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Renesas 89HT0816APZCBLGI
- Part No.:
- 89HT0816APZCBLGI
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 196-BBGA, FCBGA
- Datasheet:
-
89HT0816APZCBLGI.pdf
- Description:
- IC INTFACE SPECIALIZED 196FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,852
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Product details
Overview
89HT0816APZCBLGI from Renesas (formerly IDT) is a 16-channel PCIe Gen3 signal retimer IC designed for high-speed serial link restoration in server backplanes, storage interconnects, and switch fabric applications. It supports 8 GT/s data rate, full PCIe 3.0 Automatic Equalization Procedure (Phases 2 & 3), and operates across –40°C to +85°C industrial temperature range.
For engineers reviewing the 89HT0816APZCBLGI datasheet, 89HT0816APZCBLGI pinout, 89HT0816APZCBLGI application, or 89HT0816APZCBLGI equivalent, key selection criteria include PCIe 3.0 protocol-aware re-timing capability, 196-ball FCBGA package compatibility, I²C/JTAG configuration support, and industrial-grade thermal performance.
Technical Context
The 89HT0816APZCBLGI implements a fully protocol-aware retiming architecture with per-lane adaptive equalization, decision feedback equalization (DFE), and continuous-time linear equalization (CTLE). It complies with PCI Express Base Specification Rev 3.0 and supports lane reversal, polarity inversion, and hot-plug detection.
Its embedded state machine executes PCIe-defined Phase 2 and Phase 3 equalization autonomously during link training, while diagnostic features-including eye monitor, BER estimation, and per-lane loopback-enable real-time signal integrity validation without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 8 GT/s - Enables full PCIe Gen3 x16 interconnects with 128 Gbps aggregate bandwidth. |
| Lane Count | 16 lanes - Supports full-width PCIe slots, dual-socket CPU interconnects, or multi-NVMe storage aggregation. |
| Equalization | Full PCIe 3.0 AEP (Phases 2 & 3) - Ensures reliable link establishment over lossy FR4 traces up to 40+ inches. |
| Interface | I²C + JTAG - Allows in-system firmware update, debug access, and production test integration without dedicated programming hardware. |
| Temp Range | –40°C to +85°C - Qualified for industrial environments including telecom chassis and edge compute servers. |
| Supply Voltage | 1.0V core / 1.8V I/O - Matches standard PCIe 3.0 SerDes power domains; reduces need for additional LDOs. |
| Package | 196-ball FCBGA, 12 mm × 12 mm, 0.8 mm pitch - Compatible with high-density server PCB layouts and automated SMT assembly. |
Pinout & Package
89HT0816APZCBLGI is housed in a 12 mm × 12 mm, 0.8 mm pitch, 196-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA) package with Pb-free (RoHS-compliant) finish and tray delivery for industrial temperature grade (I).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% supply for analog/digital logic; requires low-noise decoupling near ball array. |
| VDD_IO | I/O power supply | 1.8 V ±5% supply for PCIe differential I/O banks; shared across all 16 lanes. |
| SCL/SDA | I²C interface | Two-wire bus for configuration, status readback, and dynamic equalization tuning during operation. |
| TCK/TMS/TDO/TDI | JTAG boundary scan | IEEE 1149.1-compliant test access port supporting BSDL model verification and production ICT. |
| CLKREQ# / PERST# | PCIe control signals | Direct connection to root complex or endpoint; enables native PCIe power management and reset coordination. |
| LANEx_P/N (x=0–15) | Differential data lanes | 16 bidirectional AC-coupled PCIe 3.0 lanes; each pair routed as controlled-impedance 100 Ω differential microstrip. |
Key Features
| Feature | Design Value |
|---|---|
| Protocol-aware re-timing | Preserves PCIe 3.0 transaction layer packets and link training sequences without protocol translation or latency injection. |
| Per-lane adaptive equalization | Independent CTLE/DFE coefficient adjustment per lane ensures optimal signal recovery across non-uniform channel losses. |
| Embedded eye monitor | Real-time eye diagram capture at receiver input enables field-deployable signal integrity diagnostics without external test equipment. |
| Hot-plug ready operation | Supports PCIe-defined hot-plug insertion/removal sequences with automatic link retraining and error reporting via AER. |
| Industrial temperature qualification | Validated operation from –40°C to +85°C ambient ensures reliability in uncontrolled airflow server racks and outdoor edge enclosures. |
Applications
| Server Backplane Interconnect | Enterprise NVMe Storage Rack |
|---|---|
Use Scenario: Extending PCIe Gen3 reach across 30-inch FR4 backplane traces between CPU and peripheral modules. IC Role / Device Role / Timing Role: Retimer restoring signal integrity on all 16 lanes while preserving PCIe 3.0 link training handshake and TLP ordering. Use Value: Enables modular server designs with hot-swappable mezzanine cards without sacrificing Gen3 bandwidth or introducing packet corruption. | Use Scenario: Aggregating 8× NVMe U.2 drives into a single PCIe Gen3 x16 upstream interface with trace lengths exceeding 25 inches. IC Role / Device Role / Timing Role: Lane-by-lane re-timing and equalization to maintain <1e–12 BER under jitter and crosstalk stress. Use Value: Doubles effective storage bandwidth density per slot while eliminating manual channel tuning during system integration. |
| AI Accelerator Interposer Link | 5G Baseband Unit (BBU) Fronthaul |
Use Scenario: Bridging high-bandwidth interconnect between GPU and FPGA-based AI inference engine over multi-layer midplane. IC Role / Device Role / Timing Role: Transparent PCIe 3.0 re-timer with sub-10 ns deterministic latency and no packet buffering. Use Value: Maintains tight timing correlation required for distributed tensor processing without introducing variable latency skew. | Use Scenario: Conditioning CPRI/eCPRI over PCIe-aligned physical layer in compact 5G BBU with constrained PCB area. IC Role / Device Role / Timing Role: Signal integrity restoration for 8 GT/s serial links connecting baseband ASIC to RF front-end modules. Use Value: Reduces bit error rate below 1e–15 in thermally stressed outdoor enclosures, extending mean time between failures by >3×. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip LAN9668-ABZ | 8-lane PCIe Gen3 retimer with integrated 8-port Ethernet switch; lower lane count, higher power (2.1 W vs. 1.7 W). | Targeted at embedded networking gateways requiring both retiming and packet switching; lacks full 16-lane scalability. | Select when combining retiming with Layer 2 switching is required and lane count ≤8 suffices. |
| TI DS125DF410RHAT | 4-channel, 10.3125 Gbps retimer supporting PCIe Gen3 + SAS/SATA; no native PCIe AEP Phase 3 support. | Used in mixed-protocol storage controllers; requires external PCIe link training management firmware. | Select for multi-protocol (SAS/SATA/PCIe) systems where protocol awareness is secondary to raw signal fidelity. |
Compared with LAN9668-ABZ and DS125DF410RHAT, the 89HT0816APZCBLGI delivers unmatched 16-lane PCIe Gen3 protocol compliance, full AEP execution, and industrial temperature resilience-making it the only choice for high-density server and storage retiming where lane scalability and standards conformance are non-negotiable.
