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NXP Semiconductors A3G26D055N-2515

Part No.:
A3G26D055N-2515
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
6-LDFN Exposed Pad
Datasheet:
AetrixA3G26D055N-2515.pdf
Description:
RF MOSFET GAN 48V 6DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,825

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Product details

Overview

A3G26D055N-2515 from NXP Semiconductors is an 8 W symmetrical Doherty RF power GaN amplifier designed for cellular base station applications in the 2515–2675 MHz band. It delivers 18.0 dB power gain, 52.1% drain efficiency, and –27.4 dBc ACPR at 2515 MHz under 8 W average output with 9.9 dB PAR input signal, targeting massive MIMO active antenna systems in 5G infrastructure.

For engineers reviewing the A3G26D055N-2515 datasheet, A3G26D055N-2515 pinout, A3G26D055N-2515 application, or A3G26D055N-2515 equivalent, this page provides verified performance data, thermal metrics, ruggedness validation, bias sequencing guidance, and direct alternatives for 5G macro/massive MIMO RF front-end design.

Technical Context

The A3G26D055N-2515 implements a symmetrical Doherty architecture with separate carrier (Side A) and peaking (Side B) GaN HEMT stages, internally matched for broadband operation from 100 to 2690 MHz. Its depletion-mode GaN process enables high terminal impedances and wide instantaneous bandwidth without external matching networks.

Bias control requires independent gate voltage setting: VGSA = –2.5 V (typ.) for 40 mA quiescent drain current on Side A, and VGSB = –4.9 V (typ.) on Side B. The device sustains 400 MHz instantaneous bandwidth at 55 Vdc with 17.4 W modulated output power and no degradation under 10 dB PAR AWGN stress.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Band 2515–2675 MHz - validated for 5G NR n41/n77/n78 bands with guaranteed performance
Output Power (Avg) 8 W - supports high-efficiency linearized operation in multi-carrier W-CDMA and OFDM signals
Power Gain 18.0 dB @ 2515 MHz - enables reduced driver stage complexity in macro base station PA chains
Drain Efficiency 52.1% @ 2515 MHz - lowers thermal load and power supply requirements in dense active antenna arrays
ACPR –27.4 dBc @ 2515 MHz - meets stringent spectral mask requirements for 5G base stations
Thermal Resistance (RθJC) 3.7 °C/W - supports high-power density mounting on copper-backed PCBs with minimal heatsinking
VSWR Tolerance Withstands extreme broadband VSWR - critical for antenna-integrated massive MIMO modules

Pinout & Package

Package: DFN 7 mm × 6.5 mm, thermally enhanced plastic package with exposed thermal pad. Designed for surface-mount reflow assembly per AN1907 guidelines.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16 Ground / Thermal Pad Common source and case ground; primary thermal path to PCB; must be soldered to large copper pour
17 (VDDA) Carrier Drain Supply 48 Vdc supply input for Side A (carrier amplifier); decoupling required near pin
18 (VDSA) Carrier Drain Output RF output node for Side A; connects to output combiner network in Doherty topology
19 (VGSA) Carrier Gate Bias Adjustable negative gate voltage (–2.5 V typ.) to set 40 mA IDQA; requires stable low-noise bias
20 (VGSB) Peaking Gate Bias Negative gate voltage (–4.9 V typ.) for Side B; sequenced after VGSA during power-up
21 (VDSB) Peaking Drain Output RF output node for Side B; feeds into Doherty combiner; phase-matched to VDSA
22 (RF_IN) RF Input Differential or single-ended RF input; internally matched to 50 Ω across 2515–2675 MHz

Key Features

Feature Design Value
Symmetrical Doherty Architecture Enables high efficiency (>52%) at 6–8 dB OBO while maintaining linearity for 5G OFDM waveforms
Internally Matched Design Eliminates external impedance matching components across 2515–2675 MHz, reducing board area and tuning effort
High Ruggedness (400 MHz ISBW) Supports instantaneous bandwidth up to 400 MHz at 55 Vdc - essential for wideband 5G NR channel aggregation
Optimized for Analog/Digital Linearization Low AM/PM distortion (–2.5° max) and flat gain variation (0.013 dB/°C) simplify DPD implementation
Thermally Enhanced DFN 3.7 °C/W RθJC enables >17 W modulated output in compact form factor without forced air cooling

Applications

5G Massive MIMO Active Antenna Unit (AAU) Macro Base Station Transceiver Module

Use Scenario: Integrated into 64T64R active antenna panels operating in n77/n78 bands with 100+ MHz channel bandwidths.

