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NXP Semiconductors A2T18H455W23NR6

Part No.:
A2T18H455W23NR6
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
OM-1230-4L2S
Datasheet:
AetrixA2T18H455W23NR6.pdf
Description:
RF MOSFET LDMOS 31.5V OM1230-42
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:153

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Product details

Overview

A2T18H455W23NR6 from NXP Semiconductors (formerly Freescale) is an asymmetrical Doherty RF power LDMOS transistor designed for cellular base station amplifiers operating in the 1805–1880 MHz band. It delivers 87 W average output power at 31.5 Vdc with 48.4% drain efficiency and 15.9 dB power gain at 1880 MHz under W-CDMA single-carrier conditions, supporting digital predistortion in macrocell infrastructure.

For engineers reviewing the A2T18H455W23NR6 datasheet, A2T18H455W23NR6 pinout, A2T18H455W23NR6 application, or A2T18H455W23NR6 equivalent, key selection criteria include its dual-gate Doherty architecture, 0.23 °C/W junction-to-case thermal resistance, 1805–1880 MHz instantaneous bandwidth, and ability to withstand 10:1 VSWR without degradation.

Technical Context

This device integrates two laterally diffused MOSFETs - a carrier transistor (Side A) and a peaking transistor (Side B) - in a single OM-1230-4L2S plastic overmolded package. Its internal input/output matching enables operation across the full 1805–1880 MHz band without external tuning networks.

The carrier side operates at IDQA = 1080 mA with VGSA(Q) = 2.5 Vdc, while the peaking side is biased at VGSB = 0.25 Vdc. Both sides share a common source (exposed backside) and require tied VDDA/VDDB rails per Freescale test fixture requirements.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 1805–1880 MHz: Full-band instantaneous operation without retuning in LTE/W-CDMA base stations.
Avg. Output Power 87 W: Sustained average RF output under 9.9 dB PAR W-CDMA signal at 0.01% CCDF probability.
Drain Efficiency 48.4% @ 1880 MHz: Reduces thermal load and DC power consumption in high-power macrocell PA stages.
Power Gain 15.9 dB @ 1880 MHz: Enables compact multi-stage amplifier designs with reduced driver stage complexity.
Thermal Resistance 0.23 °C/W (Junction-to-Case): Supports high-power density mounting on heatsinks with minimal thermal derating.
VSWR Tolerance 10:1 @ 32 Vdc / 575 W CW: Ensures rugged operation under mismatched antenna conditions without failure.
ACPR –33.8 dBc @ ±5 MHz offset: Meets stringent adjacent channel emission limits for 3GPP FDD Band 3 (1805–1880 MHz).

Pinout & Package

Package: OM-1230-4L2S - overmolded plastic, exposed source paddle, 6-pin surface-mount configuration. Thermal path optimized via direct die attach to copper leadframe.

Pin/Terminal Circuit Role Design Meaning
1 - RFinA/VGSA Carrier transistor gate input DC-coupled RF input for carrier amplifier; requires external bias network per Table 7 design values.
2 - VBWA(2) Carrier-side bias voltage terminal Not for VDD supply; used only for bias adjustment; device cannot operate if VDD is applied here.
3 - RFoutA/VDSA Carrier transistor drain output RF output node for carrier path; internally matched to 50 Ω system impedance.
4 - RFoutB/VDSB Peaking transistor drain output RF output node for peaking path; shares common source with Pin 1 and Pin 3.
5 - RFinB/VGSB Peaking transistor gate input DC-coupled RF input for peaking amplifier; biased at 0.25 Vdc for Class C operation.
6 - VBWB(2) Peaking-side bias voltage terminal Not for VDD supply; used only for bias adjustment; device cannot operate if VDD is applied here.

