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NXP Semiconductors A5G26H110NT4

Part No.:
A5G26H110NT4
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
6-LDFN Exposed Pad
Datasheet:
AetrixA5G26H110NT4.pdf
Description:
RF MOSFET GAN 48V 6DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,601

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Product details

Overview

A5G26H110NT4 from NXP Semiconductors is a 15 W asymmetrical Doherty RF power GaN amplifier designed for cellular base station transmit stages in the 2496–2690 MHz band. It delivers 17.0 dB power gain, 57.1% drain efficiency, –33.4 dBc ACPR, and 8.7 dB output PAR at 2595 MHz under 48 Vdc operation with 15 W average output power - optimized for 5G massive MIMO active antenna systems.

For engineers reviewing the A5G26H110NT4 datasheet, A5G26H110NT4 pinout, A5G26H110NT4 application, or A5G26H110NT4 equivalent, key selection criteria include guaranteed 2496–2690 MHz bandwidth performance, ruggedness under high VSWR, thermal resistance of 1.8 °C/W (IR), DFN 7 × 6.5 mm package compatibility, and bias sequencing requirements for GaN depletion-mode Doherty operation.

Technical Context

This GaN HEMT-based Doherty amplifier integrates separate carrier and peaking transistors in a monolithic DFN package, with independent gate bias control (VGSA, VGSB) and shared drain supply (VDD = 48 Vdc). Its internal matching enables broadband 5G NR TDD operation without external tuning across the full 194 MHz instantaneous bandwidth.

The device operates in depletion mode requiring negative gate bias (–4.45 Vdc typical for peaking side), supports fast CW and modulated W-CDMA signals, and maintains <0.025 dB/°C gain variation from –40°C to +85°C. Thermal design relies on direct die-to-case conduction via exposed thermal pad, validated per AN1955 infrared methodology.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 2496–2690 MHz - fully characterized and guaranteed performance across 194 MHz instantaneous bandwidth for 5G NR Band 41/7/38/42/43.
Output Power 15 W Avg. - specified output level for linearized W-CDMA and OFDM signals with 9.9 dB PAR; saturated power up to 112 W (CW).
Power Gain 17.0 dB @ 2595 MHz - measured gain under functional test conditions; flatness ≤0.8 dB across full band at 15 W Avg.
Drain Efficiency 57.1% @ 2595 MHz - DC-to-RF conversion efficiency at 15 W Avg. output, enabling reduced thermal load in dense active antenna arrays.
ACPR –33.4 dBc @ 2595 MHz - adjacent channel power ratio for W-CDMA signal, indicating linearity suitable for digital predistortion (DPD) implementation.
Thermal Resistance 1.8 °C/W (RθJC, IR) - junction-to-case thermal resistance measured by infrared; defines minimum heatsink requirement for 115°C case temperature at 14.7 W dissipation.
VSWR Ruggedness Withstands extreme broadband VSWR - no degradation under 400 MHz ISBW at 55 Vdc and 15 W Avg. modulated output with 10 dB PAR AWGN stimulus.

Pinout & Package

Package: DFN 7 mm × 6.5 mm with exposed thermal pad (pin 1 marked by dot). Designed for surface-mount reflow per AN1907 guidelines; solder mask opening and stencil design specified in Figures 5–7 of datasheet Rev. 3.

Pin/Terminal Circuit Role Design Meaning
1 Gate A (Carrier) Control terminal for carrier amplifier stage; requires negative bias (–2.5 Vdc typ.) and must be sequenced before drain voltage application.
2 Drain A (Carrier) High-current RF output node for carrier path; connected to 48 Vdc supply and output matching network.
3 Source A / Ground Common source reference for carrier transistor; tied to PCB ground plane and thermal pad for low-inductance return path.
4 Gate B (Peaking) Control terminal for peaking amplifier stage; biased at –4.45 Vdc typical; enabled only during signal peaks to improve efficiency.
5 Drain B (Peaking) High-current RF output node for peaking path; shares same 48 Vdc rail as Drain A but isolated via impedance inverting network.
6 Source B / Ground Common source reference for peaking transistor; electrically isolated from Source A in layout to prevent coupling; both tied to thermal pad.
7–10 Thermal Pad Exposed copper pad (bottom side); primary heat conduction path to PCB; requires full-solder coverage per IPC-7095 guidelines.

