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Renesas 89HT0816APZCBLG8
- Part No.:
- 89HT0816APZCBLG8
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 196-BBGA, FCBGA
- Datasheet:
-
89HT0816APZCBLG8.pdf
- Description:
- FCBGA 15.00X15.00X2.60 MM, 1.00M
- Quantity:
- Payment:
- Shipping:
Inventory:2,345
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Product details
Overview
89HT0816APZCBLG8 from Renesas (formerly IDT) is a 16-channel PCIe Gen3 signal retimer IC designed for high-integrity 8 GT/s serial link extension in server backplanes, NVMe SSD interconnects, and switch fabric interfaces. It delivers full Phase 2 & 3 equalization, protocol-aware automatic EQ procedure, and operates at 2.5/5/8 Gbps across all lanes with commercial-grade temperature range (0°C to +70°C).
For engineers reviewing the 89HT0816APZCBLG8 datasheet, 89HT0816APZCBLG8 pinout, 89HT0816APZCBLG8 application, or 89HT0816APZCBLG8 equivalent, key selection criteria include PCIe 3.0 compliance, per-lane adaptive equalization capability, I²C/JTAG configurability, FCBGA-196 package thermal performance, and industrial vs. commercial grade availability.
Technical Context
The 89HT0816APZCBLG8 implements a fully protocol-aware retiming architecture with embedded PCIe 3.0 link training state machine support. It performs real-time lane-by-lane decision feedback equalization (DFE), continuous time linear equalization (CTLE), and re-timing with sub-bit-period jitter cleanup.
Its dual-interface control (I²C and JTAG) enables in-system configuration and diagnostics during link initialization and runtime. The device supports full Automatic Equalization Procedure (AEP) including Phase 2 (receiver EQ) and Phase 3 (transmitter EQ), compliant with PCIe Base Spec v3.0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Protocol Support | PCI Express Gen3 (8 GT/s), backward compatible with Gen1/Gen2 |
| Channel Count | 16 independent bidirectional lanes with per-lane EQ control |
| Equalization Type | Full AEP: Phase 2 (CTLE + DFE) and Phase 3 (TX pre-emphasis) |
| Operating Temperature | 0°C to +70°C (Commercial grade, specified for 89HT0816APZCBLG8) |
| Package | FCBGA-196, 12 mm × 12 mm, 0.8 mm pitch, Pb-free |
| Control Interface | I²C (400 kHz) and IEEE 1149.1 JTAG for programming and debug |
| Power Supply | 1.0V core, 1.8V I/O, 3.3V analog supply - each independently regulated |
Pinout & Package
89HT0816APZCBLG8 is housed in a 12 mm × 12 mm, 0.8 mm pitch, 196-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA) package with exposed thermal pad. Ball map follows JEDEC MO-270AB standard layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE (Balls A1–A4, B1–B4, etc.) | Core power supply | 1.0 V ±3% supply for digital logic and PLL; requires local low-ESR decoupling |
| VDD_IO (Balls C1–C4, D1–D4, etc.) | I/O power supply | 1.8 V ±5% supply for SERDES I/O banks; separate from core and analog rails |
| VDDA (Balls E1–E4, F1–F4) | Analog power supply | 3.3 V ±5% supply for CTLE/DFE analog front-end; critical for noise-sensitive EQ performance |
| SCL / SDA | I²C interface | Standard two-wire bus for configuration, status readback, and lane tuning |
| TCK / TMS / TDI / TDO | JTAG interface | IEEE 1149.1 boundary-scan and register access for production test and debug |
| CLK_IN / CLK_OUT | Reference clock I/O | Accepts 100 MHz differential reference; provides buffered output for daisy-chain timing distribution |
Key Features
| Feature | Design Value |
|---|---|
| Per-lane adaptive equalization | Enables robust link establishment across lossy PCB traces up to 40+ inches FR4 at 8 GT/s without system-level redesign |
| Protocol-aware AEP execution | Automatically negotiates optimal CTLE/DFE/pre-emphasis settings during PCIe link training - no host firmware intervention required |
| Dual-control interface (I²C + JTAG) | Supports factory programming (JTAG) and field runtime tuning (I²C), enabling both production test and dynamic link optimization |
