NXP Semiconductors A5G38H045N-3700
- Part No.:
- A5G38H045N-3700
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- 6-LDFN Exposed Pad
- Datasheet:
-
A5G38H045N-3700.pdf
- Description:
- RF MOSFET 6DFN
- Quantity:
- Payment:

- Shipping:

Inventory:6,115
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
A5G38H045N-3700 from NXP Semiconductors is an asymmetrical Doherty RF power amplifier based on GaN-on-SiC technology, designed for 5G massive MIMO active antenna systems operating in the 3400–4000 MHz band. It delivers 5.4 W average output power with 15.5 dB power gain and 52.0% drain efficiency at 3700 MHz under 48 Vdc bias, supporting wide instantaneous bandwidth and high VSWR ruggedness.
For engineers reviewing the A5G38H045N-3700 datasheet, A5G38H045N-3700 pinout, A5G38H045N-3700 application, or A5G38H045N-3700 equivalent, this device is selected for cellular base station transmit chains requiring broadband linearity, thermal robustness up to +150°C case temperature, and compatibility with low-complexity digital pre-distortion (DPD) systems.
Technical Context
The A5G38H045N-3700 implements a two-stage GaN Doherty architecture with separate carrier and peaking transistors, biased at VDD = 48 Vdc, IDQA = 35 mA, and VGSB = –4.2 Vdc. Its internal matching enables 50 Ω system operation without external impedance tuning across 3700–3980 MHz.
It supports wideband modulated signals including W-CDMA and OFDM with 9.9 dB PAR, achieving –29.1 dBc ACPR at 3700 MHz and <1.4 dB gain flatness over 280 MHz bandwidth. Thermal design relies on RθJC (IR) = 5.1 °C/W to manage channel temperatures up to 225°C under full load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 3400–4000 MHz - guaranteed performance band for 5G NR n78/n79 deployments |
| Avg. Output Power | 5.4 W @ 3700–3980 MHz - sufficient for 64T64R massive MIMO subarray transmit stages |
| Power Gain | 15.5 dB at 3700 MHz - reduces driver stage complexity in multi-stage PA architectures |
| Drain Efficiency | 52.0% at 3700 MHz - lowers thermal load and power supply requirements in dense RF front-ends |
| ACPR | –29.1 dBc at 3700 MHz - meets 3GPP ACLR requirements for 20 MHz LTE/5G NR channels |
| VSWR Ruggedness | Withstands extreme broadband VSWR - enables stable operation without circulators in compact antenna-integrated designs |
| Thermal Resistance | RθJC (IR) = 5.1 °C/W - supports PCB-level thermal management with standard copper pour and vias |
Pinout & Package
Package: DFN 7 mm × 6.5 mm, thermally enhanced plastic package with exposed thermal pad. Designed for surface-mount reflow assembly per AN1907 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference and thermal sink | Multiple pins tied to exposed die paddle - must be soldered to large PCB copper area for thermal conduction |
| VDDA / VDDB | Drain supply for carrier and peaking transistors | Separate high-current paths enable independent decoupling and reduce inter-stage coupling |
| VGSA / VGSB | Gate bias inputs for carrier and peaking transistors | Depletion-mode GaN requires negative gate voltage; precise sequencing required per datasheet procedure |
| RF_IN | Differential or single-ended RF input | Internally matched to 50 Ω - eliminates need for external input matching network |
| RF_OUT | Single-ended RF output | Internally matched to 50 Ω - directly interfaces with filter or antenna coupler without tuning |
Key Features
| Feature | Design Value |
|---|---|
| Asymmetrical Doherty architecture | Optimized carrier-to-peaking power ratio improves back-off efficiency in 5G bursty traffic profiles |
| High terminal impedances | Enables broadband matching without lossy components - preserves signal integrity across 600 MHz bandwidth |
| Wideband ruggedness | Validated at 400 MHz ISBW and 12 W avg. modulated output - supports flexible frequency planning in shared spectrum |
| Low AM/PM distortion | –12° maximum at saturation - reduces DPD complexity and improves EVM in high-order QAM waveforms |
| ESD protection | HBM Class 1A (≥500 V), CDM Class C3 - withstands handling and board-level ESD events in production environments |
Applications
| 5G Massive MIMO Active Antenna | Sub-6 GHz Macro Base Station |
|---|---|
|
Use Scenario: Integrated into 64-element active antenna array with integrated beamforming ICs and T/R modules. IC Role / Device Role / Timing Role: Final-stage RF power amplifier delivering 5.4 W avg. output per chain in 3700–3980 MHz band. Use Value: High drain efficiency (52%) and thermal robustness (TC = –55 to +150°C) enable air-cooled, fanless outdoor deployment. |
Use Scenario: Used in remote radio head (RRH) transmit path for urban macro cells covering 3400–4000 MHz licensed spectrum. IC Role / Device Role / Timing Role: High-linearity Doherty PA supporting 100 MHz 5G NR carriers with 9.9 dB PAR. Use Value: –29.1 dBc ACPR at 3700 MHz meets 3GPP ACLR-1 and ACLR-2 mask requirements without additional filtering. |
| Private 5G Network Infrastructure | Fixed Wireless Access (FWA) CPE |
|
Use Scenario: Deployed in enterprise-grade private 5G base stations for industrial automation and smart factory applications. IC Role / Device Role / Timing Role: Transmit amplifier in compact, low-power-consumption base station unit operating in n78 band. Use Value: Internal 50 Ω matching eliminates discrete matching components - reduces BOM count and layout area by >30%. |
Use Scenario: Embedded in customer premises equipment (CPE) for 5G FWA delivering multi-Gbps downlink to homes and SMEs. IC Role / Device Role / Timing Role: High-efficiency final-stage PA enabling extended range and improved link budget in outdoor rooftop units. Use Value: Withstands 10:1 VSWR across band - tolerates antenna mismatch due to environmental changes or installation variance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| A5G38H045NT4 | Same die, identical electrical specs; differs only in tape-and-reel packaging (2500 units, 16 mm tape) | No functional difference - used interchangeably in automated SMT lines | Select A5G38H045NT4 for high-volume production; A5G38H045N-3700 denotes same device with frequency-band suffixing convention |
| AFGA38H045H | Same Airfast family, but optimized for 3300–3800 MHz; 0.5 dB lower gain at 3700 MHz, 49% efficiency | Narrower bandwidth - less suitable for full n78 coverage up to 4000 MHz | Choose A5G38H045N-3700 when full 3400–4000 MHz operation with guaranteed specs is required |
Compared with A5G38H045NT4 (identical functionality, packaging-only variant) and AFGA38H045H (narrower band, lower efficiency), the A5G38H045N-3700 provides verified 3400–4000 MHz performance with highest gain and efficiency in its class-critical for maximizing spectral reuse and minimizing cooling overhead in dense 5G deployments.