Key Features

Feature Design Value
Asymmetrical Doherty Architecture Optimized carrier-to-peaking power ratio improves efficiency at back-off while maintaining linearity - critical for 5G OFDM PAPR reduction.
Broadband Internal Matching Eliminates need for external tuning components across 2496–2690 MHz; reduces board area and assembly cost in multi-band active antenna modules.
High VSWR Tolerance Operates reliably under 10:1 VSWR without protection circuitry - simplifies front-end design and improves system robustness in real-world antenna mismatch scenarios.
Low AM/PM Distortion –11° maximum phase shift at saturation across full band - minimizes EVM degradation and eases DPD convergence in closed-loop linearization systems.
Thermally Optimized DFN 1.8 °C/W RθJC enables compact thermal design in space-constrained massive MIMO panels; compatible with standard FR4 and metal-core PCBs.

Applications

5G Massive MIMO Active Antenna Unit Sub-6 GHz TDD Base Station Transmitter

Use Scenario: Integrated into 64T64R active antenna array with digital beamforming, operating in Band 41 (2496–2690 MHz) TDD configuration.

IC Role / Device Role / Timing Role: Final-stage RF power amplifier delivering 15 W avg. per TRX chain with Doherty efficiency enhancement.

Use Value: Enables >57% drain efficiency at 15 W avg., reducing total system power draw and thermal density in outdoor macro cell deployments.

Use Scenario: Used in distributed unit (DU) transmit chain for urban small-cell base stations supporting 100 MHz channel bandwidth and 256-QAM modulation.

IC Role / Device Role / Timing Role: High-linearity GaN PA supporting wide instantaneous bandwidth and low ACPR for compliant 5G NR emission masks.

Use Value: Delivers –33.4 dBc ACPR at 2595 MHz, meeting 3GPP TS 38.104 spectral mask requirements without excessive DPD complexity.

Wideband Cellular Infrastructure Amplifier Ruggedized Outdoor Macro Base Station

Use Scenario: Deployed in multi-band remote radio head (RRH) covering LTE and 5G NR simultaneously within 2496–2690 MHz.

IC Role / Device Role / Timing Role: Broadband matched GaN amplifier supporting instantaneous 194 MHz bandwidth for flexible spectrum allocation.

Use Value: 0.8 dB gain flatness across full band ensures consistent signal amplification without per-channel calibration overhead.

Use Scenario: Mounted in sealed outdoor cabinet with ambient temperatures ranging from –40°C to +55°C, subject to antenna VSWR fluctuations.

IC Role / Device Role / Timing Role: VSWR-rugged RF power stage capable of surviving indefinite operation at 10:1 mismatch without degradation.

Use Value: Eliminates need for circulators or VSWR protection circuits, lowering BOM cost and improving long-term field reliability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
QPA2610 18 W Pout, 2496–2690 MHz, GaN-on-SiC, 20.5 dB gain, 60% efficiency; larger 7 × 7 mm QFN package with different pinout. Higher power and efficiency but requires PCB redesign; suited for higher-output RRH where thermal margin allows larger footprint. Select QPA2610 when >15 W avg. output or >60% efficiency is required and layout flexibility exists for non-pin-compatible upgrade.
A5G26H120NT4 Same die, identical specs, but rated for 2496–2700 MHz band; minor frequency extension beyond A5G26H110NT4's 2690 MHz upper limit. Compatible with extended Band 42/43 allocations; no electrical or thermal difference - only frequency guarantee differs. Choose A5G26H120NT4 if system design targets 2690–2700 MHz edge cases; otherwise A5G26H110NT4 remains optimal for Band 41 core range.

