Renesas 89HPES12N3AZGBC8
- Part No.:
- 89HPES12N3AZGBC8
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 324-BGA
- Datasheet:
-
89HPES12N3AZGBC8.pdf
- Description:
- IC INTFACE SPECIALIZED 324CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,760
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Product details
Overview
89HPES12N3AZGBC8 from IDT is a 12-lane, 3-port PCI Express 1.1 switch IC designed for high-throughput I/O expansion in servers and storage systems. It delivers 2.5 Gbps per lane, supports x4 upstream and dual x4 downstream ports, implements cut-through switching with ≤100 ns latency, and integrates twelve embedded SerDes with on-chip packet buffering.
For engineers reviewing the 89HPES12N3AZGBC8 datasheet, 89HPES12N3AZGBC8 pinout, 89HPES12N3AZGBC8 application, or 89HPES12N3AZGBC8 equivalent, key selection criteria include PCIe 1.1 compliance, 3-port topology with configurable link widths (x1/x2/x4), SMBus-configurable operation, integrated RAS features (ECRC, hot-plug support), and thermal performance in 19×19 mm BGA packaging.
Technical Context
The 89HPES12N3AZGBC8 implements a layered PCI Express architecture compliant with Base Specification Revision 1.1, integrating SerDes, Physical, Data Link, and Transaction layers across all 12 lanes. Its switch core supports eight traffic classes and one virtual channel with resource management for memory and I/O transactions.
It operates in either store-and-forward or low-latency cut-through mode, supports automatic lane reversal and polarity inversion on all ports, and loads configuration from serial EEPROM via its master SMBus interface. The device includes dual SMBus interfaces (master and slave), eight GPIOs with interrupt capability, and JTAG boundary-scan test support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| PCIe Generation | Gen 1 (2.5 Gbps per lane), fully compliant with PCIe Base Spec 1.1 |
| Lane Count & Topology | 12 total lanes: 1× x4 upstream port + 2× x4 downstream ports (ports 0, 2, 4) |
| Switch Architecture | Cut-through mode with sub-100 ns forwarding latency; also supports store-and-forward |
| Power Management | Supports D0/D3hot/D3cold states per PCI-PM 1.1; unused SerDes automatically disabled |
| Thermal Performance | Max power dissipation 2.6 W; θJA(eff) = 21.8°C/W (no airflow); junction max 125°C |
| Package | 324-ball BGA, 19×19 mm body, 1.0 mm ball pitch, RoHS-compliant |
| Operating Temperature | Commercial grade: 0°C to +70°C ambient |
Pinout & Package
Packaged in a 19×19 mm, 324-ball fine-pitch BGA (ball pitch 1.0 mm) with standard JEDEC footprint. Pin functions are validated per IDT datasheet DSC 6922 (April 2010), including differential PCIe lanes, dual SMBus interfaces, eight GPIOs, JTAG, reset, reference clock, and multi-rail power/ground distribution.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PE0RP[3:0]/PE0RN[3:0] | PCIe Port 0 Receive Differential Pair | Input lanes for upstream port (Port 0); CML interface, AC-coupled, 100 Ω differential termination |
| PE0TP[3:0]/PE0TN[3:0] | PCIe Port 0 Transmit Differential Pair | Output lanes for upstream port (Port 0); supports de-emphasis, 800–1200 mVpp differential swing |
| PE2RP[3:0]/PE2RN[3:0], PE4RP[3:0]/PE4RN[3:0] | PCIe Port 2 & Port 4 Receive Pairs | Dual downstream port inputs (Ports 2 and 4); identical electrical specs to Port 0 receive |
| PE2TP[3:0]/PE2TN[3:0], PE4TP[3:0]/PE4TN[3:0] | PCIe Port 2 & Port 4 Transmit Pairs | Dual downstream port outputs; full Gen 1 transmit compliance including eye height and jitter tolerance |
| SSMBCLK/SSMBDAT, MSMBCLK/MSMBDAT | Slave & Master SMBus Interfaces | Separate bidirectional buses: slave for register access, master for EEPROM config loading and Hot-Plug I/O expander control |
