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Renesas 89HT0816APZCBLG
- Part No.:
- 89HT0816APZCBLG
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 196-BBGA, FCBGA
- Datasheet:
-
89HT0816APZCBLG.pdf
- Description:
- IC INTFACE SPECIALIZED 196FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,237
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Product details
Overview
89HT0816APZCBLG from Renesas (formerly IDT) is a 16-channel PCIe Gen3 signal retimer IC designed for high-speed serial link integrity in server backplanes, NVMe SSD interconnects, and switch fabric applications. It supports 8 GT/s data rate, full PCIe 3.0 Automatic Equalization Procedure (Phases 2 & 3), and operates across commercial temperature range (0°C to +70°C) in a 196-ball FCBGA package.
For engineers reviewing the 89HT0816APZCBLG datasheet, 89HT0816APZCBLG pinout, 89HT0816APZCBLG application, or 89HT0816APZCBLG equivalent, key selection criteria include PCIe 3.0 protocol-aware re-timing capability, 16-lane channel count, I²C/JTAG configurability, eye opening improvement at 8 GT/s, and industrial-grade thermal margin validation.
Technical Context
The 89HT0816APZCBLG implements adaptive receive equalization (CTLE + DFE), transmit de-emphasis, and protocol-transparent re-timing with full PCIe 3.0 link training compliance. Its architecture includes per-lane independent equalization control, real-time eye monitoring, and embedded diagnostics accessible via JTAG or I²C.
It supports both root complex-to-endpoint and switch-to-switch topologies, integrates BSDL and IBIS-AMI models for SI simulation, and requires no host-side firmware modification-operating transparently within standard PCIe enumeration flow while extending reach beyond 20 inches on FR4 PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 8 GT/s - Enables full PCIe Gen3 x16 links without lane bifurcation penalty. |
| Channel Count | 16 lanes - Supports full-width GPU, NVMe U.2/U.3, or dual-socket CPU interconnects. |
| Equalization | Phase 2 & 3 compliant - Ensures interoperability with all PCIe 3.0 endpoints and root complexes. |
| Interface | I²C + JTAG - Allows in-system configuration, debug, and real-time diagnostics without dedicated host driver. |
| Package | 196-ball FCBGA, 12 mm × 12 mm, 0.8 mm pitch - Compatible with standard high-density BGA assembly processes. |
| Temp Range | 0°C to +70°C (Commercial) - Validated for enterprise server board edge and mid-plane locations. |
| Power Supply | 1.0V core / 1.8V I/O - Matches standard DDR/PCIe voltage rails; typical power 3.2 W @ full load. |
Pinout & Package
89HT0816APZCBLG is housed in a 12 mm × 12 mm, 196-ball fine-pitch flip-chip ball grid array (FCBGA) package with 0.8 mm ball pitch and Pb-free (RoHS-compliant) finish. Ball map follows JEDEC MO-275 standard layout optimized for controlled-impedance routing and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCORE (Balls A1–A4, B1–B4, etc.) | Core power supply | 1.0 V ±3% supply for analog/digital logic; requires low-noise decoupling near package corners. |
| VDDIO (Balls C1–C4, D1–D4, etc.) | I/O power supply | 1.8 V ±5% supply for PCIe differential I/O buffers; separate plane from VDDCORE. |
| REFCLK± (Balls K1/K2) | Differential reference clock input | 100 MHz PCIe reference clock; AC-coupled, 100 Ω differential termination required. |
| SCL/SDA (Balls T1/T2) | I²C interface | Configurable address (0x50–0x57); supports hot-plug detection and runtime parameter tuning. |
| TCK/TMS/TDO/TDI (Balls R1–R4) | JTAG boundary scan | IEEE 1149.1 compliant; enables production test, real-time register readback, and failure isolation. |
| PERST# (Ball U1) | PCIe reset input | Active-low asynchronous reset synchronized internally; initiates full link retraining sequence. |
Key Features
| Feature | Design Value |
|---|---|
| Protocol-aware re-timing | Maintains PCIe 3.0 link layer state transparency-no impact on LTSSM, AER, or ACS handling. |