Key Features

Feature Design Value
Asymmetrical Doherty Architecture Enables >48% efficiency at 87 W avg. output across 75 MHz bandwidth - critical for energy-efficient macrocell deployment.
High Thermal Conductivity Packaging 0.23 °C/W RθJC allows direct mounting to heatsink without thermal interface material degradation over lifetime.
Digital Predistortion Compatibility Linearized AM/PM response (–21° max) and stable ACPR enable effective DPD correction in real-time FPGA-based systems.
Wide Instantaneous Bandwidth Gain flatness of 1.4 dB over 75 MHz at Pout = 87 W supports multi-carrier LTE and carrier aggregation without re-tuning.
Robust Mismatch Tolerance Survives 10:1 VSWR at full CW power - eliminates need for external circulators or isolators in outdoor base station deployments.

Applications

Macrocell Base Station PA Multi-Band LTE Remote Radio Head

Use Scenario: High-power final stage in 1800 MHz FDD Band 3 macrocell transceivers handling up to 20 MHz LTE channels.

IC Role / Device Role / Timing Role: Dual-path Doherty RF power transistor delivering 87 W avg. output with digital predistortion support.

Use Value: Achieves 48.4% drain efficiency at 1880 MHz - reducing cooling requirements and OPEX in large-scale deployments.

Use Scenario: Compact, air-cooled RRH unit covering 1805–1880 MHz with integrated DPD and envelope tracking.

IC Role / Device Role / Timing Role: Asymmetrical Doherty transistor enabling wide instantaneous bandwidth without external matching.

Use Value: 1.4 dB gain flatness over 75 MHz allows single-unit coverage of entire Band 3 - eliminating band-splitting hardware.

W-CDMA Node B Final Amplifier 5G NR Sub-6 GHz Pre-Massive MIMO PA

Use Scenario: Final amplifier stage in 3G UMTS Node B systems requiring high PAR handling and low ACPR.

IC Role / Device Role / Timing Role: RF power LDMOS transistor operating in Doherty mode with 9.9 dB input PAR compression.

Use Value: –33.8 dBc ACPR at ±5 MHz offset meets 3GPP TS 25.104 spectral mask requirements without additional filtering.

Use Scenario: Pre-massive MIMO active antenna unit where high-efficiency, broadband PA reduces per-channel power consumption.

IC Role / Device Role / Timing Role: High-linearity Doherty transistor supporting 5G NR FR1 signals with 100 MHz channel bandwidth.

Use Value: 589 W P3dB output enables headroom for dynamic 5G burst transmission while maintaining <–32 dBc ACPR.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MRF6V2150N Single-ended 150 W LDMOS; no integrated Doherty architecture; 1805–2200 MHz range; lower efficiency (42%) at 1880 MHz. Requires external Doherty combiner and separate biasing; suited for legacy amplifier redesigns rather than new Doherty-integrated designs. Select when retrofitting existing single-ended PA layouts or when wider frequency coverage (up to 2200 MHz) is required.
AFM905S Gallium nitride (GaN) HEMT; 90 W avg.; 1805–2200 MHz; higher gain (17.5 dB); 0.19 °C/W RθJC; no internal Doherty topology. Higher voltage operation (50 V), greater thermal margin, but requires full GaN-specific gate bias and protection circuitry. Select for next-generation systems prioritizing power density and thermal headroom over cost-sensitive LDMOS compatibility.

Compared with MRF6V2150N and AFM905S, A2T18H455W23NR6 provides integrated asymmetrical Doherty functionality, eliminating external combiner losses and simplifying layout - delivering 48.4% efficiency at 87 W within a proven LDMOS process with mature reliability data.

Availability

A2T18H455W23NR6 is available at Aetrix Electronics and suitable for macrocell base station PA, remote radio head (RRH), W-CDMA Node B, and 5G sub-6 GHz pre-massive MIMO applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for A2T18H455W23NR6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communications markets, with deep expertise in RF power technologies inherited from Freescale.

A2T18H455W23NR6 belongs to the Airfast RF Power LDMOS family, engineered specifically for energy-efficient, broadband cellular infrastructure amplifiers operating in licensed spectrum bands from 700 MHz to 3.8 GHz.