Availability
A5G38H045N-3700 is available at Aetrix Electronics and suitable for 5G massive MIMO active antennas, sub-6 GHz macro base stations, and private network infrastructure requiring stable component supply, long-term lifecycle support, and traceable GaN sourcing.
Supply support for A5G38H045N-3700 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and communications markets.
The A5G38H045N-3700 belongs to NXP's Airfast RF Power portfolio, engineered specifically for energy-efficient, thermally robust, and digitally linearizable GaN amplifiers targeting 5G base station infrastructure.
FAQ
What is the guaranteed frequency range for A5G38H045N-3700?
The A5G38H045N-3700 is characterized and performance-guaranteed across 3400–4000 MHz, aligning with 3GPP n78 and n79 bands. Operation outside this range is not validated, and no performance specifications apply beyond these limits. All typical data-including gain, efficiency, and ACPR-is measured within this band using NXP's reference circuit.
Does A5G38H045N-3700 require external matching networks?
No, the A5G38H045N-3700 is internally matched to 50 Ω at both RF_IN and RF_OUT ports. This eliminates the need for external input/output matching components, reducing PCB area, BOM cost, and tuning effort. Matching is validated across the full 3400–4000 MHz band per NXP's reference design.
What is the recommended gate bias sequence for A5G38H045N-3700?
The A5G38H045N-3700 requires strict gate bias sequencing due to its depletion-mode GaN process. First set VGSA and VGSB to –5 V, then apply VDDA/VDDB = 48 Vdc, then ramp VGSA to achieve IDQA = 35 mA, then set VGSB to target bias (e.g., –4.2 Vdc). Reverse order during shutdown. Failure to follow this sequence risks device damage.
How does A5G38H045N-3700 handle high VSWR conditions?
The A5G38H045N-3700 is designed to withstand extremely high output VSWR across its operating band, validated per wideband ruggedness testing (Table 12). It sustains 400 MHz instantaneous bandwidth at 12 W avg. output under 55 Vdc without degradation-enabling direct antenna interface in compact, circulator-free designs common in active antenna systems.
What thermal management is required for A5G38H045N-3700?
The A5G38H045N-3700 has RθJC (IR) = 5.1 °C/W and requires solid thermal connection via its exposed paddle to ≥4 cm² of 2 oz copper with ≥9 thermal vias (0.3 mm diameter, 0.8 mm pitch). PCB layout must follow NXP's DFN 7×6.5 guidelines (Figures 5–7) to maintain TC ≤ +150°C under full 5.4 W avg. load at ambient +85°C.
A5G38H045N-3700 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 6-LDFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- -
- Configuration:
- -
- Frequency:
- -
- Gain:
- -
- Voltage - Test:
- -
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- -
- Power - Output:
- 5W
- Voltage - Rated:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-PDFN (7x6.5)
A5G38H045N-3700 FAQ
1.How can I place an order for A5G38H045N-3700 through Aetrix?
Please submit a Request for Quotation (RFQ) for A5G38H045N-3700 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for A5G38H045N-3700 reliable?
The price and inventory of A5G38H045N-3700 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for A5G38H045N-3700 is usually 5 days.
3.What payment methods are accepted for A5G38H045N-3700?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for A5G38H045N-3700 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for A5G38H045N-3700?
A5G38H045N-3700 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your A5G38H045N-3700 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for A5G38H045N-3700?
For technical support, including A5G38H045N-3700 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your A5G38H045N-3700 requirements.
6.How does Aetrix verify that A5G38H045N-3700 is sourced from the original manufacturer or authorized distributors?
All A5G38H045N-3700 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that A5G38H045N-3700 meets industry standards.
7.What is the process for return or replacement of A5G38H045N-3700?
All A5G38H045N-3700 units undergo pre-shipment inspection (PSI). If there is an issue with A5G38H045N-3700, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The A5G38H045N-3700 part is unused and in its original packaging.
Return procedure for A5G38H045N-3700:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
A5G38H045N-3700 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
