My Inquiry
My Account
Analog Devices Inc. AD7314ARM-REEL7
- Part No.:
- AD7314ARM-REEL7
- Manufacturer:
- Analog Devices Inc.
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
AD7314ARM-REEL7.pdf
- Description:
- IC SENSOR TEMP 10BIT DGTL 8-MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:6,899
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AD7314ARM-REEL7 from Analog Devices is a low-voltage, 10-bit digital temperature sensor in an 8-lead MSOP package, featuring ±2°C accuracy over –35°C to +85°C, SPI-/DSP-compatible serial interface, and shutdown mode with 1 µA typical quiescent current. It integrates a band gap sensor and successive-approximation ADC for ambient temperature monitoring in space-constrained embedded systems.
For engineers reviewing the AD7314ARM-REEL7 datasheet, AD7314ARM-REEL7 pinout, AD7314ARM-REEL7 application, or AD7314ARM-REEL7 equivalent, key selection considerations include its 0.25°C resolution, 25 ms conversion time, 2.65 V–5.5 V supply range, and MSOP-8 thermal performance in PC motherboard thermal management, HDD spindle control, and portable device battery temperature sensing.
Technical Context
The AD7314ARM-REEL7 implements an on-chip band gap temperature sensor paired with a 10-bit successive-approximation ADC and internally generated conversion clock. It operates autonomously in automatic conversion mode (400 ms update interval), with conversion initiated every 400 ms and completed in 25 ms.
Its SPI-compatible 4-wire serial interface supports read-only operation when SDI is grounded, and full read/write via CE/SCLK/SDI/SDO. The ID pin includes a 1 kΩ internal pull-down for device identification in multi-sensor SPI buses, and the control register enables software-initiated shutdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature Range | –35°C to +85°C operating range - ensures reliable ambient sensing in consumer and industrial enclosures without external calibration. |
| Accuracy | ±2°C (–35°C to +85°C, VDD = 2.65 V–2.9 V); ±1°C (VDD = 3 V–5.5 V) - defines worst-case error budget for thermal throttling decisions. |
| Resolution | 10-bit output (0.25°C LSB) - enables fine-grained temperature trending for predictive fan control or battery charge termination. |
| Conversion Time | 25 ms - determines minimum latency between command and valid reading in closed-loop thermal regulation. |
| Supply Voltage | 2.65 V to 5.5 V - compatible with 3.3 V and 5 V logic domains without level-shifting. |
| Shutdown Current | 1 µA max - enables ultra-low-power wake-on-temperature in battery-backed systems. |
| Interface Protocol | SPI/QSPI/MICROWIRE/DSP-compatible 4-wire serial - interoperable with 80C51, PIC16Cxx, 68HC11, and TI C2000 DSPs without protocol translation. |
Pinout & Package
AD7314ARM-REEL7 is housed in an 8-lead MSOP (RM-8) package per JEDEC MO-187AA, with 0.65 mm lead pitch, 3.0 mm × 3.0 mm body, and 1.10 mm max height. Thermal resistance θJA = 206°C/W supports self-heating <0.1°C at 1 mA supply.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (NC) | No Connect | Unbonded die pad - must remain floating; no PCB trace or copper pour connection. |
| 2 (CE) | Chip Enable Input | Active-high enable for serial interface; disables SCLK when low - prevents bus contention in multi-device SPI daisy chains. |
| 3 (SCLK) | Serial Clock Input | Master-provided clock (up to 10 MHz) synchronizing all data transfers - rising edge updates SDO, falling edge latches SDI. |
| 4 (GND) | Analog & Digital Ground | Single ground reference for ADC and logic - requires low-impedance star connection to minimize noise coupling into temperature measurement. |
| 5 (SDO) | Serial Data Output | Three-state open-drain output - high-impedance when CE is low, enabling shared bus topology. |
| 6 (SDI) | Serial Data Input | Writes to control register (bit 2 = power-down); tied to GND for read-only mode - eliminates need for microcontroller GPIO in simple monitoring. |
| 7 (ID) | Device Identification | Open-drain output with 1 kΩ internal pull-down - used by master to verify presence before initiating communication; optional 100 kΩ pull-up for logic-high assertion. |