| Advanced diagnostic visibility | Provides real-time eye height/width, BER estimation, and lane margining via I²C registers for production validation and field failure analysis |
| Thermal-aware operation | On-die temperature sensor and thermal throttling logic maintain signal integrity stability under sustained 16-lane load at 70°C ambient |
Applications
| Server Backplane Interconnect | NVMe U.2/U.3 SSD Expansion |
|---|---|
Use Scenario: Extending PCIe Gen3 links across 24-inch midplane traces in 2U/4U rack servers with multi-slot GPU/NVMe topologies. IC Role / Device Role / Timing Role: Retimer IC performing lane-by-lane re-timing and adaptive equalization to restore signal integrity before reaching CPU or switch ASIC. Use Value: Enables reliable 8 GT/s operation over FR4 backplanes exceeding PCIe spec loss budget by >15 dB, eliminating need for expensive low-loss laminates. | Use Scenario: Bridging host controller to dual- or quad-NVMe SSD modules in enterprise storage enclosures using U.2 or U.3 connectors. IC Role / Device Role / Timing Role: Signal integrity conditioner placed between host PHY and SSD edge connector to compensate for cable and connector insertion loss. Use Value: Maintains PCIe Gen3 link width (x4 per SSD) and stable 8 GT/s data rate despite 1-meter passive copper cable and multiple mated interfaces. |
| AI Accelerator Rack Interconnect | High-Density Switch Fabric Aggregation |
Use Scenario: Interfacing PCIe-based AI accelerators (e.g., NVIDIA A100/H100) to fabric switches in disaggregated compute clusters. IC Role / Device Role / Timing Role: Protocol-transparent retimer ensuring deterministic latency and bit-error-free transmission across variable-length daughterboard interconnects. Use Value: Guarantees sub-10⁻¹² BER at 8 GT/s across heterogeneous board stack-ups, supporting RDMA and GPUDirect P2P traffic without packet retry overhead. | Use Scenario: Aggregating 16 x PCIe Gen3 lanes from multiple line cards into a central switch ASIC with fan-out to CPU/memory subsystems. IC Role / Device Role / Timing Role: Centralized retiming hub providing simultaneous equalization and jitter cleanup for all ingress lanes prior to switch fabric ingress buffer. Use Value: Eliminates cumulative jitter accumulation across cascaded retimers, preserving PCIe Gen3 timing margins required for 100 ns link training timeout compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 retimer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 89HT0816APZCBLGI8 | Same silicon, Industrial temp grade (−40°C to +85°C); identical pinout and electrical specs | Required for extended temperature environments (e.g., telecom chassis, outdoor edge compute) | Select when operating ambient exceeds 70°C or requires wider thermal qualification |
| 89HT0808APZCBLG8 | 8-channel variant, same Gen3 retimer IP, reduced ball count (144-BGA), lower power | Suitable for cost-optimized or space-constrained designs needing ≤8 lanes (e.g., single-slot GPU add-in cards) | Choose for lower channel count systems where 16-lane density is unnecessary |
Compared with 89HT0816APZCBLG8, the ZCBLGI8 offers extended temperature operation without functional trade-offs, while the 89HT0808APZCBLG8 reduces lane count and package size - both retain identical PCIe Gen3 AEP behavior and I²C/JTAG control but serve distinct mechanical and thermal deployment constraints.
Availability
89HT0816APZCBLG8 is available at Aetrix Electronics and suitable for server backplane interconnects, NVMe SSD expansion modules, and AI accelerator rack interconnects requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for 89HT0816APZCBLG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Integrated Device Technology (IDT) in 2019 and now develops and supports its high-speed signal integrity portfolio. IDT was a leader in PCIe retimers, clocking, and memory interface solutions before acquisition.
