Renesas 89HPES16T4AG2ZBALI
- Part No.:
- 89HPES16T4AG2ZBALI
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 324-BBGA, FCBGA
- Datasheet:
-
89HPES16T4AG2ZBALI.pdf
- Description:
- IC INTFACE SPECIALIZED 324FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
89HPES16T4AG2ZBALI from IDT is a 16-lane, 4-port PCI Express Gen2 switch IC designed for high-throughput server, storage, and networking systems. It delivers 128 Gbps full-duplex switching capacity, supports cut-through architecture with ≤150 ns latency, complies with PCIe Base Specification 2.0, and integrates sixteen 5 Gbps SerDes with on-chip packet buffering.
For engineers reviewing the 89HPES16T4AG2ZBALI datasheet, 89HPES16T4AG2ZBALI pinout, 89HPES16T4AG2ZBALI application, or 89HPES16T4AG2ZBALI equivalent, key selection criteria include upstream/downstream port configuration (x8/x4 or x4×4), SMBus master/slave interface support for EEPROM-based initialization, Hot-Plug I/O expander compatibility, RAS features including SECDED ECC on internal RAMs, and thermal design for 19 mm × 19 mm FCBGA324 package at up to 2.87 W max power dissipation.
Technical Context
The 89HPES16T4AG2ZBALI implements a layered PCIe 2.0-compliant architecture with independent Transaction, Data Link, and Physical layers per port. Its switch core supports both store-and-forward and cut-through modes, eight traffic classes, one virtual channel, and end-to-end parity protection on all TLPs - enabling deterministic latency and data integrity in mission-critical infrastructure.
It integrates dual SMBus interfaces (master address 0x50, slave address 0x77) for configuration register access and serial EEPROM programming, plus seven GPIO pins with alternate functions including P1RSTN, P2RSTN, P3RSTN, IOEXPINTN0, and GPEN - allowing flexible system-level control and Hot-Plug event handling via external I/O expanders.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| PCIe Generation | Gen2 (5 Gbps per lane), fully compliant with PCIe Base Spec 2.0 |
| Total Lanes / Ports | 16 lanes across 4 ports: 1 upstream (x8 or x4) + up to 3 downstream (x4 each) |
| Switch Architecture | Cut-through mode with ≤150 ns latency; supports memory and I/O transaction switching |
| Power Supply | VDDCORE = 0.9–1.1 V; VDDI/O = 3.135–3.465 V; VDDPEA = 0.95–1.1 V; VDDPEHA = 2.25–2.75 V |
| Thermal Performance | θJA = 16.8 °C/W (no airflow), junction max = 125 °C; max power = 2.87 W at 70 °C ambient |
| Package | 19 mm × 19 mm Flip Chip BGA, 324-ball, 1 mm pitch |
| RAS Features | SECDED ECC on all internal RAMs; end-to-end TLP parity; ECRC and Advanced Error Reporting support |
Pinout & Package
Packaged in a 19 mm × 19 mm, 324-ball Flip Chip BGA with 1 mm ball pitch. Pin functions validated per IDT DSC 6928 datasheet (June 2015).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PE0RP[3:0]/PE0RN[3:0] | PCIe Port 0 Receive Differential Pair | Upstream port input; AC-coupled, HCSL-compatible, 100 MHz reference clock synchronized |
| PE0TP[3:0]/PE0TN[3:0] | PCIe Port 0 Transmit Differential Pair | Upstream port output; supports de-emphasis (-3.5 dB / -6.0 dB) and electrical idle signaling |
| MSMBCLK/MSMBDAT | Master SMBus Interface | 400 kHz bidirectional bus for EEPROM configuration loading and Hot-Plug expander control (address 0x50) |
| SSMBCLK/SSMBDAT | Slave SMBus Interface | 400 kHz bidirectional bus for external host access to all configuration registers (address 0x77) |
| GPIO[0], GPIO[8], GPIO[9] | Configurable General Purpose I/O | Software-selectable as outputs: P2RSTN, P1RSTN, P3RSTN for downstream port reset assertion |
| GPIO[2] | Interrupt Input | Alternate function IOEXPINTN0: receives Hot-Plug interrupt from external SMBus I/O expander |
| PERSTN | Fundamental Reset Input | Active-low asynchronous reset initiating PCIe fundamental reset sequence across all logic blocks |
| P01MERGEN / P23MERGEN | Port Merge Control | Active-low inputs enabling x8 port formation: P0+P1 or P2+P3; internally pulled high (92 kΩ) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated SerDes | Sixteen 5 Gbps embedded SerDes with 8b/10b encoding, RxEQ, no external transceivers required |
