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Renesas 89HPES12N3AZGBCI

Part No.:
89HPES12N3AZGBCI
Manufacturer:
Renesas
Category:
Specialized
Package:
324-BGA
Datasheet:
Aetrix89HPES12N3AZGBCI.pdf
Description:
IC INTFACE SPECIALIZED 324CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,750

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Product details

Overview

89HPES12N3AZGBCI from IDT is a 12-lane, 3-port PCI Express® 1.1 switch IC designed for high-throughput I/O interconnect in servers, storage, and networking equipment. It delivers 2.5 Gbps per lane, supports x4 upstream and dual x4 downstream ports, implements cut-through switching with ≤150 ns latency, and integrates twelve embedded SerDes with on-chip packet buffering.

For engineers reviewing the 89HPES12N3AZGBCI datasheet, 89HPES12N3AZGBCI pinout, 89HPES12N3AZGBCI application, or 89HPES12N3AZGBCI equivalent, key selection criteria include PCIe 1.1 compliance, 3-port topology with configurable link widths (x1/x2/x4), support for eight traffic classes and one virtual channel, ECRC and Advanced Error Reporting, and Hot-Plug I/O expander interface via SMBus master.

Technical Context

The 89HPES12N3AZGBCI implements a layered PCI Express architecture compliant with Base Specification Revision 1.1, including integrated SerDes, Physical, Data Link, and Transaction layers. It operates in either store-and-forward or low-latency cut-through mode and supports memory and I/O transaction switching across three ports.

Its switching core includes a route table, arbitration scheduler, frame buffer, and multiplexer/demultiplexer logic. Configuration is loaded from serial EEPROM via SMBus master interface, while real-time register access is enabled through SMBus slave interface - both supporting full read/write capability to all internal registers.

Key Specifications

ParameterValue and Actual Design Meaning
PCIe GenerationGen 1 (2.5 Gbps per lane), compliant with PCIe Base Spec Rev 1.1
Lane Count & Topology12 total lanes: 1× x4 upstream port + 2× x4 downstream ports (ports 0, 2, 4)
Switch ArchitectureCut-through mode with typical latency ≤150 ns; also supports store-and-forward
Traffic ManagementEight traffic classes (TCs) and one virtual channel (VC) for QoS prioritization
Error HandlingEnd-to-End CRC (ECRC), Advanced Error Reporting (AER), and internal TLP parity protection
Power ManagementSupports D0, D3hot, D3cold states per PCI-PM 1.1; unused SerDes automatically disabled
Reference Clock100 MHz or 125 MHz differential input (selected by REFCLKM pin)
Package324-ball BGA, 19×19 mm, 1.0 mm ball pitch (BCG324)

Pinout & Package

Package: 324-ball BGA (19×19 mm, 1.0 mm pitch), RoHS-compliant, thermal pad exposed on underside.

Pin/TerminalCircuit RoleDesign Meaning
PE0RP[3:0]/PE0RN[3:0]PCIe Port 0 Receive Differential PairInput lanes for upstream port (Port 0); CML interface, AC-coupled
PE0TP[3:0]/PE0TN[3:0]PCIe Port 0 Transmit Differential PairOutput lanes for upstream port (Port 0); CML interface, 800–1200 mVpp differential swing
PE2RP[3:0]/PE2RN[3:0], PE4RP[3:0]/PE4RN[3:0]PCIe Port 2 & 4 Receive PairsInputs for downstream ports (Ports 2 and 4); identical electrical specs to Port 0 receive
PE2TP[3:0]/PE2TN[3:0], PE4TP[3:0]/PE4TN[3:0]PCIe Port 2 & 4 Transmit PairsOutputs for downstream ports; support lane reversal and polarity inversion
SSMBCLK/SSMBDAT, MSMBCLK/MSMBDATSlave & Master SMBus InterfacesSeparate bidirectional buses: slave for register access, master for EEPROM config loading and Hot-Plug I/O expander control
GPIO[0]–GPIO[7]General Purpose I/OConfigurable as input/output or interrupt; GPIO[0]/[1] serve as P2RSTN/P4RSTN; GPIO[2]/[4]/[7] support I/O expander interrupts and GPE output
PERSTN, RSTHALT, SWMODE[3:0]Fundamental Reset & ConfigurationActive-low reset (PERSTN); RSTHALT enables pre-operational register access; SWMODE sets boot mode (0x0 = normal, 0x1 = EEPROM-init)
VDDCORE/VDDIO/VDDPE/VDDAPE/VTTPEPower Supply RailsDedicated supplies: 1.0 V core/digital, 3.3 V I/O, 1.0 V PCIe digital/analog, 1.5 V termination; strict power-up sequence required