| GPIO[0]–GPIO[7] | Configurable General Purpose I/O | Software-controllable pins; GPIO[0]/[1] double as port reset outputs (P2RSTN/P4RSTN); GPIO[2]/[4] serve as I/O expander interrupt inputs |
| PERSTN, RSTHALT | Fundamental Reset & Reset Halt Control | Active-low synchronous reset; RSTHALT enables register access during reset before normal operation begins |
Key Features
| Feature | Design Value |
|---|---|
| Integrated SerDes | Twelve 2.5 Gbps embedded SerDes with 8B/10B encoding - eliminates need for external transceivers |
| On-chip Memory | Dedicated internal buffer memory for packet queuing and scheduling - no external RAM required |
| RAS Support | End-to-end parity on all TLPs + ECRC + Advanced Error Reporting - ensures data integrity in mission-critical server/storage environments |
| Hot-Plug Enablement | Native PCIe Hot-Plug support per port via SMBus-controlled external I/O expander - compatible with PC/server motherboard implementations |
| Flexible Configuration | Automatic link width negotiation (x1/x2/x4), lane reversal, polarity inversion, and EEPROM-based boot - reduces board design complexity and firmware overhead |
Applications
| Enterprise Storage Backplane | Server I/O Expansion Module |
|---|---|
|
Use Scenario: High-density SAS/SATA controller aggregation behind a single PCIe root port in a 2U storage chassis. IC Role / Device Role / Timing Role: 3-port PCIe switch providing non-blocking connectivity between host CPU and up to eight storage controllers. Use Value: Enables 12-lane fanout with deterministic latency (<100 ns) and hardware-enforced traffic isolation across eight traffic classes. |
Use Scenario: Adding dual x4 PCIe slots to a legacy server motherboard lacking native slot count. IC Role / Device Role / Timing Role: Upstream port connects to chipset; downstream ports drive add-in cards (NICs, HBAs, GPUs). Use Value: Delivers Gen 1 bandwidth without requiring PCB layer count increase - uses only 12 serial lanes and minimal passive components. |
| Communications Blade Switching | Industrial Embedded Computing |
|
Use Scenario: Interconnecting multiple DSP/FPGA compute modules in a telecom media gateway blade. IC Role / Device Role / Timing Role: Central PCIe fabric switch enabling peer-to-peer DMA between processing nodes. Use Value: Supports simultaneous memory-mapped I/O and message-passing traffic with per-port hot-plug capability for field-replaceable modules. |
Use Scenario: Enabling modular I/O in ruggedized industrial PCs where space and thermal envelope constrain component count. IC Role / Device Role / Timing Role: Low-power PCIe bridge expanding limited chipset lanes to support CAN, Ethernet, and analog acquisition peripherals. Use Value: Achieves 1.44 W typical power at 4/1/1 lane configuration - eliminates need for heatsink in convection-cooled enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 89HPES12N3AGBC | Same die, identical electrical specs, but in leaded (Pb) package - not RoHS-compliant | Restricted to legacy industrial programs exempt from RoHS; incompatible with modern automated assembly | Select only if Pb-free compliance is waived and legacy reflow profiles are used. |
| 89HPES12N3AZBBC | Same functional silicon, but in 17×17 mm 256-ball BGA (smaller footprint, fewer lanes routed) | Lower I/O count limits downstream port flexibility; lacks two GPIOs and one SMBus address pin | Choose when board area is constrained and full 12-lane routing is unnecessary. |
Compared with 89HPES12N3AZGBC8, the 89HPES12N3AGBC offers identical switching performance but requires Pb-handling controls, while the 89HPES12N3AZBBC trades package size and pin count for reduced routing complexity - neither is pin-compatible, and both require layout revision.
