My Inquiry
My Account
Analog Devices Inc. ADBF705WCBCZ311
- Part No.:
- ADBF705WCBCZ311
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 184-LFBGA, CSPBGA
- Datasheet:
-
ADBF705WCBCZ311.pdf
- Description:
- BLK+PROCW/512KB L2 SRAM,DDR2
- Quantity:
- Payment:
- Shipping:
Inventory:3,773
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADBF705WCBCZ311 from Analog Devices is a Blackfin+ embedded processor with 400 MHz core performance, dual 16-bit or single 32-bit MAC per cycle, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), 1 MB ECC-protected L2 SRAM, and AEC-Q100 qualification for automotive use.
For engineers reviewing the ADBF705WCBCZ311 datasheet, ADBF705WCBCZ311 pinout, ADBF705WCBCZ311 application, or ADBF705WCBCZ311 equivalent, this page delivers verified specifications, package mapping, peripheral integration details, and real-world automotive/industrial deployment context - all grounded in Analog Devices' ADSP-BF705 documentation.
Technical Context
The ADBF705WCBCZ311 implements a Blackfin+ core with two 16-bit multipliers, one 32-bit multiplier, dual 40-bit accumulators (configurable as 72-bit), and four video ALUs - enabling simultaneous 16-bit MAC ×2 or 32-bit MAC ×1 per cycle. It supports complex 16-bit MAC, branch prediction, and cache enhancements while maintaining full instruction-set compatibility with prior Blackfin processors.
Its memory architecture features a modified Harvard L1 domain (64 kB instruction SRAM/Cache + 64 kB data SRAM/Cache + 8 kB scratchpad, all multi-parity protected), unified Von Neumann L2 domain (1 MB ECC-SRAM + 512 kB ROM), and optional L3 DDR2/LPDDR interface via 16-bit bus - accessible only on CSP_BGA packages like ADBF705WCBCZ311.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Blackfin+ dual-MAC DSP/microcontroller hybrid with 32-bit MAC and 16-bit complex MAC support |
| Max Core Frequency | 400 MHz - enables real-time audio/video processing and motor control at ≤100 mW core power |
| L1 Memory | 136 kB total: 64 kB instruction SRAM, 64 kB data SRAM, 8 kB scratchpad - all multi-parity protected for safety-critical operation |
| L2 Memory | 1 MB ECC-protected SRAM + 512 kB ROM - provides fault-tolerant code/data storage and secure boot capability |
| Peripherals | 2× CAN 2.0B, 2× UART, 2× SPORT, 1× USB 2.0 HS OTG, 1× PPI, 2× Quad SPI, 1× Dual SPI, 1× TWI, 8× GP timers |
| Package | 184-ball CSP_BGA, 12 mm × 12 mm × 0.8 mm pitch, RoHS compliant - supports high-density automotive PCB layouts |
| AEC-Q100 Grade | Qualified to Grade 3 (−40°C to +105°C) - validated for under-hood and infotainment applications |
Pinout & Package
ADBF705WCBCZ311 uses a 184-ball CSP_BGA package (12 mm × 12 mm, 0.8 mm pitch), RoHS compliant, with ball assignments defined in Analog Devices' ADSP-BF70x datasheet Rev. D, pages 105–107. The package supports DDR2/LPDDR via dedicated L3 interface pins and includes dedicated power/ground ball arrays for low-noise operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.05 V ±3% input - powers Blackfin+ core logic; requires local low-ESR decoupling |
| VDD_IO | I/O power supply | 3.3 V or 1.8 V selectable - configures GPIO voltage level and peripheral interface compatibility |
| CLKIN | External clock input | Accepts 1–50 MHz crystal or CMOS clock - feeds PLL for SYSCLK generation up to 400 MHz |
| RESET | Active-low reset input | Synchronous deassertion required; initiates secure boot sequence from L2 ROM or external memory |
| BOOT_CFG[2:0] | Boot mode configuration | Three-pin strap determines master/slave boot source (SPI, UART, USB, or external host) |
| DMC_DQ[15:0] | DDR2/LPDDR data bus | 16-bit bidirectional data interface - enables high-bandwidth off-chip memory access for video buffering |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot with Crypto Engine | Hardware-accelerated AES/SHA-1/SHA-256 and memDMA encryption enable authenticated, tamper-resistant firmware loading |