Key Features

FeatureDesign Value
Integrated SerDesTwelve 2.5 Gbps embedded SerDes with 8B/10B encoder/decoder - eliminates need for external transceivers
No External ComponentsOn-chip memory for packet buffering/queueing and internal logic eliminate discrete buffers, FIFOs, or configuration PROMs
Hot-Plug SupportNative PCIe Hot-Plug via SMBus master interface to standard I/O expanders - no dedicated Hot-Plug controller required
Flexible ConfigurationAutomatic link width negotiation (x1/x2/x4), lane reversal, polarity inversion, and EEPROM-based initialization reduce board design complexity
RAS EnhancementsInternal end-to-end parity on all TLPs ensures data integrity even in systems without ECRC implementation
Debug & Test AccessFull register visibility and control via SMBus slave interface; IEEE 1149.1 JTAG boundary scan for production test

Applications

Enterprise Storage BackplaneCommunications Line Card

Use Scenario: High-density SAS/SATA expansion behind a host controller, connecting multiple drives to a single PCIe root complex.

IC Role / Device Role / Timing Role: PCIe switch providing non-blocking interconnect between upstream host and downstream storage controllers.

Use Value: Enables scalable, low-latency drive aggregation with hardware-enforced traffic isolation across eight traffic classes.

Use Scenario: Modular telecom line card with multiple GbE, SATA, and PCIe add-in slots sharing a single upstream CPU interface.

IC Role / Device Role / Timing Role: Central I/O fabric switch routing packets between CPU, network PHYs, and peripheral slots.

Use Value: Reduces PCB layer count and routing congestion by consolidating 12 serial lanes into a compact BGA package with automatic lane management.

Server I/O Expansion ModuleIndustrial Embedded Control Chassis

Use Scenario: PCIe riser card adding dual x4 slots and hot-pluggable I/O modules to a 1U server motherboard.

IC Role / Device Role / Timing Role: PCIe switch enabling native Hot-Plug via SMBus-connected I/O expander for safe module insertion/removal.

Use Value: Eliminates need for custom Hot-Plug ASICs; leverages standard motherboard I/O expanders and provides full AER reporting.

Use Scenario: Ruggedized chassis for factory automation, integrating motion control, vision capture, and fieldbus interfaces over PCIe.

IC Role / Device Role / Timing Role: Deterministic I/O aggregator handling time-sensitive memory-mapped transactions across distributed peripherals.

Use Value: Cut-through latency ≤150 ns ensures sub-microsecond response for real-time control loops; ECRC and parity protect mission-critical data paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen 1 switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
89HPES12N3AGISame die, industrial-grade (-40°C to +85°C), identical pinout and electrical specsRequired for extended temperature deployments; higher thermal resistance tolerance (θJA = 21.8°C/W at zero airflow)Select when operating ambient exceeds 70°C or thermal margin is constrained
89HPES8N3AZC8-lane, 3-port variant (x4/x2/x2 topology); lower power (1.44W typ), same BCG324 packageSuitable for cost-optimized or lower-bandwidth I/O expansion where full 12-lane capacity is unnecessaryChoose to reduce BOM cost and power draw without changing PCB layout

Compared with 89HPES12N3AZGBCI, the 89HPES12N3AGI offers identical functionality with extended temperature range, while the 89HPES8N3AZC reduces lane count and power consumption but retains pin compatibility - enabling scalable design reuse across commercial and industrial tiers.

