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NXP Semiconductors A2T09D400-23NR6

Part No.:
A2T09D400-23NR6
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
OM-1230-4L2S
Datasheet:
AetrixA2T09D400-23NR6.pdf
Description:
RF MOSFET LDMOS 28V OM1230-42
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,777

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Product details

Overview

A2T09D400-23NR6 from NXP Semiconductors (formerly Freescale) is a symmetrical Doherty RF power LDMOS transistor designed for cellular base station amplifiers operating in the 716–960 MHz band. It delivers 93 W average output power at 28 Vdc, achieves 48.0% drain efficiency at 836 MHz, and maintains –37.1 dBc ACPR under single-carrier W-CDMA with 9.9 dB PAR. Its dual-gate architecture supports carrier-peaking operation in macrocell BTS final-stage PA modules.

For engineers reviewing the A2T09D400-23NR6 datasheet, A2T09D400-23NR6 pinout, A2T09D400-23NR6 application, or A2T09D400-23NR6 equivalent, key selection criteria include its validated 0.29 °C/W thermal resistance, symmetrical Doherty test validation, negative gate-source voltage tolerance for Class C peaking, and internal input/output matching across 776–836 MHz.

Technical Context

This device integrates two matched N-channel enhancement-mode LDMOS transistors-Carrier (Side A) and Peaking (Side B)-in a single OM-1230-4L2S plastic package. It operates with independent gate biasing: VGSA(Q) = 1.5–2.5 Vdc for the carrier side and VGSB = 1.12 Vdc fixed for peaking, enabling precise Doherty load modulation.

The transistor is internally matched for 50 Ω systems across 716–960 MHz, eliminating external matching networks at fundamental frequencies. Its exposed backside source terminal provides low-inductance thermal and electrical grounding, critical for stability and efficiency in high-power RF PA designs.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 716–960 MHz - Covers LTE Band 12/13/14/17/20 and legacy UMTS 850/900 MHz bands in macrocell infrastructure.
Avg. Output Power 93 W @ 28 Vdc - Sustained linear output for single-carrier W-CDMA with 9.9 dB PAR, enabling 4G/LTE Class A/B BTS deployment.
Drain Efficiency 48.0% @ 836 MHz - Reduces thermal load and DC power consumption in air-cooled base station PA stages.
ACPR –37.1 dBc @ ±5 MHz offset - Meets 3GPP spectral mask requirements for adjacent channel leakage without excessive DPD complexity.
Thermal Resistance 0.29 °C/W (Junction-to-Case) - Enables compact heatsink design with case temperature ≤78 °C at full 93 W avg. output.
Gate Voltage Range VGS = –6.0 to +10 Vdc - Supports deep Class C peaking operation and robust ESD protection during bias sequencing.
P1dB Output Power 400 W CW - Provides >4× headroom above 93 W avg., allowing dynamic PAPR handling in multi-carrier scenarios.

Pinout & Package

Package: OM-1230-4L2S - 6-pin plastic overmolded package with exposed copper backside (source terminal). Dimensions: 12.3 mm × 12.3 mm × 4.0 mm (L × W × H), RoHS-compliant, MSL Level 3 (260 °C peak).

Pin/Terminal Circuit Role Design Meaning
1 - RFinA / VGSA Carrier-side gate input Bias and RF drive node for carrier amplifier; requires stable 1.5–2.5 Vdc quiescent gate voltage.
2 - VBWA(1) Carrier-side VDD supply Drain supply pin for carrier transistor; not intended for current sourcing per note (1) in datasheet.
3 - RFoutA / VDSA Carrier-side drain output RF output and drain connection for carrier path; tied to external combiner network.
4 - VBWB(1) Peaking-side VDD supply Drain supply pin for peaking transistor; shares same restriction as Pin 2.
5 - RFinB / VGSB Peaking-side gate input Fixed-bias gate node for peaking amplifier; factory-set to 1.12 Vdc for optimal Doherty timing.
6 - RFoutB / VDSB Peaking-side drain output RF output and drain connection for peaking path; combined with Pin 3 via hybrid coupler.