FAQ

What is the maximum continuous drain current rating for A2T18H455W23NR6?

The A2T18H455W23NR6 does not specify a maximum continuous drain current in absolute terms. Instead, it defines operational limits by quiescent current: IDQA = 1080 mA for the carrier side under typical W-CDMA test conditions (VDD = 31.5 Vdc). The device's safe operating area is governed by VDSS (–0.5 to +65 Vdc), TJ (–40 to +225 °C), and thermal resistance (0.23 °C/W), not a fixed IDC rating. Always refer to the SOA curves in the official datasheet for pulsed and CW boundary conditions.

Can A2T18H455W23NR6 be used in a symmetrical Doherty configuration?

No - A2T18H455W23NR6 is explicitly designed and characterized for asymmetrical Doherty operation, with distinct carrier (Side A) and peaking (Side B) transistor parameters. Its internal layout, biasing requirements (e.g., VGSB = 0.25 Vdc), and load-pull data assume asymmetry. Using it in a symmetrical configuration would violate the specified operating conditions and invalidate published performance metrics like 48.4% efficiency and –33.8 dBc ACPR.

What is the recommended PCB material and thickness for A2T18H455W23NR6 evaluation?

The reference design in Table 7 specifies Rogers RO4350B laminate with 0.020″ thickness (0.508 mm) and εr = 3.66. This material provides optimal RF performance, thermal stability, and controlled impedance for the 1805–1880 MHz band. Use of alternative substrates (e.g., FR-4) will degrade gain flatness, ACPR, and thermal dissipation - especially above 50 W average output - and is not validated for A2T18H455W23NR6.

Does A2T18H455W23NR6 require external input/output matching networks?

No - A2T18H455W23NR6 is internally matched on both input and output for 50 Ω systems across 1805–1880 MHz, as confirmed in Table 6 footnote 2 and Figure 1 layout. External matching is unnecessary for baseline operation; however, fine-tuning networks may be added for specific linearity or efficiency targets, as demonstrated in the load-pull data (Tables 8–11).

What is the ESD sensitivity classification for A2T18H455W23NR6?

A2T18H455W23NR6 is rated Class 2 per JESD22-A114 (Human Body Model), Class B per JESD22-A115 (Machine Model), and Class IV per JESD22-C101 (Charge Device Model). These ratings indicate moderate robustness - sufficient for standard handling with grounded wrist straps and ESD-safe workstations, but insufficient for direct unshielded board-level probing without current-limiting series resistors.

A2T18H455W23NR6 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
OM-1230-4L2S
Packaging:
Bulk
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
N-Channel
Frequency:
1.805GHz ~ 1.88GHz
Gain:
14.5dB
Voltage - Test:
31.5 V
Current Rating (Amps):
10µA
Noise Figure:
-
Current - Test:
1.08 A
Power - Output:
87W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
OM-1230-4L2S

A2T18H455W23NR6 FAQ

1.How can I place an order for A2T18H455W23NR6 through Aetrix?

Please submit a Request for Quotation (RFQ) for A2T18H455W23NR6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of A2T18H455W23NR6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for A2T18H455W23NR6 is usually 5 days.

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A2T18H455W23NR6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your A2T18H455W23NR6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for A2T18H455W23NR6?

For technical support, including A2T18H455W23NR6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your A2T18H455W23NR6 requirements.

6.How does Aetrix verify that A2T18H455W23NR6 is sourced from the original manufacturer or authorized distributors?

All A2T18H455W23NR6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that A2T18H455W23NR6 meets industry standards.

7.What is the process for return or replacement of A2T18H455W23NR6?

All A2T18H455W23NR6 units undergo pre-shipment inspection (PSI). If there is an issue with A2T18H455W23NR6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The A2T18H455W23NR6 part is unused and in its original packaging.

Return procedure for A2T18H455W23NR6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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