Analog Devices Inc. AD8159ASVZ
- Part No.:
- AD8159ASVZ
- Manufacturer:
- Analog Devices Inc.
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
AD8159ASVZ.pdf
- Description:
- IC MUX/DEMUX 4 X 2:1 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,093
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AD8159ASVZ from Analog Devices is a quad-lane, protocol-agnostic 2:1 multiplexer / 1:2 demultiplexer IC designed for high-speed serial backplane routing. It supports up to 3.2 Gbps per lane (NRZ), provides two levels of input equalization and four levels of output pre-emphasis, and operates across −40°C to +85°C in a 100-lead TQFP_EP package. It enables redundancy switching in XAUI, PCIe, and Fibre Channel systems.
For engineers reviewing the AD8159ASVZ datasheet, AD8159ASVZ pinout, AD8159ASVZ application, or AD8159ASVZ equivalent, key selection criteria include deterministic jitter (20 ps p-p), lane-to-lane skew (100 ps), unicast/bicast configuration, port-level loopback, and reversible Port C I/O for ASIC pinout alignment.
Technical Context
The AD8159ASVZ implements independent lane switching via SEL[3:0], with each lane supporting dc–3.2 Gbps NRZ signaling. Its architecture integrates receive equalization (EQ) per port (0 dB or 6 dB gain) and transmit pre-emphasis (PE) per port (0–4.9 dB), enabling compensation over up to 40 inches of FR4 backplane including connectors.
It features three differential ports: Port A and Port B are dedicated 4-lane inputs (mux side) or outputs (demux side); Port C is bidirectional and reversible via REVERSE_C, supporting both 2:1 mux and 1:2 demux functions simultaneously under control logic including BICAST, LB_A/B/C, and EQ/PE configuration pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate per Lane | 3.2 Gbps NRZ - supports XAUI, PCIe Gen1, Fibre Channel 2.125 Gbps without retiming |
| Deterministic Jitter | 20 ps p-p at 3.2 Gbps - ensures robust eye opening in high-loss backplane channels |
| Lane-to-Lane Skew | 100 ps - maintains inter-lane timing integrity for parallel protocols like XAUI |
| Input Equalization | 2 levels (0 dB / 6 dB) per port - compensates up to ~40″ FR4 loss at 3.2 Gbps |
| Output Pre-Emphasis | 4 levels (0–4.9 dB) per port - adds controlled overshoot to restore high-frequency content |
| BER Performance | < 10⁻¹⁶ - meets telecom-grade reliability requirements for mission-critical links |
| Supply Voltage | 3.3 V core (VCC), flexible I/O supplies down to 2.5 V - supports mixed-voltage system interfacing |
Pinout & Package
AD8159ASVZ is housed in a 100-lead TQFP_EP (exposed paddle) package, 14 mm × 14 mm, 0.5 mm pitch. The exposed paddle must be soldered to VEE for thermal compliance (θJC = 13°C/W). Pin count includes 12 differential CML-compatible inputs, 12 differential outputs, 4 lane-select controls (SEL[3:0]), 6 pre-emphasis controls (PE_A/B/C[1:0]), 3 loopback enables (LB_A/B/C), BICAST, REVERSE_C, EQ_A/B/C, and multiple termination supply rails (VTTI, VTTO, VTTIO, VTTOI).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SEL[3:0] (Pins 68,69,70,71) | Lane Select Control | Configures 2:1 mux path per lane - selects Input Port A or B to Output Port C |
| BICAST (Pin 64) | Demux Mode Control | Enables simultaneous routing from Input Port C to both Output Ports A and B |
| REVERSE_C (Pin 12) | Port C I/O Direction Flip | Swaps input/output function of all Port C pins - matches opposing ASIC pinouts |
| LB_A/B/C (Pins 65,66,77) | Port-Level Loopback Enable | Forces local loopback per port - bypasses SEL/BICAST for test and debug |
| EQ_A/B/C (Pins 74,73,72) | Input Equalization Control | Per-port 1-bit setting for 0 dB or 6 dB high-frequency boost |
| PE_A/B/C[1:0] (Pins 6–7,8–9,10–11) | Output Pre-Emphasis Control | Per-port 2-bit setting selecting 0–4.9 dB pre-emphasis for backplane loss compensation |
Key Features
| Feature | Design Value |
|---|---|
| Quad-lane independent switching | Each lane switches separately via SEL[3:0] - enables partial failover and lane-level redundancy |
| Reversible Port C I/O | REVERSE_C pin swaps all Port C pin directions - eliminates need for external crossover PCB traces |
| On-chip 100 Ω differential termination | Integrated resistors reduce external component count and improve signal integrity at 3.2 Gbps |
| Low-power operation | 175 mA ICC in basic configuration - ~1 W total power at 3.3 V, suitable for dense backplane cards |
| Protocol-agnostic architecture | No embedded clock recovery or framing - transparently passes NRZ data for SONET, XAUI, PCIe, InfiniBand |
Applications
| XAUI Backplane Redundancy | PCIe Gen1 Link Testing |
|---|---|
Use Scenario: Dual-switch fabric line card with primary/redundant paths in telecom infrastructure. IC Role / Device Role / Timing Role: 2:1 mux on line interface side and 1:2 demux on backplane side - enables 1+1 hitless failover. Use Value: Eliminates manual switchovers; maintains sub-100 ns switchover latency and preserves BER < 10⁻¹⁶ during transition. |
Use Scenario: High-speed serial link validation using real-time oscilloscope and pattern generator. IC Role / Device Role / Timing Role: Bicast mode duplicates incoming traffic from Port C to both Port A (DUT) and Port B (test equipment). Use Value: Enables concurrent functional testing and signal integrity analysis without adding latency or jitter. |
| Fibre Channel 2.125 Gbps Failover | InfiniBand® DDR Backplane Routing |
Use Scenario: Storage area network (SAN) switch with dual-controller failover capability. IC Role / Device Role / Timing Role: Unicast mode routes active controller's 4-lane FC-2 output to backplane; standby path held idle. Use Value: Idle-state tail current shutdown reduces crosstalk and power consumption on inactive lanes. |