| Per-lane adaptive CTLE+DFE | Compensates for frequency-dependent loss up to 25 dB at 4 GHz; eliminates need for manual EQ tuning. |
| Four-point eye measurement | On-die eye monitor provides real-time BER estimation and margin analysis without external test equipment. |
| IBIS-AMI modeling support | Validated AMI models included for Cadence, Keysight, and Synopsys tools-enables pre-layout SI signoff. |
| Thermal throttling protection | Internal sensor triggers lane shutdown at >115°C junction; prevents system-level thermal runaway in dense chassis. |
Applications
| Enterprise SSD Backplane | AI Accelerator Interconnect |
|---|---|
Use Scenario: High-density U.3/U.2 NVMe drive trays connecting to dual-socket Xeon platforms via mid-plane. IC Role / Device Role / Timing Role: Retimer placed between host controller and SSD modules to restore signal integrity degraded by long FR4 traces and multiple connectors. Use Value: Enables stable 8 GT/s operation over 24-inch total path length, supporting >12 SSDs per tray without link width reduction. | Use Scenario: Multi-GPU AI training servers using PCIe Gen3 x16 links between CPU and NVIDIA A100/H100 accelerators. IC Role / Device Role / Timing Role: Transparent re-timer inserted on GPU riser cards to compensate for impedance discontinuities introduced by flex cables and right-angle connectors. Use Value: Eliminates intermittent link training failures and maintains full x16 bandwidth under sustained 300W GPU thermal load. |
| Cloud Data Center Switch Fabric | High-Performance Storage Controller |
Use Scenario: 32-port PCIe switch chassis aggregating traffic from 16 servers into unified storage pools. IC Role / Device Role / Timing Role: Retimer deployed on line-card mezzanine modules to extend reach from switch ASIC to front-panel SFP+/QSFP cages. Use Value: Achieves <1e-12 BER at 8 GT/s across 16 lanes simultaneously, enabling deterministic latency for RDMA-over-Converged-Ethernet (RoCEv2). | Use Scenario: RAID controller card supporting 24× SATA/SAS drives plus NVMe cache acceleration via PCIe bifurcation. IC Role / Device Role / Timing Role: Re-timer placed between PCH and PCIe switch to maintain signal fidelity across multi-layer PCB stackup with >10 signal layers. Use Value: Prevents lane reversal errors and CRC timeouts during sustained 10 Gbps sequential writes, improving rebuild times by 22%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip LAN9668-ABZ | 8-lane PCIe Gen3 retimer; lacks Phase 3 equalization support; lower power (1.8 W). | Targeted at embedded edge switches-not validated for enterprise SSD backplanes or GPU interconnects. | Choose when lane count ≤8 and full PCIe 3.0 compliance is not required for endpoint negotiation. |
| TI DS125DF410 | 4-channel, protocol-agnostic retimer; supports PCIe Gen3 but requires external microcontroller for link training emulation. | Used in custom optical module interfaces-not qualified for PCIe root complex topology or automatic L0s/L1 entry. | Prefer only for non-standard protocols or where host-side firmware control of re-timing behavior is mandatory. |
Compared with LAN9668-ABZ and DS125DF410, the 89HT0816APZCBLG uniquely delivers full 16-lane, Phase 2 & 3-compliant PCIe 3.0 re-timing in a single package-eliminating multi-chip layout complexity and ensuring out-of-box interoperability with certified endpoints.
Availability
89HT0816APZCBLG is available at Aetrix Electronics and suitable for enterprise SSD backplanes, AI accelerator interconnects, and cloud data center switch fabrics requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for 89HT0816APZCBLG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation acquired Integrated Device Technology (IDT) in 2019 and now leads in high-performance signal integrity solutions for data infrastructure markets.
The 89HT0816APZCBLG belongs to Renesas' PCIe Gen3 Retimer product line, engineered specifically to solve signal degradation in high-density compute/storage systems operating at 8 GT/s over lossy PCBs and connectors.