Key Features

Feature Design Value
Symmetrical Doherty configuration Production-tested as matched carrier-peaking pair - eliminates inter-device gain/phase calibration in PA module assembly.
Negative VGS tolerance Rated to –6.0 Vdc - enables reliable Class C peaking operation with gate voltage undershoot during transient switching.
Digital predistortion (DPD) readiness Validated with IQ magnitude clipping and 9.9 dB PAR - ensures linearity convergence under real-world DPD algorithms.
Internal 50 Ω matching Input/output matched across 776–836 MHz - removes need for discrete matching components, reducing board area and insertion loss.
ESD robustness HBM Class 2 (2 kV), MM Class B - withstands handling and PCB assembly stresses without gate oxide damage.

Applications

Macrocell Base Station Transmitter Multi-Band LTE Remote Radio Head (RRH)

Use Scenario: Final-stage power amplifier in 4G/LTE macrocell BTS operating across Bands 5/8/20 (850/900 MHz) with 20 MHz channel bandwidth.

IC Role / Device Role / Timing Role: Dual-path Doherty transistor providing carrier and peaking amplification synchronized via hybrid coupler; enables high-efficiency envelope tracking.

Use Value: Delivers 93 W avg. output at 48% efficiency while meeting –37.1 dBc ACPR, reducing cooling requirements and OPEX in outdoor cabinet deployments.

Use Scenario: Compact RRH unit supporting simultaneous LTE FDD operation on 700 MHz (Band 12) and 900 MHz (Band 8) with shared PA architecture.

IC Role / Device Role / Timing Role: Single-package symmetrical Doherty transistor enabling frequency-agile PA design with minimal layout rework between bands.

Use Value: Internal 50 Ω matching and 716–960 MHz bandwidth allow one hardware revision to cover multiple regional frequency plans, accelerating time-to-market.

W-CDMA/HSPA+ Infrastructure Amplifier Digital Pre-Distortion Test Platform

Use Scenario: Linear PA stage in 3G UMTS Node B supporting 5-carrier HSPA+ with 15 MHz aggregated bandwidth and 10 dB PAR.

IC Role / Device Role / Timing Role: High-linearity RF power transistor biased for Doherty mode, with carrier and peaking paths independently controllable for dynamic load modulation.

Use Value: 0.3 dB gain flatness over 60 MHz and –7.1° AM/PM distortion enable stable closed-loop DPD convergence across full operating bandwidth.

Use Scenario: Reference device in lab-based DPD algorithm development platform using vector signal analyzer and arbitrary waveform generator.

IC Role / Device Role / Timing Role: Production-validated Doherty transistor with documented load-pull contours (Tables 8–9) and broadband PARC response (Fig. 3).

Use Value: Published Zload and Zsource data for P1dB/P3dB/ηD optimization allow accurate behavioral model extraction and DPD coefficient training.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
AFM905S Single-path LDMOS, 90 W avg. @ 860 MHz, 42% efficiency, no integrated peaking path. Requires external Doherty combiner and separate peaking transistor; higher component count and layout complexity. Select when modular PA design or independent carrier/peaking tuning is required.
CGHV1F090P GaN HEMT, 90 W avg. @ 860 MHz, 55% efficiency, 0.17 °C/W RθJC, VDS = 50 V. Higher voltage operation enables higher PEP; requires redesigned gate bias and thermal interface due to GaN-specific reliability constraints. Select when maximum efficiency and power density are prioritized over cost and proven field reliability in legacy BTS.

Compared with AFM905S and CGHV1F090P, the A2T09D400-23NR6 uniquely integrates matched carrier-peaking paths in one package with production-validated Doherty performance, reducing system-level design risk and time-to-deployment for LTE/UMTS macrocell amplifiers.

Availability

A2T09D400-23NR6 is available at Aetrix Electronics and suitable for cellular infrastructure, macrocell base stations, and remote radio head applications requiring stable component supply, long-term lifecycle support, and traceable manufacturing origin.

Supply support for A2T09D400-23NR6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and continues its RF Power portfolio under the Airfast brand, focusing on high-efficiency, thermally robust solutions for wireless infrastructure.

