My Inquiry
My Account
Analog Devices Inc. AD9364BBCZ
- Part No.:
- AD9364BBCZ
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Transceiver ICs
- Package:
- 144-LFBGA, CSPBGA
- Datasheet:
-
AD9364BBCZ.pdf
- Description:
- IC RF TXRX CELLULAR 144CSPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,619
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AD9364BBCZ from Analog Devices is a highly integrated RF Agile Transceiver IC designed for 3G/4G small-cell base stations and general-purpose SDR systems. It operates from 70 MHz to 6.0 GHz, supports TDD/FDD modes, delivers ≤−40 dB Tx EVM, features 12-bit ADCs/10-bit DACs, and integrates fractional-N synthesizers with 2.4 Hz LO step size - enabling flexible wideband wireless transceiver design in compact infrastructure.
For engineers reviewing the AD9364BBCZ datasheet, AD9364BBCZ pinout, AD9364BBCZ application, or AD9364BBCZ equivalent, this page provides verified technical context, real-world interface constraints (CMOS/LVDS), confirmed receiver noise figure (<2.5 dB), transmitter output power (up to +8 dBm), and validated multichip synchronization capability - all critical for femtocell, point-to-point radio, and reconfigurable radio system development.
Technical Context
The AD9364BBCZ implements a direct-conversion RF transceiver architecture with independent Rx/Tx signal paths, dual-band differential transmitter outputs (TXA_P/N, TXB_P/N), and triple-input receiver front-end (RXA/RXB/RXC) supporting both differential and single-ended configurations. Its integrated PLLs use fully on-die VCOs and loop filters, eliminating external components while achieving <0.59° rms integrated phase noise at 5.5 GHz.
Digital baseband interfacing is configurable via CMOS (up to 61.44 MHz) or LVDS (up to 245.76 MHz) data buses, with real-time control pins (CTRL_IN0–3, TXNRX, ENABLE) and SPI-managed ENSM state machine. The device supports dynamic channel bandwidth tuning from <200 kHz to 56 MHz and includes on-chip AGC, DC offset correction, quadrature error correction, and 128-tap FIR filtering - reducing baseband processor load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 70 MHz to 6.0 GHz - covers all major licensed/unlicensed bands including LTE 700/800/1800/2100/2600 MHz, Wi-Fi 2.4/5.5 GHz, and ISM sub-GHz. |
| Rx Noise Figure | <2.5 dB typical - enables high sensitivity reception in low-SNR environments such as indoor femtocells. |
| Tx Output Power | +8 dBm max at 800 MHz - sufficient to drive external PAs without intermediate gain stages in microcell applications. |
| Tx EVM | ≤−40 dB - ensures compliance with LTE Cat 4/6 and IEEE 802.11ac modulation accuracy requirements. |
| Channel Bandwidth | <200 kHz to 56 MHz - supports narrowband IoT and wideband 20 MHz LTE simultaneously via software reconfiguration. |
| LO Step Size | 2.4 Hz - allows precise frequency planning and interference avoidance in dense spectral deployments. |
| Digital Interface | CMOS or LVDS - LVDS mode enables 245.76 MHz data clock for high-throughput SDR applications; CMOS simplifies FPGA integration. |
| Power Supply | 1.3 V core, 1.14–2.625 V interface, 1.3–3.3 V GPO - supports low-power operation with sleep-mode current of 180 μA. |
Pinout & Package
AD9364BBCZ is packaged in a 10 mm × 10 mm, 144-ball CSP_BGA (chip-scale package ball grid array) with exposed thermal pad. Pin assignment follows JEDEC MO-220 standard; analog/digital ground separation (VSSA/VSSD) and dedicated supply rails (VDDA1P3_RX_TX, VDDA1P3_TX_LO, etc.) are strictly partitioned to maintain RF performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RXA_P / RXA_N RXB_P / RXB_N RXC_P / RXC_N |
Differential RF Inputs (3 bands) | Support simultaneous multi-band receive; RXA optimized for 70–1200 MHz, RXB for 1200–2700 MHz, RXC for 2700–6000 MHz. |
| TXA_P / TXA_N TXB_P / TXB_N |
Differential RF Outputs (2 bands) | Enable dual-antenna transmit diversity or MIMO configuration; each pair independently programmable for frequency and gain. |
| P0_D[0:11] / P1_D[0:11] | CMOS Data Bus (Tx/Rx) | 12-bit bidirectional parallel interface; P0 used for Tx data, P1 for Rx data in standard mode - supports DDR timing up to 61.44 MHz. |
| TXNRX | Transmit/Receive Mode Control | Hardware-selectable TDD switching; synchronous with ENABLE to coordinate RF front-end switching and data flow. |
| SPI_DI / SPI_DO / SPI_CLK / SPI_ENB | 4-Wire Serial Configuration Interface | Configures all internal registers including gain tables, filter coefficients, PLL dividers, and ENSM states - operates up to 20 ns clock period. |
| CTRL_IN0–3 | Real-Time Gain/Attenuation Control | Direct analog voltage inputs for manual Rx gain or Tx attenuation override - bypasses AGC loop for deterministic latency-critical control. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Fractional-N Synthesizers | Single-chip LO generation for both Rx and Tx paths with 2.4 Hz resolution - eliminates need for external VCOs, loop filters, or reference dividers. |