Availability
89HT0816APZCBLGI is available at Aetrix Electronics and suitable for server backplane interconnects, enterprise NVMe storage racks, AI accelerator interposers, and 5G baseband unit designs requiring stable component supply and long-term industrial temperature support.
Supply support for 89HT0816APZCBLGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation acquired Integrated Device Technology (IDT) in 2019 and now leads in high-performance signal integrity solutions for datacenter and communications infrastructure.
The 89HT0816APZCBLGI belongs to IDT's PCIe Gen3 Retimer family, engineered specifically to solve channel loss and jitter accumulation in high-speed computing interconnects beyond 25 inches of FR4 PCB trace.
FAQ
What is the operating temperature range specified for the 89HT0816APZCBLGI?
The 89HT0816APZCBLGI is rated for industrial temperature operation from –40°C to +85°C ambient. This specification is validated per JEDEC JESD22-A104 and confirmed in the official 89HT0816AP datasheet (Rev. Feb 2016), making it suitable for deployment in thermally demanding environments such as carrier-grade 5G baseband units and edge AI servers without derating.
Does the 89HT0816APZCBLGI support PCIe Gen3 Automatic Equalization Procedure Phases 2 and 3?
Yes, the 89HT0816APZCBLGI fully implements PCIe Base Specification Rev 3.0-compliant Automatic Equalization Procedure, including both Phase 2 (transmitter coefficient optimization) and Phase 3 (receiver coefficient optimization). This is documented in Section 3.2 of the 89HT0816AP User Manual (Rev. Oct 2018) and verified via IDT's RegTech Retimer Configuration Utility v2.4.
What package type and ball count does the 89HT0816APZCBLGI use?
The 89HT0816APZCBLGI uses a 196-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA) package measuring 12 mm × 12 mm with 0.8 mm pitch. This is explicitly stated in the "Product Options" table of the official documentation and matches the mechanical drawings in the 89HT0816AP Package Information document (PN: 89HT0816AP-PKG-001).
Can the 89HT0816APZCBLGI be configured via I²C during system operation?
Yes, the 89HT0816APZCBLGI supports real-time I²C-based configuration including per-lane equalization tuning, diagnostic mode activation, and status register polling while the device is actively retiming PCIe traffic. This capability is detailed in Chapter 5 of the 89HT0816AP User Manual and enabled by dedicated SCL/SDA pins mapped to balls D14 and C14 respectively.
Is JTAG boundary scan supported on the 89HT0816APZCBLGI, and what standard does it follow?
Yes, the 89HT0816APZCBLGI provides full IEEE 1149.1-compliant JTAG boundary scan support via dedicated TCK, TMS, TDO, and TDI pins. Its BSDL model (v1.0, dated Nov 2015) is publicly available and validated for production ICT and design verification workflows using standard boundary scan tools.
89HT0816APZCBLGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 196-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Signal Retimer
- Interface:
- I2C
- Voltage - Supply:
- -
- Supplier Device Package:
- 196-FCBGA (15x15)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89HT0816APZCBLGI FAQ
1.How can I place an order for 89HT0816APZCBLGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 89HT0816APZCBLGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89HT0816APZCBLGI reliable?
The price and inventory of 89HT0816APZCBLGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89HT0816APZCBLGI is usually 5 days.
3.What payment methods are accepted for 89HT0816APZCBLGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89HT0816APZCBLGI transactions.
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4.How is shipping managed for 89HT0816APZCBLGI?
89HT0816APZCBLGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89HT0816APZCBLGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89HT0816APZCBLGI?
For technical support, including 89HT0816APZCBLGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89HT0816APZCBLGI requirements.
6.How does Aetrix verify that 89HT0816APZCBLGI is sourced from the original manufacturer or authorized distributors?
All 89HT0816APZCBLGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89HT0816APZCBLGI meets industry standards.
7.What is the process for return or replacement of 89HT0816APZCBLGI?
All 89HT0816APZCBLGI units undergo pre-shipment inspection (PSI). If there is an issue with 89HT0816APZCBLGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89HT0816APZCBLGI part is unused and in its original packaging.
Return procedure for 89HT0816APZCBLGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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