NXP Semiconductors A5G35H110NT4
- Part No.:
- A5G35H110NT4
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- 6-LDFN Exposed Pad
- Datasheet:
-
A5G35H110NT4.pdf
- Description:
- RF MOSFET GAN 48V 6DFN
- Quantity:
- Payment:

- Shipping:

Inventory:5,469
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Product details
Overview
A5G35H110NT4 from NXP Semiconductors is a 15.1 W asymmetrical Doherty RF power GaN amplifier optimized for 5G massive MIMO active antenna systems in cellular base stations. It delivers 15.8 dB gain, 57.6% drain efficiency, and –31.1 dBc ACPR at 3600 MHz under 48 Vdc operation with 70 mA quiescent current on the carrier side.
For engineers reviewing the A5G35H110NT4 datasheet, A5G35H110NT4 pinout, A5G35H110NT4 application, or A5G35H110NT4 equivalent, this device supports wide instantaneous bandwidth (3300–3700 MHz), high VSWR ruggedness, low-complexity linearization, and thermal reliability up to 150°C case temperature - critical for high-density 5G macro and small-cell deployments.
Technical Context
The A5G35H110NT4 implements a dual-path GaN-on-SiC Doherty architecture with separate carrier and peaking transistors, each independently biased via dedicated gate terminals (VGSA, VGSB) and drain supplies (VDSA, VDSB). Its internally matched 50 Ω input/output enables direct integration into reference circuits without external matching networks.
It operates as a depletion-mode amplifier requiring negative gate bias sequencing: VGSA/VGSB must be set to –5 V before applying drain voltage, and gate bias must return to –5 V before draining VDD. Thermal performance is validated using infrared measurement (RθJC = 2.8 °C/W) and finite element analysis (RθCHC = 5.9 °C/W) to ensure channel temperature remains below 225°C under full load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 3300–3700 MHz - fully characterized and guaranteed performance across entire 400 MHz band for 5G n77/n78 bands. |
| Output Power | 15.1 W Avg. - supports high-PAR W-CDMA and OFDM signals at 9.9 dB PAR with 0.01% CCDF probability. |
| Drain Efficiency | 57.6% @ 3300 MHz - reduces thermal load and power supply demand in densely packed active antenna modules. |
| ACPR | –31.1 dBc @ 3600 MHz - meets stringent spectral mask requirements for 5G NR base station transmission. |
| Gain | 15.8 dB @ 3500/3600 MHz - provides stable small-signal amplification across full band with ≤0.4 dB flatness over 200 MHz. |
| Thermal Resistance | RθJC = 2.8 °C/W - enables high-power operation with standard heatsink interfaces in compact DFN 7 × 6.5 mm package. |
| VSWR Ruggedness | Withstands extreme broadband VSWR - validated with AWGN signal at 10 dB PAR and 400 MHz ISBW at 55 Vdc. |
Pinout & Package
Package: DFN 7 mm × 6.5 mm, thermally enhanced plastic package with exposed thermal pad (bottom-side solderable). Compliant with MSL Level 3 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground Reference | Common source and substrate connection for both carrier and peaking paths; requires low-inductance PCB grounding to thermal pad. |
| VDSA | Carrier Drain Supply | 48 Vdc supply input for carrier transistor; decoupling capacitor placement critical for stability at >3 GHz. |
| VDSB | Peaking Drain Supply | Independent 48 Vdc supply for peaking transistor; enables precise power tracking and efficiency optimization. |
| VGSA | Carrier Gate Bias | Negative gate control (–4.1 Vdc typical) for carrier path; requires low-noise bias network to minimize AM/PM distortion. |
| VGSB | Peaking Gate Bias | Negative gate control (–4.1 Vdc typical) for peaking path; bias sequencing must follow strict ON/OFF protocol. |
| RF_IN | Input RF Port | 50 Ω matched single-ended input; internally matched - no external matching required for 3300–3700 MHz band. |
| RF_OUT | Output RF Port | 50 Ω matched single-ended output; capable of delivering 15.1 W avg. into 50 Ω load with <0.4 dB gain variation. |
Key Features
| Feature | Design Value |
|---|---|
| Asymmetrical Doherty Architecture | Optimizes efficiency vs. linearity trade-off for 5G OFDM signals by allocating different power ratios between carrier and peaking paths. |
| High Terminal Impedances | Enables broadband impedance transformation without external matching components, simplifying PCB layout and reducing BOM count. |
| Wideband Ruggedness | Validated under 400 MHz instantaneous bandwidth noise excitation at 55 Vdc - ensures field reliability in unpredictable RF environments. |