| 8 (VDD) | Positive Supply | 2.65 V–5.5 V analog/digital supply - requires 0.1 µF ceramic decoupling capacitor placed ≤2 mm from pin to suppress switching noise. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip band gap sensor + 10-bit SAR ADC | Eliminates external sensor and signal conditioning, reducing BOM count and layout area in thermal feedback loops. |
| Auto-conversion mode (400 ms interval) | Enables continuous background temperature sampling without CPU polling overhead or timer interrupt dependency. |
| Software-controllable shutdown mode | Reduces supply current to ≤1 µA, extending battery life in portable devices during idle periods without hardware reset. |
| ID pin with internal 1 kΩ pull-down | Allows firmware-level device enumeration in multi-sensor SPI buses, avoiding address jumpers or I²C address conflicts. |
| MSOP-8 package (3 mm × 3 mm) | Supports high-density PCB layouts in laptops, SSDs, and telecom modules where board space is constrained. |
Applications
| Hard Disk Drive Thermal Management | PC Motherboard CPU Zone Monitoring |
|---|---|
Use Scenario: Real-time spindle motor and controller IC temperature tracking to prevent thermal runaway during sustained write operations. IC Role / Device Role / Timing Role: Primary ambient temperature sensor feeding thermal throttle logic in HDD controller ASIC. Use Value: ±2°C accuracy and 25 ms conversion time enable responsive fan speed adjustment before junction temperatures exceed 70°C. |
Use Scenario: Localized temperature sensing near CPU VRM and chipset to trigger dynamic voltage/frequency scaling (DVFS). IC Role / Device Role / Timing Role: Dedicated thermal monitor interfaced directly to southbridge SMBus controller via SPI-to-SMBus bridge. Use Value: MSOP-8 footprint allows placement within 5 mm of hot components, minimizing thermal lag and improving closed-loop response fidelity. |
| Mobile Phone Battery Pack Sensing | Industrial PLC Cabinet Ambient Monitoring |
Use Scenario: Measuring battery pack surface temperature during fast charging to enforce JEITA-compliant charge current derating. IC Role / Device Role / Timing Role: Secondary temperature node connected to baseband processor's SPI peripheral for independent thermal safety validation. Use Value: 1 µA shutdown current extends standby time between charge cycles; 2.65 V minimum VDD supports direct connection to LDO outputs. |
Use Scenario: Monitoring enclosure air temperature in DIN-rail mounted PLCs to prevent processor throttling under high ambient conditions. IC Role / Device Role / Timing Role: Standalone sensor reporting via isolated RS-485 gateway, powered from 24 V DC-DC converter with local LDO. Use Value: –35°C to +85°C rating covers industrial temperature extremes; 0.25°C resolution supports predictive maintenance alerts before threshold breaches. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX31820 (Maxim Integrated) | 1-Wire interface, 12-bit resolution, ±0.5°C accuracy, TO-92 package | Requires single-wire bus infrastructure; lacks SPI native support and shutdown control register | Select when minimizing interconnect wires is critical and microcontroller has 1-Wire peripheral. |
| LMT70AIDSC (Texas Instruments) | 0.05°C typical accuracy, 0.75 mm × 0.75 mm DSBGA, analog output + integrated ADC | Delivers higher precision but requires external ADC or MCU with 12-bit SAR; no native SPI interface | Select when sub-degree accuracy is mandatory and board space is extremely limited (e.g., wearable sensors). |
Compared with MAX31820 and LMT70AIDSC, AD7314ARM-REEL7 offers balanced trade-offs: SPI-native integration reduces firmware complexity versus 1-Wire, while its MSOP-8 package provides better manufacturability and thermal stability than ultra-small DSBGA alternatives - ideal for cost-sensitive, medium-precision thermal monitoring.
Availability
AD7314ARM-REEL7 is available at Aetrix Electronics and suitable for hard disk drives, personal computers, and electronic test equipment requiring stable component supply across long-lifecycle industrial programs.
Supply support for AD7314ARM-REEL7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and healthcare markets since 1965.
The AD7314ARM-REEL7 belongs to Analog Devices' precision temperature sensor product line, engineered for embedded thermal management where low power, small size, and SPI compatibility are essential - not general-purpose sensing.
FAQ
What is the operating temperature range of the AD7314ARM-REEL7?