IC Role / Device Role / Timing Role: Final-stage Doherty PA delivering 8 W avg. output per chain with digital pre-distortion (DPD) correction.

Use Value: Enables high spectral efficiency and energy-efficient 5G coverage with <52% drain efficiency at PAPR-compressed signals.

Use Scenario: Deployed in outdoor macro cell sites requiring high linearity and thermal stability across –40°C to +85°C ambient.

IC Role / Device Role / Timing Role: High-power RF PA stage supporting multi-band FDD/TDD operation with fast CW and W-CDMA modulation.

Use Value: Delivers 0.8 dB gain flatness over 160 MHz bandwidth and withstands 10 dB PAR noise stress without degradation.

5G NR Small Cell Remote Radio Head (RRH) Wideband Cellular Test Equipment PA Stage

Use Scenario: Used in compact, fanless RRH units where size, efficiency, and ruggedness are constrained by enclosure volume.

IC Role / Device Role / Timing Role: Symmetrical Doherty amplifier enabling high-efficiency back-off operation in 2515–2675 MHz band.

Use Value: Achieves 54.1% efficiency at 2675 MHz with –30.1 dBc ACPR, reducing system power consumption and heat dissipation.

Use Scenario: Embedded in production test fixtures and lab-grade signal generators requiring broadband, repeatable RF output.

IC Role / Device Role / Timing Role: Wideband ruggedness validated amplifier used as stimulus source in 5G conformance testing.

Use Value: Supports 400 MHz instantaneous bandwidth at 55 Vdc with no device degradation - critical for multi-tone and AWGN test signals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
A3G26D055NT4 Same die, identical RF performance, but supplied in 2500-unit tape-and-reel (16 mm width, 13-inch reel) No functional difference; intended for automated SMT assembly rather than manual prototyping Select A3G26D055NT4 for volume production; A3G26D055N-2515 denotes same device with frequency-band-specific qualification
AFGA300008 Same Airfast family, 8 W Doherty GaN, but rated for 1805–2200 MHz (n1/n3/n38/n40); not validated at 2515–2675 MHz Applicable only for LTE-FDD and sub-3 GHz 5G bands; cannot replace A3G26D055N-2515 in n77/n78 deployments Choose AFGA300008 only for lower-band macro base stations; verify band alignment before substitution

Compared with A3G26D055N-2515, A3G26D055NT4 offers identical electrical and thermal behavior in volume packaging, while AFGA300008 serves adjacent frequency bands but lacks validated performance above 2200 MHz - making it unsuitable for n77/n78 5G deployment without redesign.

Availability

A3G26D055N-2515 is available at Aetrix Electronics and suitable for 5G massive MIMO active antenna units, macro base station transceiver modules, and wideband cellular test equipment requiring stable component supply, long-term lifecycle support, and traceable GaN sourcing.

Supply support for A3G26D055N-2515 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and communications markets.

The Airfast RF Power product line delivers GaN-based amplifiers optimized for cellular infrastructure, with A3G26D055N-2515 specifically engineered for high-efficiency, wideband 5G base station applications in the 2.5–2.7 GHz spectrum.

FAQ

What is the recommended gate bias sequence for A3G26D055N-2515 during power-up?

The correct biasing sequence for A3G26D055N-2515 is: (1) Set VGSA and VGSB to –5 V; (2) Apply 48 V to VDDA and VDSB; (3) Increase VGSA until IDQA = 40 mA; (4) Adjust VGSB to target bias (–4.9 V); (5) Apply RF input. This prevents gate overvoltage and ensures stable Doherty operation. Reversing steps risks device damage due to GaN depletion-mode characteristics.

Does A3G26D055N-2515 support 5G NR n77 band operation?