Availability

89HPES12N3AZGBCI is available at Aetrix Electronics and suitable for enterprise storage backplanes, communications line cards, and server I/O expansion modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 89HPES12N3AZGBCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology, Inc.) is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions, now part of Renesas Electronics.

The 89HPES12N3AZGBCI belongs to IDT's PRECISE™ family of PCIe switching solutions, engineered specifically for high-reliability, low-latency I/O consolidation in servers, storage arrays, and carrier-grade networking infrastructure.

FAQ

What PCIe specification revision does the 89HPES12N3AZGBCI implement?

The 89HPES12N3AZGBCI implements PCI Express Base Specification Revision 1.1. It supports 2.5 Gbps per lane, 8B/10B encoding, and all mandatory features including Advanced Error Reporting, ECRC, and Native Hot-Plug. It does not support PCIe 2.0 or later revisions, and its maximum payload size is limited to 2048 bytes per TLP.

Does the 89HPES12N3AZGBCI require external configuration memory?

No, the 89HPES12N3AZGBCI does not require external configuration memory for basic operation. Its default configuration is hardwired, but it supports optional loading from an external serial EEPROM via the master SMBus interface when SWMODE is set to 0x1. This enables field-updatable settings without firmware changes.

How many PCIe lanes does the 89HPES12N3AZGBCI support, and how are they allocated?

The 89HPES12N3AZGBCI supports 12 PCIe lanes total, allocated across three ports: Port 0 (upstream, x4), Port 2 (downstream, x4), and Port 4 (downstream, x4). All ports support automatic link width negotiation down to x1, and lane reversal/polarity inversion is handled internally without PCB layout impact.

What power supply sequencing is required for reliable operation of the 89HPES12N3AZGBCI?

The 89HPES12N3AZGBCI requires strict power-up sequencing: (1) VDDIO (3.3 V) first, (2) then VDDCORE, VDDPE, and VDDAPE (all 1.0 V), and (3) finally VTTPE (1.5 V). Power-down must follow the reverse order. Failure to observe this sequence risks internal latch-up and functional failure during startup.

Can the 89HPES12N3AZGBCI support Hot-Plug without additional controller hardware?

Yes, the 89HPES12N3AZGBCI supports PCIe Hot-Plug natively using its master SMBus interface to communicate with standard Hot-Plug I/O expanders (e.g., those used on PC/server motherboards). No separate Hot-Plug controller IC is needed - the device generates SMBus transactions to manage slot presence detection and power control autonomously.

89HPES12N3AZGBCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
PRECISE™
Package/Case:
324-BGA
Packaging:
Tray
Product Status:
Obsolete
Applications:
Switch Interfacing
Interface:
PCI Express
Voltage - Supply:
3.3V
Supplier Device Package:
324-CABGA (19x19)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

89HPES12N3AZGBCI FAQ

1.How can I place an order for 89HPES12N3AZGBCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 89HPES12N3AZGBCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 89HPES12N3AZGBCI reliable?

The price and inventory of 89HPES12N3AZGBCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89HPES12N3AZGBCI is usually 5 days.

3.What payment methods are accepted for 89HPES12N3AZGBCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89HPES12N3AZGBCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 89HPES12N3AZGBCI?

89HPES12N3AZGBCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89HPES12N3AZGBCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89HPES12N3AZGBCI?

For technical support, including 89HPES12N3AZGBCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89HPES12N3AZGBCI requirements.

6.How does Aetrix verify that 89HPES12N3AZGBCI is sourced from the original manufacturer or authorized distributors?

All 89HPES12N3AZGBCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89HPES12N3AZGBCI meets industry standards.

7.What is the process for return or replacement of 89HPES12N3AZGBCI?

All 89HPES12N3AZGBCI units undergo pre-shipment inspection (PSI). If there is an issue with 89HPES12N3AZGBCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89HPES12N3AZGBCI part is unused and in its original packaging.

Return procedure for 89HPES12N3AZGBCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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