The A2T09D400-23NR6 belongs to the Airfast RF Power LDMOS family, engineered specifically for energy-efficient, digitally predistorted Doherty amplifiers in 4G/LTE and 3G cellular base stations.

FAQ

What is the recommended gate bias for the peaking path of the A2T09D400-23NR6?

The peaking-side gate (Pin 5, RFinB/VGSB) of the A2T09D400-23NR6 is factory-biased to 1.12 Vdc under test conditions (VDD = 28 Vdc, IDQA = 1200 mA). This fixed bias enables optimal Doherty load modulation and must be maintained in production circuits using a precision low-noise voltage reference; deviation beyond ±0.05 Vdc degrades efficiency and ACPR performance.

Can the A2T09D400-23NR6 operate outside the 716–960 MHz band?

The A2T09D400-23NR6 is characterized and production-tested from 716–960 MHz, with typical performance data provided at 776/806/836 MHz. While functional operation may occur down to 600 MHz or up to 1 GHz, gain flatness degrades beyond ±30 MHz of center frequency, and ACPR exceeds –34.7 dBc outside the specified band - use only within 716–960 MHz for compliant 3GPP deployments.

How is thermal management implemented for the A2T09D400-23NR6 in high-power operation?

The A2T09D400-23NR6 uses its exposed copper backside as the primary thermal and electrical source connection. It requires direct mounting onto a nickel-plated copper heatsink with thermal interface material (TIM) and minimum clamping force of 25 lbf/in². At 93 W avg. output, junction temperature must remain ≤225 °C - achieved by maintaining case temperature ≤78 °C, verified via thermocouple on the package edge per AN1955.

Is the A2T09D400-23NR6 pin-compatible with earlier Freescale Doherty transistors like A2T09D400-23N?

Yes - the A2T09D400-23NR6 shares identical pinout, package outline (OM-1230-4L2S), and electrical specifications with the A2T09D400-23N. The "R6" suffix denotes tape-and-reel packaging (150 units, 56 mm tape width, 13-inch reel); all functional and thermal parameters remain unchanged from the base part number.

What is the maximum safe operating drain voltage for continuous-wave operation of the A2T09D400-23NR6?

The absolute maximum drain-source voltage (VDSS) for the A2T09D400-23NR6 is +70 Vdc, but continuous-wave operation is rated for VDD ≤ 32 Vdc per Table 1. Operating at 32 Vdc requires derating output power to maintain TJ ≤ 225 °C and avoid electromigration failure; Freescale's MTTF calculator (nxp.com/RF/calculators) confirms 10-year reliability only when case temperature is held ≤78 °C at 28 Vdc/93 W avg.

A2T09D400-23NR6 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
OM-1230-4L2S
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
LDMOS
Configuration:
-
Frequency:
716MHz ~ 960MHz
Gain:
17.8dB
Voltage - Test:
28 V
Current Rating (Amps):
10µA
Noise Figure:
-
Current - Test:
1.2 A
Power - Output:
400W
Voltage - Rated:
70 V
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
OM-1230-4L2S

A2T09D400-23NR6 FAQ

1.How can I place an order for A2T09D400-23NR6 through Aetrix?

Please submit a Request for Quotation (RFQ) for A2T09D400-23NR6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for A2T09D400-23NR6 reliable?

The price and inventory of A2T09D400-23NR6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for A2T09D400-23NR6 is usually 5 days.

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4.How is shipping managed for A2T09D400-23NR6?

A2T09D400-23NR6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your A2T09D400-23NR6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for A2T09D400-23NR6?

For technical support, including A2T09D400-23NR6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your A2T09D400-23NR6 requirements.

6.How does Aetrix verify that A2T09D400-23NR6 is sourced from the original manufacturer or authorized distributors?

All A2T09D400-23NR6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that A2T09D400-23NR6 meets industry standards.

7.What is the process for return or replacement of A2T09D400-23NR6?

All A2T09D400-23NR6 units undergo pre-shipment inspection (PSI). If there is an issue with A2T09D400-23NR6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The A2T09D400-23NR6 part is unused and in its original packaging.

Return procedure for A2T09D400-23NR6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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