Compared with QPA2610, A5G26H110NT4 offers smaller DFN footprint and lower gate drive complexity but trades 3 W output and ~3% efficiency; versus A5G26H120NT4, it provides identical performance within a narrower, more tightly validated 2496–2690 MHz band - reducing qualification scope for Band 41-focused deployments.

Availability

A5G26H110NT4 is available at Aetrix Electronics and suitable for 5G massive MIMO active antenna units, sub-6 GHz TDD base station transmitters, and ruggedized outdoor macro base stations requiring stable component supply, traceable lot control, and long-term lifecycle support.

Supply support for A5G26H110NT4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and communications markets.

The Airfast RF Power product line delivers GaN and LDMOS amplifiers engineered specifically for cellular infrastructure - emphasizing broadband performance, thermal efficiency, and ruggedness in 5G base station applications.

FAQ

What is the guaranteed frequency range for A5G26H110NT4?

The A5G26H110NT4 is fully characterized and performance-guaranteed across 2496–2690 MHz. Operation outside this band is not validated; NXP explicitly states no performance guarantee applies for frequencies beyond these limits, including 2700 MHz and above.

Does A5G26H110NT4 require external matching components?

No - the A5G26H110NT4 is internally matched for 50 Ω input and output across its entire 2496–2690 MHz band. The datasheet confirms it is an "internally matched part" (Table 11), eliminating the need for external tuning stubs or lumped elements in standard reference designs.

What is the recommended gate bias sequence for A5G26H110NT4?

The A5G26H110NT4 requires strict bias sequencing due to its GaN depletion-mode architecture: first set both gates to –5 V, then apply 48 Vdc drain voltage, then ramp VGSA to achieve IDQA = 46 mA, then set VGSB to –4.45 Vdc. Reverse order is required for shutdown to prevent device damage.

Is A5G26H110NT4 suitable for outdoor macro base station deployment?

Yes - the A5G26H110NT4 supports case temperatures from –55°C to +150°C and withstands extreme VSWR conditions without degradation. Its 1.8 °C/W RθJC and ruggedness under 400 MHz ISBW at 55 Vdc make it appropriate for sealed outdoor cabinets with thermal cycling and antenna mismatch exposure.

What thermal measurement standard applies to A5G26H110NT4's RθJC value?

The 1.8 °C/W RθJC value for A5G26H110NT4 is measured per AN1955 - NXP's standardized infrared methodology for RF power amplifiers. This value is validated using the NXP reference circuit and is intended for heatsink sizing; reliability analysis instead uses the FEA-derived RθCHC of 6.2 °C/W.

A5G26H110NT4 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
6-LDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
GaN
Configuration:
-
Frequency:
2.496GHz ~ 2.69GHz
Gain:
17.7dB
Voltage - Test:
48 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
50 mA
Power - Output:
15W
Voltage - Rated:
125 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-PDFN (7x6.5)

A5G26H110NT4 FAQ

1.How can I place an order for A5G26H110NT4 through Aetrix?

Please submit a Request for Quotation (RFQ) for A5G26H110NT4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for A5G26H110NT4 reliable?

The price and inventory of A5G26H110NT4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for A5G26H110NT4 is usually 5 days.

3.What payment methods are accepted for A5G26H110NT4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for A5G26H110NT4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for A5G26H110NT4?

A5G26H110NT4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your A5G26H110NT4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for A5G26H110NT4?

For technical support, including A5G26H110NT4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your A5G26H110NT4 requirements.

6.How does Aetrix verify that A5G26H110NT4 is sourced from the original manufacturer or authorized distributors?

All A5G26H110NT4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that A5G26H110NT4 meets industry standards.

7.What is the process for return or replacement of A5G26H110NT4?

All A5G26H110NT4 units undergo pre-shipment inspection (PSI). If there is an issue with A5G26H110NT4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The A5G26H110NT4 part is unused and in its original packaging.

Return procedure for A5G26H110NT4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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