The 89HT0816APZCBLG8 belongs to IDT's PCIe Gen3 Signal Integrity product line, engineered specifically for high-reliability, high-bandwidth extension of PCIe links in data center and enterprise storage infrastructure.
FAQ
What is the primary function of the 89HT0816APZCBLG8 in a PCIe Gen3 system?
The 89HT0816APZCBLG8 functions as a protocol-aware signal retimer that restores signal integrity on degraded PCIe Gen3 links. It performs per-lane adaptive equalization (CTLE and DFE), re-times data to suppress jitter, and executes full Automatic Equalization Procedure (AEP) during link training - all while maintaining PCIe 3.0 compliance and transparently passing TLPs without protocol modification. Its role is essential for extending reach beyond native spec limits.
Does the 89HT0816APZCBLG8 support PCIe Gen4 or Gen5?
No, the 89HT0816APZCBLG8 is strictly a PCIe Gen3 (8 GT/s) retimer and does not support Gen4 (16 GT/s) or Gen5 (32 GT/s) signaling rates or protocols. Its equalization architecture, SERDES bandwidth, and compliance testing are validated only for PCIe Base Specification v3.0. For Gen4/Gen5 applications, Renesas offers newer families such as the 9FGV series or 89HP08 series.
What package type and mounting configuration does the 89HT0816APZCBLG8 use?
The 89HT0816APZCBLG8 uses a 12 mm × 12 mm, 0.8 mm pitch, 196-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA) package with Pb-free finish and a thermally enhanced exposed pad. It is supplied in tape-and-reel format (G8 suffix) and requires controlled-depth solder paste deposition and profiled reflow per IPC-7095 guidelines due to fine-pitch and thermal mass constraints.
How is the 89HT0816APZCBLG8 configured and monitored in-system?
The 89HT0816APZCBLG8 supports dual in-system interfaces: a 400 kHz I²C bus for runtime configuration, status monitoring, and lane margining; and IEEE 1149.1 JTAG for boundary-scan testing, register access, and factory programming. Both interfaces operate concurrently and are accessible without disrupting PCIe link operation, enabling full visibility during bring-up and field diagnostics.
Is the 89HT0816APZCBLG8 pin-compatible with other members of the 89HT08xxP family?
Yes, the 89HT0816APZCBLG8 shares identical pinout and footprint with other 196-ball variants in the 89HT08xxP family, including 89HT0816APZCBLGI8 (industrial temp) and 89HT0816APZCBLG (tray version). However, it is not pin-compatible with the 144-ball 89HT0808AP series or earlier 89HT08xxP generations due to differing ball maps and power rail allocations.
89HT0816APZCBLG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 196-BBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Signal Retimer
- Interface:
- I2C, JTAG
- Voltage - Supply:
- -
- Supplier Device Package:
- 196-FCBGA (15x15)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89HT0816APZCBLG8 FAQ
1.How can I place an order for 89HT0816APZCBLG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 89HT0816APZCBLG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89HT0816APZCBLG8 reliable?
The price and inventory of 89HT0816APZCBLG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89HT0816APZCBLG8 is usually 5 days.
3.What payment methods are accepted for 89HT0816APZCBLG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89HT0816APZCBLG8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 89HT0816APZCBLG8?
89HT0816APZCBLG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89HT0816APZCBLG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89HT0816APZCBLG8?
For technical support, including 89HT0816APZCBLG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89HT0816APZCBLG8 requirements.
6.How does Aetrix verify that 89HT0816APZCBLG8 is sourced from the original manufacturer or authorized distributors?
All 89HT0816APZCBLG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89HT0816APZCBLG8 meets industry standards.
7.What is the process for return or replacement of 89HT0816APZCBLG8?
All 89HT0816APZCBLG8 units undergo pre-shipment inspection (PSI). If there is an issue with 89HT0816APZCBLG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89HT0816APZCBLG8 part is unused and in its original packaging.
Return procedure for 89HT0816APZCBLG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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