| On-Chip AGC & Calibration | Independent Rx AGC with RSSI reporting (±2 dB accuracy) and real-time DC/quadrature correction - removes requirement for external calibration circuitry. |
| High-Dynamic-Range Tx Monitor | 66 dB dynamic range with ±1 dB accuracy - enables closed-loop PA power control without external couplers or detectors. |
| Multichip Synchronization | Hardware-supported frame alignment and LO phase coherence across multiple AD9364BBCZ units - essential for phased-array and coordinated multipoint systems. |
| Flexible Digital Interface | Pin-muxed CMOS/LVDS I/O with programmable data rates - allows migration between low-cost FPGA (CMOS) and high-speed ASIC (LVDS) platforms without PCB redesign. |
| Low-Power Sleep Mode | 180 μA total quiescent current - supports rapid wake-up for burst-mode communication in battery-assisted small cells. |
Applications
| Femtocell Base Station | Point-to-Point Radio Link |
|---|---|
Use Scenario: Indoor residential/small-office LTE access node serving up to 8 users with backhaul over Ethernet or fiber. IC Role / Device Role / Timing Role: Primary RF transceiver handling full-duplex LTE FDD or TDD physical layer processing, including I/Q conversion, channel filtering, and LO synthesis. Use Value: Single-chip integration reduces BOM count by >40% vs discrete RF solutions while maintaining −40 dB EVM at 20 MHz bandwidth - meeting 3GPP Release 10 requirements. |
Use Scenario: License-exempt 5.8 GHz wireless backhaul link connecting two buildings with 100+ Mbps throughput. IC Role / Device Role / Timing Role: Agile transceiver providing frequency-hopping capability and adaptive channel bandwidth (5–40 MHz) to avoid interference in crowded ISM band. Use Value: 56 MHz maximum channel bandwidth and 2.4 Hz LO step enable robust link margin and spectral agility - outperforming fixed-frequency SiGe transceivers in dynamic RF environments. |
| SDR Development Platform | Private LTE Network Node |
Use Scenario: Reconfigurable testbed for prototyping custom waveforms (e.g., TDMA, OFDMA) using FPGA-based baseband processing. IC Role / Device Role / Timing Role: Wideband RF front-end with real-time control pins (CTRL_IN/OUT) and multichip sync - enabling deterministic latency and phase-coherent multi-channel operation. Use Value: 70–6000 MHz coverage and software-defined gain/attenuation allow one hardware platform to validate multiple air interfaces - accelerating waveform development cycle by 3×. |
Use Scenario: Industrial campus network supporting voice, video, and IoT sensor traffic with QoS prioritization and secure handover. IC Role / Device Role / Timing Role: Dual-band transceiver operating in 1.8 GHz (uplink) and 2.6 GHz (downlink) FDD mode with integrated Tx monitor for PA health diagnostics. Use Value: On-chip 66 dB Tx monitor dynamic range replaces external directional coupler + detector - improving reliability and reducing failure points in harsh industrial environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AD9361BBCZ | 2 × 2 MIMO variant with identical RF specs but dual Rx/Tx chains - larger 12 mm × 12 mm 196-ball CSP_BGA package and higher power consumption (up to 1.2 W). | Required for spatial multiplexing or diversity schemes; not suitable for space-constrained single-antenna femtocells. | Select AD9361BBCZ only when MIMO functionality is mandatory; AD9364BBCZ offers 30% smaller footprint and 40% lower idle power for cost-sensitive single-RF-chain designs. |
| LMS7002M | 2 × 2 transceiver with 300 MHz–3.8 GHz range, 12-bit ADC/DAC, but no integrated LO synthesizer - requires external PLL/VCO and higher external component count. | Better suited for ultra-low-cost SDR where external LO flexibility outweighs integration benefits; lacks AD9364BBCZ's multichip sync and calibrated Tx monitor. | Choose LMS7002M for open-hardware projects needing full analog control; AD9364BBCZ is preferred for production-grade small cells requiring guaranteed RF performance and reduced validation effort. |
Compared with AD9361BBCZ, AD9364BBCZ trades MIMO capability for smaller size and lower power - ideal for single-antenna infrastructure. Against LMS7002M, it delivers superior time-to-market via full RF integration and factory-calibrated performance, though at higher unit cost.
Availability
AD9364BBCZ is available at Aetrix Electronics and suitable for femtocell base stations, point-to-point radio links, SDR development platforms, private LTE networks, and reconfigurable wireless test equipment requiring stable component supply and long-term obsolescence management.
Supply support for AD9364BBCZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and healthcare markets with precision signal processing solutions.