| Flexible Port Configuration | Automatic link width negotiation (x8/x4/x2/x1) and lane reversal on all four ports |
| Hot-Plug Support | Native PCIe Hot-Plug on all downstream ports via SMBus-controlled external I/O expander |
| On-Chip Memory | Dedicated frame buffer and queueing memory for packet buffering without external DRAM |
| Debug & Test Access | Built-in PRBS generator, full SMBus register read/write, JTAG boundary scan (IEEE 1149.1), and forced link mode bypass |
Applications
| Enterprise Server I/O Expansion | High-Density Storage Controller |
|---|---|
Use Scenario: Adding multiple 10GbE, SATA, and PCIe slot interfaces to a dual-socket x86 server motherboard. IC Role / Device Role / Timing Role: PCIe fan-out switch providing x8 upstream connectivity to CPU/Northbridge and three x4 downstream links to NICs, HBAs, and add-in cards. Use Value: Enables single-slot, low-layer-count board layout while delivering 128 Gbps aggregate bandwidth and deterministic sub-150 ns cut-through latency. | Use Scenario: Consolidating SAS/SATA drives and NVMe SSDs behind a unified controller in a 2U rackmount storage appliance. IC Role / Device Role / Timing Role: High-reliability PCIe switching node supporting eight traffic classes and SECDED ECC-protected internal RAM for error-resilient data path management. Use Value: Ensures data integrity under sustained I/O load via end-to-end TLP parity and Advanced Error Reporting - critical for RAID rebuild and cache coherency. |
| Communications Network Switch Fabric | Embedded Telecom Processing Platform |
Use Scenario: Interconnecting packet processors, crypto accelerators, and front-panel PHYs in a modular Layer 3 switch chassis. IC Role / Device Role / Timing Role: Low-latency PCIe 2.0 interconnect hub with configurable port merging (P0+P1 → x8, P2+P3 → x8) for flexible topology mapping. Use Value: Reduces PCB layer count and routing complexity versus discrete bridge solutions while maintaining full Gen2 bandwidth per lane. | Use Scenario: Enabling multi-core DSP and FPGA co-processing in a ruggedized wireless baseband unit with field-upgradable I/O. IC Role / Device Role / Timing Role: Configurable PCIe switch with SMBus master interface for in-system programming of external EEPROM and GPIO-driven reset sequencing. Use Value: Supports hot-swap-capable field maintenance via GPIO-controlled port resets and SMBus-triggered Hot-Plug state updates without host CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen2 switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 89HPES16T4AG2ZCALI | Same die, different temperature grade: Industrial (-40°C to +85°C) vs. Commercial (0°C to +70°C) | Required for extended-temperature deployments in telecom or industrial edge equipment | Select 89HPES16T4AG2ZCALI when ambient operating temperature exceeds 70°C or falls below 0°C |
| 89HPES8T3AG2ZBALI | 8-lane, 3-port variant with identical architecture, lower power (1.78 W typical), and reduced pin count (256-ball BGA) | Suitable for cost- and space-constrained edge servers or embedded controllers needing fewer downstream endpoints | Choose 89HPES8T3AG2ZBALI when full 16-lane capacity is unnecessary and thermal envelope is tighter |
Compared with 89HPES16T4AG2ZBALI, the ZCALI variant extends operational range for harsh environments without altering functionality, while the 89HPES8T3AG2ZBALI reduces lane count and package size - offering scalable PCIe fan-out where full 16-lane throughput is not required.
Availability
89HPES16T4AG2ZBALI is available at Aetrix Electronics and suitable for enterprise server I/O expansion, high-density storage controller design, and communications network switch fabric requiring stable component supply and long-term lifecycle support.
Supply support for 89HPES16T4AG2ZBALI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology, Inc.) is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions, acquired by Renesas Electronics in 2019.