Availability
89HPES12N3AZGBC8 is available at Aetrix Electronics and suitable for enterprise storage backplanes, server I/O expansion modules, communications blade switching, and industrial embedded computing requiring stable component supply and long-term lifecycle assurance.
Supply support for 89HPES12N3AZGBC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology, Inc.) is a fabless semiconductor company specializing in timing, memory interface, RF, and interconnect solutions, acquired by Renesas Electronics in 2019.
The 89HPES12N3AZGBC8 belongs to IDT's PRECISE™ family of PCIe switching solutions, engineered specifically for high-reliability, low-latency I/O expansion in datacenter and telecom infrastructure where RAS, thermal efficiency, and configuration flexibility are critical.
FAQ
What PCIe specification version does the 89HPES12N3AZGBC8 implement?
The 89HPES12N3AZGBC8 implements PCI Express Base Specification Revision 1.1 exclusively. It supports 2.5 Gbps per lane, 8B/10B encoding, and all mandatory features of Gen 1, including ECRC, Advanced Error Reporting, and Native Hot-Plug. It does not support Gen 2 (5.0 Gbps) or later revisions.
Does the 89HPES12N3AZGBC8 require external configuration memory?
No - the 89HPES12N3AZGBC8 integrates dual SMBus interfaces to load configuration from an external serial EEPROM via its master SMBus. However, the EEPROM itself is external; the device contains no non-volatile memory. The slave SMBus allows runtime register access without EEPROM dependency.
How many PCIe lanes does the 89HPES12N3AZGBC8 support, and how are they allocated?
The 89HPES12N3AZGBC8 supports exactly 12 PCIe lanes, allocated as one x4 upstream port (Port 0) and two x4 downstream ports (Ports 2 and 4). Lane width is auto-negotiated per port and can be configured down to x1, but total lane count remains fixed at 12.
What thermal management is required for the 89HPES12N3AZGBC8 in a 70°C ambient environment?
In a 70°C ambient environment with 1 m/s airflow, the 89HPES12N3AZGBC8 achieves a junction temperature of ~96°C (below its 125°C maximum), so no heatsink is required. Thermal resistance is θJA(eff) = 15.1°C/W under that airflow condition, and the device is rated for commercial temperature range (0°C to +70°C).
Can the 89HPES12N3AZGBC8 support peer-to-peer traffic between downstream ports?
Yes - the 89HPES12N3AZGBC8 explicitly supports switching between its two downstream ports (Port 2 and Port 4). This enables direct peer-to-peer DMA transfers without involving the upstream root complex, reducing latency and host CPU overhead in multi-node architectures.
89HPES12N3AZGBC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- PRECISE™
- Package/Case:
- 324-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- 3.3V
- Supplier Device Package:
- 324-CABGA (19x19)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89HPES12N3AZGBC8 FAQ
1.How can I place an order for 89HPES12N3AZGBC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 89HPES12N3AZGBC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89HPES12N3AZGBC8 reliable?
The price and inventory of 89HPES12N3AZGBC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89HPES12N3AZGBC8 is usually 5 days.
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4.How is shipping managed for 89HPES12N3AZGBC8?
89HPES12N3AZGBC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89HPES12N3AZGBC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89HPES12N3AZGBC8?
For technical support, including 89HPES12N3AZGBC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89HPES12N3AZGBC8 requirements.
6.How does Aetrix verify that 89HPES12N3AZGBC8 is sourced from the original manufacturer or authorized distributors?
All 89HPES12N3AZGBC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89HPES12N3AZGBC8 meets industry standards.
7.What is the process for return or replacement of 89HPES12N3AZGBC8?
All 89HPES12N3AZGBC8 units undergo pre-shipment inspection (PSI). If there is an issue with 89HPES12N3AZGBC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89HPES12N3AZGBC8 part is unused and in its original packaging.
Return procedure for 89HPES12N3AZGBC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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