| Low-Complexity Linearization Support | Delivers improved EVM with next-generation digital predistortion (DPD) algorithms, reducing FPGA resource usage in baseband units. |
| Massive MIMO Optimized | Compact DFN package and thermal design support high-density integration into multi-element active antenna arrays with shared cooling. |
Applications
| 5G Massive MIMO Active Antenna Unit (AAU) | Macro Base Station Transceiver Module |
|---|---|
Use Scenario: Integrated into 64T64R or 128T128R active antenna panels operating in n77/n78 bands. IC Role / Device Role / Timing Role: Final-stage RF power amplifier for individual TRX chains, delivering 15.1 W avg. output per chain. Use Value: Enables high-efficiency, high-linearity transmission with minimal thermal footprint - critical for air-cooled outdoor AAUs. |
Use Scenario: Used in centralized radio units (CRUs) or distributed units (DUs) for urban macro cell coverage. IC Role / Device Role / Timing Role: High-power driver stage in multi-carrier FDD/TDD configurations supporting 100+ MHz channel bandwidths. Use Value: Delivers consistent 15.8 dB gain and <0.4 dB gain flatness across 3300–3700 MHz - simplifies wideband DPD calibration. |
| Small-Cell Outdoor Base Station | Private 5G Network Infrastructure |
Use Scenario: Deployed in street-level small cells serving enterprise campuses or dense urban zones. IC Role / Device Role / Timing Role: Primary PA in compact, fanless enclosures where thermal headroom is constrained. Use Value: RθJC = 2.8 °C/W allows continuous operation at 48 Vdc/70 mA IDQA without forced cooling - lowers system cost and noise. |
Use Scenario: Embedded in private 5G infrastructure for industrial automation, smart ports, or logistics hubs. IC Role / Device Role / Timing Role: High-reliability RF PA for mission-critical uplink/downlink links requiring robust VSWR tolerance. Use Value: Withstands >20:1 VSWR under modulated conditions - prevents shutdown during antenna detuning or environmental interference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| A5G35H110NT1 | Same die, T1 suffix = 500-unit tape-and-reel; identical electrical specs and thermal performance. | No functional difference - only packaging quantity differs; not suitable for high-volume production runs requiring 2500-unit reels. | Select A5G35H110NT4 for volume manufacturing; use T1 only for prototyping or low-volume qualification. |
| A5G35H110NT2 | Same die, T2 suffix = 1000-unit tape-and-reel; identical RF performance, biasing, and thermal characteristics. | Same application scope but lower reel count increases handling frequency and potential for moisture exposure in MSL Level 3 environment. | Prefer A5G35H110NT4 for automated SMT lines with long run times; T2 suits mid-volume pilot builds. |
Compared with A5G35H110NT1 and A5G35H110NT2, the A5G35H110NT4 offers optimal logistics alignment for high-throughput 5G base station production - its 2500-unit reel minimizes changeover frequency, reduces moisture sensitivity risk per unit, and improves traceability in large-scale BOM management.
Availability
A5G35H110NT4 is available at Aetrix Electronics and suitable for 5G massive MIMO active antenna units, macro base station transceiver modules, and outdoor small-cell deployments requiring stable component supply, extended lifecycle support, and full MSL-compliant handling.
Supply support for A5G35H110NT4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communications markets, with core expertise in RF power, secure edge processing, and automotive radar.
The A5G35H110NT4 belongs to NXP's Airfast RF Power portfolio, engineered specifically for energy-efficient, thermally robust, and spectrally clean 5G base station amplification - targeting massive MIMO, macro, and small-cell infrastructure.
FAQ
What is the recommended gate bias sequence for safe operation of the A5G35H110NT4?
The A5G35H110NT4 requires strict gate bias sequencing due to its GaN depletion-mode architecture. Before applying drain voltage, set both VGSA and VGSB to –5 V. Then ramp VDSA and VDSB to +48 Vdc, followed by adjusting VGSA to achieve 70 mA IDQA, then setting VGSB to target bias. To power down, first remove RF input, return gates to –5 V, then discharge drains to 0 V. This prevents gate overvoltage and thermal runaway. The A5G35H110NT4 datasheet specifies this sequence in Section "Correct biasing sequence for GaN depletion mode amplifiers in a Doherty Configuration".
