NXP Semiconductors A5M36TG140TC-EVB

Overview

A5M36TG140TC-EVB from NXP is an evaluation board for the A5M36TG040-TC top-side cooling RF power amplifier module, designed for 3.3–3.8 GHz 5G massive MIMO active antenna systems, delivering 40.2 dBm average output power, 30.7 dB gain, and 46.6% efficiency at 9.3 dB OBO with dual supply (5 V / 48 V).

For engineers reviewing the A5M36TG140TC-EVB datasheet, A5M36TG140TC-EVB pinout, A5M36TG140TC-EVB application, or A5M36TG140TC-EVB equivalent, this board enables rapid characterization of thermal management, RF performance, and system integration of NXP's top-side cooled GaN/LDMOS hybrid PA modules in mMIMO radio front-ends.

Technical Context

The A5M36TG140TC-EVB implements a complete test platform for the A5M36TG040-TC module, featuring matched input/output RF interfaces (SMA), dual regulated DC supplies (5 V control logic + 48 V PA drain), and thermally optimized PCB layout with integrated thermal interface material (TIM) and heatsink mounting provisions aligned to top-side cooling architecture.

It supports full RF characterization across 3400–3800 MHz, including gain flatness, ACLR, EVM, and thermal derating validation under real-world drive conditions-enabling verification of the module's wideband linearity and thermal resistance reduction versus conventional bottom-side cooled radios.

Key Specifications

Availability

A5M36TG140TC-EVB is available at Aetrix Electronics and suitable for 5G mMIMO active antenna development, outdoor small cell RF front-end validation, and Open RAN radio unit prototyping requiring stable component supply and documented thermal/mechanical reference designs.

Supply support for A5M36TG140TC-EVB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, IoT, and communications infrastructure markets.

The A5M36TG140TC-EVB belongs to NXP's Top-Side Cooling Evaluation Board family, developed specifically to accelerate RF power stage validation for next-generation 5G base station radios using hybrid GaN/LDMOS technology.

FAQ

What is the primary function of the A5M36TG140TC-EVB?

The A5M36TG140TC-EVB is an evaluation board designed to characterize and validate the A5M36TG040-TC top-side cooling RF power amplifier module. It provides calibrated RF I/O, dual regulated power supplies, and thermal interface structures to enable accurate measurement of gain, efficiency, linearity, and thermal performance in 3.3–3.8 GHz 5G mMIMO applications. The A5M36TG140TC-EVB itself is not a production component but a development tool for radio front-end engineering.

Does the A5M36TG140TC-EVB include the A5M36TG040-TC module mounted on board?

Yes, the A5M36TG140TC-EVB ships with the A5M36TG040-TC RF power amplifier module pre-mounted and fully integrated. The board includes all necessary biasing circuitry, matching networks, thermal interface material (TIM), and mechanical mounting features to replicate the top-side cooling architecture used in final radio designs. This allows immediate RF and thermal testing without additional assembly steps.

What RF connectors are used on the A5M36TG140TC-EVB?

The A5M36TG140TC-EVB uses SMA female connectors for both RF input and RF output, enabling direct connection to standard lab equipment such as signal generators and spectrum analyzers. These connectors are impedance-matched to 50 Ω and positioned to minimize parasitic coupling, supporting repeatable wideband measurements from 3400 MHz to 3800 MHz. The A5M36TG140TC-EVB layout ensures minimal launch discontinuity for reliable S-parameter and ACLR evaluation.

Can the A5M36TG140TC-EVB be used for thermal resistance measurement?

Yes, the A5M36TG140TC-EVB is explicitly designed to support thermal resistance quantification of the A5M36TG040-TC module under operating conditions. It includes thermal vias, copper pour areas, and standardized heatsink mounting points aligned with NXP's top-side cooling specification. When paired with a calibrated heatsink and temperature sensors, the A5M36TG140TC-EVB enables measurement of junction-to-case (R_θJC) and case-to-heatsink (R_θCH) thermal resistance per JEDEC JESD51 standards.

Where can I obtain design files for the A5M36TG140TC-EVB?

Board design files for the A5M36TG140TC-EVB-including schematic, PCB layout (Gerber), bill of materials (BOM), and mechanical drawings-are available directly from NXP's official website under document number TSCEVBFS REV 1. These files are provided to support custom derivative designs, compliance testing, and integration into proprietary radio platforms. Access requires registration on nxp.com, and the A5M36TG140TC-EVB design files are not distributed by Aetrix Electronics.