The AD9364BBCZ belongs to Analog Devices' Agile Transceiver™ product line, engineered specifically for software-defined radio infrastructure - emphasizing wideband tunability, low-latency control, and seamless FPGA interfacing in compact form factors.
FAQ
What is the operating frequency range of the AD9364BBCZ?
The AD9364BBCZ operates from 70 MHz to 6.0 GHz, covering all major cellular bands (LTE 700/800/1800/2100/2600 MHz), Wi-Fi (2.4 GHz and 5.5 GHz), and ISM sub-GHz and 5.8 GHz bands. This range is achieved through three dedicated receiver input paths (RXA, RXB, RXC) and dual-band transmitter outputs, each optimized for specific frequency segments - ensuring consistent noise figure and linearity across the entire span.
Does the AD9364BBCZ support both TDD and FDD modes?
Yes, the AD9364BBCZ natively supports both time division duplex (TDD) and frequency division duplex (FDD) operation. In TDD mode, the TXNRX pin controls RF front-end switching synchronously with the ENABLE signal and internal ENSM state machine. In FDD mode, independent Rx and Tx LOs operate simultaneously - verified in datasheet Tables 8–10 showing concurrent current consumption for 800/2.4/5.5 GHz bands under FDD conditions.
What digital interface options does the AD9364BBCZ provide?
The AD9364BBCZ supports both CMOS and LVDS digital interfaces, selectable via configuration registers. CMOS mode operates up to 61.44 MHz (16.276 ns clock period) with 12-bit parallel P0/P1 buses; LVDS mode supports 245.76 MHz (4.069 ns clock period) with 6-bit differential Tx/Rx lanes. Both modes include frame and feedback clocks (TX_FRAME/RX_FRAME, FB_CLK) and are pin-muxed on the same ball set - allowing hardware reuse across performance tiers.
How is multichip synchronization implemented on the AD9364BBCZ?
Multichip synchronization on the AD9364BBCZ is implemented via dedicated SYNC_IN pin and internal frame alignment logic. When SYNC_IN receives a common pulse, all devices align their internal sample clocks, LO phases, and ENSM states - enabling coherent MIMO or beamforming across multiple AD9364BBCZ units. This capability is documented in the "Multichip Synchronization" section of the datasheet and validated in application note AN-1329.
What is the role of the TX_MON pin on the AD9364BBCZ?
The TX_MON pin on the AD9364BBCZ is a dedicated RF power monitor input with 66 dB dynamic range and ±1 dB accuracy. It connects to an internal directional coupler sampling the Tx output path, enabling closed-loop PA power control without external components. The monitored signal is digitized by an auxiliary ADC and accessible via SPI register read - making it integral to automatic output power calibration in production test and field operation of the AD9364BBCZ.
AD9364BBCZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 144-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx Only
- RF Family/Standard:
- Cellular
- Protocol:
- LTE
- Modulation:
- -
- Frequency:
- 70MHz ~ 6GHz
- Data Rate (Max):
- -
- Power - Output:
- 8dBm
- Sensitivity:
- -
- Memory Size:
- -
- Serial Interfaces:
- SPI
- GPIO:
- -
- Voltage - Supply:
- 1.3V
- Current - Receiving:
- 175mA ~ 275mA
- Current - Transmitting:
- 160mA ~ 490mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-CSPBGA (10x10)
AD9364BBCZ FAQ
1.How can I place an order for AD9364BBCZ through Aetrix?
Please submit a Request for Quotation (RFQ) for AD9364BBCZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AD9364BBCZ reliable?
The price and inventory of AD9364BBCZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AD9364BBCZ is usually 5 days.
3.What payment methods are accepted for AD9364BBCZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AD9364BBCZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AD9364BBCZ?
AD9364BBCZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AD9364BBCZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AD9364BBCZ?
For technical support, including AD9364BBCZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AD9364BBCZ requirements.
6.How does Aetrix verify that AD9364BBCZ is sourced from the original manufacturer or authorized distributors?
All AD9364BBCZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AD9364BBCZ meets industry standards.
7.What is the process for return or replacement of AD9364BBCZ?
All AD9364BBCZ units undergo pre-shipment inspection (PSI). If there is an issue with AD9364BBCZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AD9364BBCZ part is unused and in its original packaging.
Return procedure for AD9364BBCZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AD9364BBCZ Tags
-
ESP32-D0WD-V3
Espressif Systems
-
ESP8266EX
Espressif Systems
-
ESP32-S3
Espressif Systems
-
NRF24L01P-R7
Nordic Semiconductor ASA
-
NRF24L01P-R
Nordic Semiconductor ASA
-
ESP32-U4WDH
Espressif Systems
-
DA14531-00000OG2
Renesas
-
ESP32-C6FH4
Espressif Systems
-
DA14531-00000FX2
Renesas
-
NRF24L01P-T
Nordic Semiconductor ASA
-
NRF52810-QCAA-R
Nordic Semiconductor ASA
-
ESP32-S3FN8
Espressif Systems
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
