with 89HPES12N3A2ZCBCI8, the 89HPES12N3AG2ZBBCI8 offers identical functionality in a smaller BGA footprint, while the 89HPES8N3A2ZBBCI8 reduces lane count and buffer resources to meet entry-level expansion needs - both require distinct PCB layouts and thermal validation.

Availability

89HPES12N3A2ZCBCI8 is available at Aetrix Electronics and suitable for server backplane design, enterprise storage subsystem integration, and communications network card development requiring stable component supply and long-term industrial temperature support.

Supply support for 89HPES12N3A2ZCBCI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology, Inc.) is a fabless semiconductor company specializing in high-performance timing, memory interface, and interconnect solutions for computing and communications infrastructure.

The 89HPES12N3A2ZCBCI8 belongs to IDT's PRECISE™ family of PCI Express switches, engineered specifically for low-latency, high-reliability I/O expansion in datacenter servers, storage arrays, and telecom equipment.

FAQ

What PCIe specification revision does the 89HPES12N3A2ZCBCI8 implement?

The 89HPES12N3A2ZCBCI8 implements PCI Express Base Specification Revision 1.1. It operates at 2.5 Gbps per lane with full compliance for transaction, data link, and physical layers - including 8B/10B encoding, ACK/NAK retry, and LTSSM state machine behavior. It does not support PCIe 2.0 or later generations.

Does the 89HPES12N3A2ZCBCI8 support hot-plug functionality, and how is it implemented?

Yes, the 89HPES12N3A2ZCBCI8 supports native PCI Express hot-plug on both downstream ports. It uses its master SMBus interface to communicate with external Hot-Plug I/O expanders (e.g., TI TPS2384), sending output updates and reading input status via SMBus transactions triggered by the IOEXPINTN GPIO alternate function.

What are the power supply requirements for the 89HPES12N3A2ZCBCI8?

The 89HPES12N3A2ZCBCI8 requires five independent supplies: VDDCORE (1.0 V ±10%), VDDIO (3.3 V ±10%), VDDPE (1.0 V ±10%), VDDAPE (1.0 V ±10%), and VTTPE (1.5 V ±5%). Power-up sequence must follow VDDIO → VDDCORE/VDDPE/VDDAPE → VTTPE to prevent latch-up; reverse order applies for power-down.

How many general-purpose I/O pins does the 89HPES12N3A2ZCBCI8 provide, and what alternate functions are available?

The 89HPES12N3A2ZCBCI8 provides eight GPIO pins (GPIO[0]–GPIO[7]). Alternate functions include P2RSTN and P4RSTN (downstream port reset outputs), IOEXPINTN0 and IOEXPINTN2 (Hot-Plug interrupt inputs), and GPEN (General Purpose Event output). Each pin is software-configurable as input/output or interrupt source.

Is the 89HPES12N3A2ZCBCI8 pin-compatible with other members of the PES12N3A family?

No - the 89HPES12N3A2ZCBCI8 uses a 324-ball BCG324 package. While functionally identical to the 256-ball 89HPES12N3AG2ZBBCI8, it is not pin-compatible due to differing ball count, pitch, and signal mapping. Board redesign is required when substituting between these variants.

89HPES12N3A2ZCBCI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
PRECISE™
Package/Case:
324-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Switch Interfacing
Interface:
PCI Express
Voltage - Supply:
3.3V
Supplier Device Package:
324-CABGA (19x19)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

89HPES12N3A2ZCBCI8 FAQ

1.How can I place an order for 89HPES12N3A2ZCBCI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 89HPES12N3A2ZCBCI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 89HPES12N3A2ZCBCI8 reliable?

The price and inventory of 89HPES12N3A2ZCBCI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89HPES12N3A2ZCBCI8 is usually 5 days.

3.What payment methods are accepted for 89HPES12N3A2ZCBCI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89HPES12N3A2ZCBCI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 89HPES12N3A2ZCBCI8?

89HPES12N3A2ZCBCI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89HPES12N3A2ZCBCI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89HPES12N3A2ZCBCI8?

For technical support, including 89HPES12N3A2ZCBCI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89HPES12N3A2ZCBCI8 requirements.

6.How does Aetrix verify that 89HPES12N3A2ZCBCI8 is sourced from the original manufacturer or authorized distributors?

All 89HPES12N3A2ZCBCI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89HPES12N3A2ZCBCI8 meets industry standards.

7.What is the process for return or replacement of 89HPES12N3A2ZCBCI8?

All 89HPES12N3A2ZCBCI8 units undergo pre-shipment inspection (PSI). If there is an issue with 89HPES12N3A2ZCBCI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89HPES12N3A2ZCBCI8 part is unused and in its original packaging.

Return procedure for 89HPES12N3A2ZCBCI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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