Does the A5G35H110NT4 require external impedance matching networks?
No, the A5G35H110NT4 is internally matched to 50 Ω at both input and output across 3300–3700 MHz, eliminating the need for external matching components in standard reference designs. This is confirmed in Table 11 ("Functional tests") and Section 12.4 ("Typical performance"), which report measured performance using the NXP Doherty Reference Circuit without added matching. However, system-level board layout - especially ground plane integrity and thermal pad soldering - remains critical to maintain specified gain, efficiency, and ACPR. The A5G35H110NT4 achieves this through high terminal impedances optimized for broadband operation.
What is the maximum allowable case temperature for continuous operation of the A5G35H110NT4?
The A5G35H110NT4 supports continuous operation with a case temperature (TC) range of –55°C to +150°C, as defined in Table 4 ("Limiting values"). Its thermal resistance RθJC is 2.8 °C/W (infrared measurement), enabling reliable operation at full 15.1 W average output power when mounted on a properly designed heatsink. The maximum channel temperature is limited to 225°C (Table 4), and RθCHC (FEA) = 5.9 °C/W must be used for reliability modeling. The A5G35H110NT4's thermal performance is validated per AN1955 and supports deployment in uncooled outdoor base station enclosures.
How does the A5G35H110NT4 support digital predistortion (DPD) linearization?
The A5G35H110NT4 delivers improved linearized error vector magnitude (EVM) with next-generation DPD algorithms, as stated in Section 2 ("Features and benefits"). Its asymmetrical Doherty architecture, combined with high terminal impedances and low AM/PM distortion (–6° max across 3400–3600 MHz), reduces DPD complexity and convergence time. Measured ACPR of –31.1 dBc at 3600 MHz under W-CDMA conditions confirms strong out-of-band suppression - a key enabler for efficient DPD implementation. The A5G35H110NT4 thus lowers FPGA resource requirements and improves overall transmitter linearity in 5G baseband units.
Is the A5G35H110NT4 suitable for non-5G applications such as WiMAX or LTE-TDD?
The A5G35H110NT4 is characterized and performance-guaranteed exclusively for 3300–3700 MHz operation, aligning with 5G NR n77/n78 bands. While its 400 MHz instantaneous bandwidth may appear applicable to legacy LTE-TDD (Band 42/43) or WiMAX, NXP explicitly states in Section 1 ("General description") that "there is no guarantee of performance when this part is used in applications designed outside of these frequencies." Therefore, the A5G35H110NT4 should not be selected for non-5G systems without full system-level validation - its bias points, gain profile, and linearity are optimized for 5G OFDM waveforms and cannot be assumed compatible with other modulation schemes or frequency plans.
A5G35H110NT4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 6-LDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- GaN
- Configuration:
- -
- Frequency:
- 3.3GHz ~ 3.7GHz
- Gain:
- 15.3dB
- Voltage - Test:
- 48 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 70 mA
- Power - Output:
- 15.1W
- Voltage - Rated:
- 125 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-PDFN (7x6.5)
A5G35H110NT4 FAQ
1.How can I place an order for A5G35H110NT4 through Aetrix?
Please submit a Request for Quotation (RFQ) for A5G35H110NT4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for A5G35H110NT4 reliable?
The price and inventory of A5G35H110NT4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for A5G35H110NT4 is usually 5 days.
3.What payment methods are accepted for A5G35H110NT4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for A5G35H110NT4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for A5G35H110NT4?
A5G35H110NT4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your A5G35H110NT4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for A5G35H110NT4?
For technical support, including A5G35H110NT4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your A5G35H110NT4 requirements.
6.How does Aetrix verify that A5G35H110NT4 is sourced from the original manufacturer or authorized distributors?
All A5G35H110NT4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that A5G35H110NT4 meets industry standards.
7.What is the process for return or replacement of A5G35H110NT4?
All A5G35H110NT4 units undergo pre-shipment inspection (PSI). If there is an issue with A5G35H110NT4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The A5G35H110NT4 part is unused and in its original packaging.
Return procedure for A5G35H110NT4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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