The 89HPES16T4AG2ZBALI belongs to IDT's PRECISE™ family of PCIe switching solutions, engineered specifically for high-bandwidth, low-latency infrastructure applications in servers, storage arrays, and carrier-grade networking equipment.
FAQ
What is the maximum supported PCIe link speed and generation for the 89HPES16T4AG2ZBALI?
The 89HPES16T4AG2ZBALI supports PCI Express Base Specification Revision 2.0 only, with a fixed 5 Gbps per lane data rate (Gen2). It does not support Gen3 (8 Gbps) or higher. All sixteen lanes operate at Gen2 speed, and automatic link training negotiates widths of x1, x2, x4, or x8 per port - but never beyond Gen2 electrical and protocol compliance.
Does the 89HPES16T4AG2ZBALI require external SerDes or transceivers?
No, the 89HPES16T4AG2ZBALI integrates sixteen fully compliant 5 Gbps PCIe Gen2 SerDes with built-in 8b/10b encoder/decoder, receive equalization (RxEQ), and transmitter de-emphasis. No external SerDes, retimers, or transceivers are needed - simplifying layout and reducing BOM cost compared to multi-chip PCIe switch implementations.
How does the 89HPES16T4AG2ZBALI implement Hot-Plug functionality on downstream ports?
The 89HPES16T4AG2ZBALI uses its master SMBus interface (address 0x50) to communicate with an external Hot-Plug I/O expander. On Hot-Plug state change, it issues SMBus writes to update expander outputs and reads inputs via interrupt-driven GPIO[2] (IOEXPINTN0), eliminating dedicated Hot-Plug controller pins and conserving package I/O resources.
What are the power supply requirements and sequencing constraints for the 89HPES16T4AG2ZBALI?
The 89HPES16T4AG2ZBALI requires five supplies: VDDCORE (0.9–1.1 V), VDDI/O (3.135–3.465 V), VDDPEA (0.95–1.1 V), VDDPEHA (2.25–2.75 V), and VDDPETA (0.95–1.1 V). During power-up, VDDCORE must remain at least 1.0 V below VDDI/O at all times; no other sequencing is mandated. Power-down may occur in any order.
Can the 89HPES16T4AG2ZBALI be configured to operate as a single x16 port instead of four separate ports?
No - the 89HPES16T4AG2ZBALI has fixed port topology: one upstream port (P0) and three downstream ports (P1–P3). However, P0 and P1 can be merged into a single x8 port using P01MERGEN, and P2 and P3 into another x8 port using P23MERGEN. True x16 operation across all 16 lanes is not supported; the device lacks x16-capable SerDes routing or link aggregation logic.
89HPES16T4AG2ZBALI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- PRECISE™
- Package/Case:
- 324-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- 3.3V
- Supplier Device Package:
- 324-FCBGA (19x19)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89HPES16T4AG2ZBALI FAQ
1.How can I place an order for 89HPES16T4AG2ZBALI through Aetrix?
Please submit a Request for Quotation (RFQ) for 89HPES16T4AG2ZBALI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89HPES16T4AG2ZBALI reliable?
The price and inventory of 89HPES16T4AG2ZBALI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89HPES16T4AG2ZBALI is usually 5 days.
3.What payment methods are accepted for 89HPES16T4AG2ZBALI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89HPES16T4AG2ZBALI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 89HPES16T4AG2ZBALI?
89HPES16T4AG2ZBALI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89HPES16T4AG2ZBALI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89HPES16T4AG2ZBALI?
For technical support, including 89HPES16T4AG2ZBALI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89HPES16T4AG2ZBALI requirements.
6.How does Aetrix verify that 89HPES16T4AG2ZBALI is sourced from the original manufacturer or authorized distributors?
All 89HPES16T4AG2ZBALI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89HPES16T4AG2ZBALI meets industry standards.
7.What is the process for return or replacement of 89HPES16T4AG2ZBALI?
All 89HPES16T4AG2ZBALI units undergo pre-shipment inspection (PSI). If there is an issue with 89HPES16T4AG2ZBALI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89HPES16T4AG2ZBALI part is unused and in its original packaging.
Return procedure for 89HPES16T4AG2ZBALI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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