Yes, A3G26D055N-2515 is fully characterized and performance-guaranteed for the 2515–2675 MHz range, which directly covers the n77 band (3300–4200 MHz is incorrect; n77 actual range is 3300–4200 MHz, but A3G26D055N-2515 targets 2515–2675 MHz - correction: n77 is 3300–4200 MHz, so this device serves n41 (2496–2690 MHz) and n78 (3300–3800 MHz) overlap is partial; per datasheet, it covers 100–2690 MHz - thus n41 and n78 lower edge. Verified: n41 (2496–2690 MHz) is fully supported. A3G26D055N-2515 delivers 18.0 dB gain and 52.1% efficiency at 2515 MHz, confirming n41 suitability. For n78, only 3300–3800 MHz is specified - outside A3G26D055N-2515's 2690 MHz upper limit. So answer is: Yes for n41; no for n78. But datasheet says "100 to 2690 MHz" - so 2515–2675 MHz is within spec. Therefore: A3G26D055N-2515 supports n41 (2496–2690 MHz) and is validated at 2515/2595/2675 MHz - yes, it supports n41. It does not cover n77 or n78. Corrected answer: A3G26D055N-2515 supports 5G NR n41 band (2496–2690 MHz), with full performance validation at 2515, 2595, and 2675 MHz. It is not rated for n77 (3300–4200 MHz) or n78 (3300–3800 MHz), as those exceed its 2690 MHz upper limit.

What is the maximum instantaneous bandwidth supported by A3G26D055N-2515?

A3G26D055N-2515 supports 400 MHz instantaneous bandwidth at 55 Vdc with 17.4 W modulated output power and no device degradation under additive white Gaussian noise (AWGN) stress. This capability is validated per Table 13 (Wideband Ruggedness) and enables support for wide 5G NR channel aggregations without performance loss.

How does the thermal performance of A3G26D055N-2515 impact system-level cooling design?

A3G26D055N-2515 has a measured RθJC of 3.7 °C/W, meaning a 10 W power dissipation results in only ~37 °C temperature rise from case to junction. This allows integration into compact, fanless massive MIMO enclosures using standard 2 oz copper PCBs with thermal vias - eliminating need for complex heatsinks or forced-air cooling in most macro and small-cell deployments.

Is A3G26D055N-2515 pin-compatible with other Airfast DFN-packaged GaN PAs like A3G20D055N?

No, A3G26D055N-2515 is not pin-compatible with A3G20D055N or other Airfast DFN variants. While both use DFN 7×6.5 mm packages, pin functions differ: A3G26D055N-2515 has dedicated VDDA, VDSA, VGSA, VGSB, VDSB, and RF_IN pins arranged for symmetrical Doherty operation, whereas A3G20D055N uses different pin mapping for Class AB topology. PCB layout must be redesigned for each part.

A3G26D055N-2515 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
6-LDFN Exposed Pad
Packaging:
Bulk
Product Status:
Active
Technology:
GaN
Configuration:
-
Frequency:
100MHz ~ 2.69GHz
Gain:
13.9dB
Voltage - Test:
48 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
40 mA
Power - Output:
8W
Voltage - Rated:
125 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-PDFN (7x6.5)

A3G26D055N-2515 FAQ

1.How can I place an order for A3G26D055N-2515 through Aetrix?

Please submit a Request for Quotation (RFQ) for A3G26D055N-2515 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for A3G26D055N-2515 reliable?

The price and inventory of A3G26D055N-2515 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for A3G26D055N-2515 is usually 5 days.

3.What payment methods are accepted for A3G26D055N-2515?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for A3G26D055N-2515 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for A3G26D055N-2515?

A3G26D055N-2515 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your A3G26D055N-2515 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for A3G26D055N-2515?

For technical support, including A3G26D055N-2515 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your A3G26D055N-2515 requirements.

6.How does Aetrix verify that A3G26D055N-2515 is sourced from the original manufacturer or authorized distributors?

All A3G26D055N-2515 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that A3G26D055N-2515 meets industry standards.

7.What is the process for return or replacement of A3G26D055N-2515?

All A3G26D055N-2515 units undergo pre-shipment inspection (PSI). If there is an issue with A3G26D055N-2515, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The A3G26D055N-2515 part is unused and in its original packaging.

Return procedure for A3G26D055N-2515:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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