The AD7314ARM-REEL7 operates from –35°C to +85°C, with guaranteed ±2°C accuracy across this full range when supplied at 2.65 V–2.9 V, and ±1°C accuracy at 3 V–5.5 V. Its band gap sensor and internal reference are trimmed to maintain stability across this industrial-grade envelope, making AD7314ARM-REEL7 suitable for deployment in uncontrolled environments like office equipment enclosures or mobile device battery compartments.
Does the AD7314ARM-REEL7 require an external clock source?
No, the AD7314ARM-REEL7 uses an internally generated conversion clock - no external oscillator or crystal is needed. The internal oscillator drives automatic conversions every 400 ms, and only the SCLK signal (provided by the host microcontroller) is required for serial data transfer. This simplifies system design and reduces bill-of-materials cost compared to temperature sensors requiring external timing components.
How does the shutdown mode function in the AD7314ARM-REEL7?
The AD7314ARM-REEL7 enters shutdown mode via a write to its control register (bit 2 = 1), reducing supply current to ≤1 µA. In shutdown, the internal oscillator halts and no new conversions occur, but the last valid temperature reading remains accessible via SPI read. This allows AD7314ARM-REEL7 to conserve power in battery-operated systems while retaining immediate thermal visibility upon wake-up.
Can the AD7314ARM-REEL7 be used in a 3-wire SPI configuration?
Yes - the AD7314ARM-REEL7 supports 3-wire operation by grounding the SDI pin, enabling read-only access to the temperature value register via SDO. In this mode, CE, SCLK, and SDO are used, eliminating one microcontroller GPIO. However, software-controlled shutdown is disabled, so AD7314ARM-REEL7 remains in normal mode unless physically reset or powered down externally.
What is the purpose of the ID pin on the AD7314ARM-REEL7?
The ID pin (Pin 7) on the AD7314ARM-REEL7 provides device identification in multi-sensor SPI systems: it features a 1 kΩ internal pull-down resistor, allowing the host to detect presence by reading its logic state. When pulled up with a 100 kΩ resistor to VDD, it asserts a known high level - enabling firmware to distinguish AD7314ARM-REEL7 from other SPI peripherals on the same bus without address conflicts.
AD7314ARM-REEL7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -35°C ~ 85°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SPI
- Voltage - Supply:
- 2.65V ~ 5.5V
- Resolution:
- 10 b
- Features:
- Shutdown Mode, Standby Mode
- Accuracy - Highest (Lowest):
- ±2°C
- Test Condition:
- -35°C ~ 85°C
- Operating Temperature:
- -35°C ~ 85°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-MSOP
AD7314ARM-REEL7 FAQ
1.How can I place an order for AD7314ARM-REEL7 through Aetrix?
Please submit a Request for Quotation (RFQ) for AD7314ARM-REEL7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AD7314ARM-REEL7 reliable?
The price and inventory of AD7314ARM-REEL7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AD7314ARM-REEL7 is usually 5 days.
3.What payment methods are accepted for AD7314ARM-REEL7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AD7314ARM-REEL7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AD7314ARM-REEL7?
AD7314ARM-REEL7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AD7314ARM-REEL7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AD7314ARM-REEL7?
For technical support, including AD7314ARM-REEL7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AD7314ARM-REEL7 requirements.
6.How does Aetrix verify that AD7314ARM-REEL7 is sourced from the original manufacturer or authorized distributors?
All AD7314ARM-REEL7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AD7314ARM-REEL7 meets industry standards.
7.What is the process for return or replacement of AD7314ARM-REEL7?
All AD7314ARM-REEL7 units undergo pre-shipment inspection (PSI). If there is an issue with AD7314ARM-REEL7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AD7314ARM-REEL7 part is unused and in its original packaging.
Return procedure for AD7314ARM-REEL7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AD7314ARM-REEL7 Tags
-
MCP9700T-E/TT
Microchip Technology
-
MCP9700T-E/LT
Microchip Technology
-
MCP9701T-E/TT
Microchip Technology
-
MCP9701T-E/LT
Microchip Technology
-
TMP235A4DBZR
Texas Instruments
-
MCP9700AT-E/TT
Microchip Technology
-
MCP9700AT-E/LT
Microchip Technology
-
MCP9701AT-E/LT
Microchip Technology
-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