Use Scenario: Blade server chassis requiring low-skew, high-fidelity interconnect between compute and I/O modules. IC Role / Device Role / Timing Role: Quad-lane mux/demux with <100 ps lane-to-lane skew - preserves DDR timing margins. Use Value: Supports 2.5 Gbps per lane InfiniBand DDR signaling over 30″ FR4 with PE=2 and EQ=1 enabled. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial mux/demux applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI SN65LVCP22 | 2-lane only; no bicast or loopback; fixed 2.5 Gbps max; no equalization/pre-emphasis | Suitable for lower-density, cost-sensitive GigE backplanes - lacks redundancy features | Choose when lane count and advanced signal conditioning are not required |
| Maxim MAX9158 | Single 4-lane mux/demux; no Port C reversal; 3.125 Gbps max; no integrated termination | Used in compact optical module interfaces - requires external 100 Ω termination networks | Prefer when board space is constrained and external termination is acceptable |
Compared with SN65LVCP22 and MAX9158, AD8159ASVZ uniquely combines quad-lane independence, bicast capability, Port C reversibility, on-chip EQ/PE, and integrated termination - making it the only option qualified for full-featured XAUI/PCIe redundancy switching in industrial temperature range.
Availability
AD8159ASVZ is available at Aetrix Electronics and suitable for XAUI backplane redundancy, PCIe Gen1 link testing, and Fibre Channel failover systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for AD8159ASVZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, communications, and industrial markets since 1965.
The AD8159ASVZ belongs to Analog Devices' high-speed interface portfolio, engineered specifically for protocol-transparent serial link redundancy, signal integrity enhancement, and backplane channel compensation in telecom and data center infrastructure.
FAQ
What is the maximum supported data rate per lane for AD8159ASVZ?
The AD8159ASVZ supports up to 3.2 Gbps per lane using NRZ signaling. This rate is validated across the full operating temperature range (−40°C to +85°C) with deterministic jitter ≤20 ps p-p and BER <10⁻¹⁶. It fully complies with XAUI (3.125 Gbps), PCIe Gen1 (2.5 Gbps), and Fibre Channel 2.125 Gbps standards.
Does AD8159ASVZ require external termination resistors?
No, AD8159ASVZ includes on-chip 100 Ω differential termination with ±10% tolerance and 0.15 Ω/°C temperature coefficient. External termination is optional and only needed when custom impedance matching or AC coupling is used. The internal termination simplifies layout and improves signal integrity at 3.2 Gbps.
How does the REVERSE_C pin affect AD8159ASVZ functionality?
The REVERSE_C pin (Pin 12) toggles the I/O direction of all Port C pins: when low, Pins 77–87 act as inputs and 89–99 as outputs; when high, their roles swap. This allows direct connection to ASICs with mirrored pinouts without redesigning the PCB, preserving signal integrity and reducing development time for AD8159ASVZ-based systems.
Can AD8159ASVZ operate with 2.5 V I/O supplies?
Yes, AD8159ASVZ supports flexible I/O supply voltages down to 2.5 V on VTTO, VTTI, VTTOI, and VTTIO rails while maintaining full 3.2 Gbps operation and specified jitter performance. Core supply remains fixed at 3.3 V (VCC), but I/O voltage scaling enables interoperability with 2.5 V CML or LVDS receivers/transmitters in mixed-voltage systems.
What is the thermal design requirement for AD8159ASVZ?
AD8159ASVZ uses an exposed paddle (ePAD) that must be soldered to the VEE ground plane to achieve θJC = 13°C/W. Without ePAD connection, junction-to-case thermal resistance degrades significantly. For 1 W typical power dissipation, this ensures junction temperature stays within spec under still-air conditions across the full −40°C to +85°C ambient range.
AD8159ASVZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- XStream™
- Package/Case:
- 100-TQFP Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 4 x 2:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP-EP (14x14)
AD8159ASVZ FAQ
1.How can I place an order for AD8159ASVZ through Aetrix?
Please submit a Request for Quotation (RFQ) for AD8159ASVZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AD8159ASVZ reliable?
The price and inventory of AD8159ASVZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AD8159ASVZ is usually 5 days.
3.What payment methods are accepted for AD8159ASVZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AD8159ASVZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AD8159ASVZ?
AD8159ASVZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AD8159ASVZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AD8159ASVZ?
For technical support, including AD8159ASVZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AD8159ASVZ requirements.
6.How does Aetrix verify that AD8159ASVZ is sourced from the original manufacturer or authorized distributors?
All AD8159ASVZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AD8159ASVZ meets industry standards.
7.What is the process for return or replacement of AD8159ASVZ?
All AD8159ASVZ units undergo pre-shipment inspection (PSI). If there is an issue with AD8159ASVZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AD8159ASVZ part is unused and in its original packaging.
Return procedure for AD8159ASVZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AD8159ASVZ Tags
-
SN74HC138DR
Texas Instruments

-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage

-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments

-
74CBTLV3257GUX
Nexperia USA Inc.

-
74HC154BQ,118
Nexperia USA Inc.

-
P3S0200GMX
NXP USA Inc.

-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments

-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments

-
SN74HC138N
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