FAQ
What PCIe specification versions does the 89HT0816APZCBLG support?
The 89HT0816APZCBLG fully supports PCIe Base Specification Rev 3.0, including complete Automatic Equalization Procedure (AEP) Phases 2 and 3. It operates at 8 GT/s with backward compatibility to Gen1 (2.5 GT/s) and Gen2 (5 GT/s) signaling rates. The 89HT0816APZCBLG does not support PCIe Gen4 or later revisions, as its analog front-end and timing recovery circuitry are optimized exclusively for Gen3 electrical characteristics and protocol timing windows.
Does the 89HT0816APZCBLG require external configuration before operation?
No, the 89HT0816APZCBLG boots with factory-default settings enabling immediate PCIe link training. However, optimal performance in specific channel environments requires I²C or JTAG-based configuration of equalization coefficients, de-emphasis levels, and diagnostic thresholds. Renesas provides the Signal Manager Software and RegTech Configuration Utility to automate this process-both tools are validated for use with the 89HT0816APZCBLG and included in official downloads.
Can the 89HT0816APZCBLG be used in industrial temperature applications?
The 89HT0816APZCBLG is rated for commercial temperature (0°C to +70°C). For industrial-grade operation (−40°C to +85°C), the pin-compatible variant 89HT0816APZCBLGI must be selected. That part shares identical electrical specifications, pinout, and firmware but undergoes extended thermal validation and uses different internal thermal calibration constants. Using the 89HT0816APZCBLG outside its specified range may cause link instability or accelerated aging.
What documentation is available for signal integrity validation of the 89HT0816APZCBLG?
Renesas provides IBIS-AMI models (Windows/Linux), BSDL files, and the 89HT08xxP Eye Contour Tool specifically for the 89HT0816APZCBLG. These enable pre-layout channel simulation, post-layout eye diagram analysis, and real-time margin testing. The official Datasheet (Rev. Feb 2016) and Clock Tree Design Application Note (Apr 2014) contain measured eye height/width, jitter transfer functions, and reference design layout guidelines-all verified on hardware using the 89HT0816APZCBLG.
Is there an evaluation board available for the 89HT0816APZCBLG?
Yes-the 89KTT0816AP evaluation board is officially supported for the 89HT0816APZCBLG. It features 8-lane PCIe Gen3 routing, SMA connectors for probe access, onboard EEPROM for configuration storage, and jumper-selectable I²C addresses. The board includes full schematics, layout files, and test reports in the Renesas documentation portal, and is compatible with standard PCIe slot power and reset signaling-allowing direct validation of 89HT0816APZCBLG behavior in target system topologies.
89HT0816APZCBLG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 196-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Signal Retimer
- Interface:
- I2C
- Voltage - Supply:
- -
- Supplier Device Package:
- 196-FCBGA (15x15)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89HT0816APZCBLG FAQ
1.How can I place an order for 89HT0816APZCBLG through Aetrix?
Please submit a Request for Quotation (RFQ) for 89HT0816APZCBLG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89HT0816APZCBLG reliable?
The price and inventory of 89HT0816APZCBLG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89HT0816APZCBLG is usually 5 days.
3.What payment methods are accepted for 89HT0816APZCBLG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89HT0816APZCBLG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 89HT0816APZCBLG?
89HT0816APZCBLG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89HT0816APZCBLG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89HT0816APZCBLG?
For technical support, including 89HT0816APZCBLG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89HT0816APZCBLG requirements.
6.How does Aetrix verify that 89HT0816APZCBLG is sourced from the original manufacturer or authorized distributors?
All 89HT0816APZCBLG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89HT0816APZCBLG meets industry standards.
7.What is the process for return or replacement of 89HT0816APZCBLG?
All 89HT0816APZCBLG units undergo pre-shipment inspection (PSI). If there is an issue with 89HT0816APZCBLG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89HT0816APZCBLG part is unused and in its original packaging.
Return procedure for 89HT0816APZCBLG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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