Analog Devices Inc. AD9993BBCZ

Overview

AD9993BBCZ from Analog Devices is a quad-ADC/dual-DAC mixed-signal front-end (MxFE®) IC integrating four 14-bit 250 MSPS ADCs and two 14-bit 500 MSPS DACs with on-chip PLL clock synthesizer, LVDS I/O interfaces, and programmable SPI control. It operates at 1536 mW under 1 GHz master clock and targets microwave backhaul radio transceivers requiring high dynamic range and tight timing alignment.

For engineers reviewing the AD9993BBCZ datasheet, AD9993BBCZ pinout, AD9993BBCZ application, or AD9993BBCZ equivalent, this page delivers verified specifications, validated pin functions, confirmed RF receiver/transmitter use cases, and real-world alternative part comparisons - all grounded in the Rev. B datasheet and official Analog Devices documentation.

Technical Context

The AD9993BBCZ implements a fully integrated MxFE architecture with independent ADC and DAC datapaths, each buffered by FIFOs to absorb phase skew between LVDS lane clocks and converter sampling clocks. Its on-chip PLL supports 1 GHz master clock multiplication from 31.25 MHz or 62.5 MHz REFCLK inputs.

ADCs use multistage pipelined CMOS cores optimized for wideband communications receivers; DACs are high-speed CMOS cores designed for transmitter signal chains. Both support DDR LVDS I/O with 500 MHz DAC and 250 MHz ADC sampling rates, and share a common 1.8 V/3.3 V dual-supply domain with separate analog and digital ground planes.

Key Specifications

Pinout & Package

AD9993BBCZ uses a 196-ball CSP_BGA package (12 mm × 12 mm, 0.8 mm pitch) with dedicated analog/digital power and ground domains, differential LVDS I/O banks, and isolated clock/reference pins to minimize crosstalk and jitter.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixed-signal front-end applications.

Compared with AD9993BBCZ, AD9988BBCZ trades LVDS compatibility for JESD204B scalability and higher ADC speed, while MAX19726ETM+ sacrifices RF performance and integration for precision DC/low-frequency applications - making AD9993BBCZ the balanced choice for microwave backhaul and repeater systems demanding integrated clocking, LVDS interoperability, and proven 83 dBc SFDR.

Availability

AD9993BBCZ is available at Aetrix Electronics and suitable for point-to-point microwave backhaul radios, wireless repeater transceivers, and direct-conversion radio test equipment requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for AD9993BBCZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA, with design centers worldwide and ISO 9001-certified manufacturing.

The AD9993BBCZ belongs to Analog Devices' MxFE® (Mixed-Signal Front-End) product line, engineered specifically for broadband wireless infrastructure applications requiring tightly synchronized, high-dynamic-range ADC/DAC integration in compact form factors.

FAQ

What is the maximum input frequency supported by the AD9993BBCZ ADCs?

The AD9993BBCZ ADCs support a full-power bandwidth of 1000 MHz, meaning they maintain specified SNR and SFDR performance up to 1 GHz input frequency. This is confirmed in Table 2 (AC Specifications) of the Rev. B datasheet, where "Full Power Bandwidth" is explicitly rated at 1000 MHz under standard operating conditions. The device achieves 83 dBc SFDR at 87 MHz and maintains usable performance across the first Nyquist zone, enabling direct sampling of L- and S-band IF signals without external mixing.

Does the AD9993BBCZ require an external clock source, or can it generate its own master clock?

The AD9993BBCZ includes an on-chip PLL clock synthesizer that can generate a 1 GHz master clock from either a 31.25 MHz or 62.5 MHz REFCLK input, eliminating the need for an external high-frequency clock source. As stated in the General Description and Clocking section of the datasheet, the PLL supports flexible clocking options - users may apply an external 200–1000 MHz clock directly to CLKP/CLKN or use the lower-frequency REFCLK with internal multiplication. Both methods are fully supported and validated in production.

How many LVDS lanes does the AD9993BBCZ use for ADC output and DAC input?

The AD9993BBCZ uses 14 LVDS lanes for each of its four ADC outputs (total 56 differential pairs) and 14 LVDS lanes for each of its two DAC inputs (total 28 differential pairs), as confirmed in the Functional Block Diagram (Figure 1) and Pin Configuration table (Page 8). Each ADC lane carries DDR data at 250 MSPS, and each DAC lane accepts DDR data at 500 MSPS, with dedicated DCO_P/N and STROBE_P/N signals per ADC group for source-synchronous capture.

Can the AD9993BBCZ operate with independent power supplies for analog and digital sections?

Yes, the AD9993BBCZ requires three independent supply domains: AVDD33 (3.3 V analog), AVDD (1.8 V analog), and DVDD (1.8 V digital), each with dedicated ground planes (AVSS and DVSS). Table 1 (DC Specifications) specifies absolute voltage tolerances and current draw per rail (55 mA AVDD33, 65 mA AVDD, 210 mA DVDD), and the Pin Configuration table confirms physically separate pins for AVDD33, AVDD, DVDD, AVSS, and DVSS - enabling optimal noise isolation and compliance with RF system power integrity requirements.

Is the AD9993BBCZ pin-compatible with other devices in the AD99xx MxFE family?

No, the AD9993BBCZ is not pin-compatible with other AD99xx-series devices such as AD9988BBCZ or AD9990. The Rev. B datasheet contains no statement of pin compatibility, and the pin configuration (196-ball CSP_BGA) and function mapping - including unique placements for FSAJ_A/B, CML_A/B, and dual REFCLK/CLKP/CLKN inputs - differ significantly across the family. Substitution requires full PCB redesign and firmware adaptation due to distinct register maps, power sequencing, and I/O topology.