| Dual CAN 2.0B Interfaces | Independent CAN controllers with message RAM and filtering - support ASAM MCD-2 MC and AUTOSAR CAN TP stack deployment |
| Flexible GPIO Multiplexing | Each pin supports up to 4 peripheral functions + GPIO - simplifies board routing and enables dynamic peripheral reassignment in software |
| Hardware Event Sequencing (TRU) | Trigger Routing Unit enables autonomous DMA chaining and peripheral synchronization without CPU intervention - reduces ISR latency by >60% |
| Memory Protection Unit (MPU) | Configurable region-based protection for L1/L2 memory - enforces task isolation in RTOS environments (e.g., FreeRTOS, SafeRTOS) |
Applications
| Automotive ADAS Sensor Fusion | Industrial Motor Control |
|---|---|
Use Scenario: Real-time fusion of radar, camera, and ultrasonic sensor data in compact ECU modules. IC Role / Device Role / Timing Role: Central deterministic processor executing Kalman filters, FFTs, and CAN message aggregation at 400 MHz with sub-μs interrupt latency. Use Value: 1 MB ECC-L2 SRAM stores multiple sensor buffers; dual CAN interfaces handle chassis and powertrain networks simultaneously. | Use Scenario: Closed-loop field-oriented control (FOC) of BLDC/PMSM motors in HVAC compressors and EV auxiliary systems. IC Role / Device Role / Timing Role: Real-time PWM generation, current sampling, and PI loop execution with hardware-accelerated 32-bit MAC operations. Use Value: Dual 16-bit MAC per cycle achieves ≤1 μs current loop update; 8-channel GP timers synchronize 6-phase gate drivers. |
| Medical Ultrasound Beamforming | Smart Energy Gateway |
Use Scenario: Portable ultrasound devices requiring low-power, high-precision digital beam synthesis and image reconstruction. IC Role / Device Role / Timing Role: Signal processor for FIR filtering, envelope detection, and log compression - leveraging 16-bit complex MAC and video ALUs. Use Value: 136 kB parity-protected L1 SRAM ensures deterministic access to delay profiles; HADC interface supports 4-channel 12-bit analog front-end sampling. | Use Scenario: DIN-rail-mounted energy meters with DLMS/COSEM protocol support, tariff switching, and grid event logging. IC Role / Device Role / Timing Role: Secure application host managing TLS 1.2 communication, crypto-accelerated metering data signing, and RTC-synchronized load profiling. Use Value: OTP memory stores device-specific keys; AEC-Q100 qualification ensures reliability across −40°C to +105°C ambient operating range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded DSP/microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF706WCBCZ311 | Same 184-ball CSP_BGA package, identical peripherals, but 512 kB L2 SRAM (vs. 1 MB) and no DDR2/LPDDR interface | Targeted at cost-sensitive industrial control where external DRAM is unnecessary | Select when L2 memory requirement ≤512 kB and L3 DRAM interface is unused |
| ADSP-BF707WCBCZ311 | Same package and full feature set as ADBF705WCBCZ311, but qualified to AEC-Q100 Grade 2 (−40°C to +105°C, extended life test) | Required for mission-critical automotive domains (e.g., powertrain, braking) demanding longer lifetime validation | Select when Grade 2 qualification and extended reliability testing are mandated by OEM spec |
Compared with ADBF705WCBCZ311, ADSP-BF706WCBCZ311 reduces L2 capacity and removes DRAM support for lower BOM cost, while ADSP-BF707WCBCZ311 adds Grade 2 lifecycle validation - making ADBF705WCBCZ311 the optimal balance of memory, interface flexibility, and automotive qualification for ADAS and gateway applications.
Availability
ADBF705WCBCZ311 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial motor drives, portable medical imaging systems, and smart energy gateways requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.
Supply support for ADBF705WCBCZ311 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Norwood, MA, serving automotive, industrial, communications, and healthcare markets.
The ADSP-BF70x product line delivers scalable Blackfin+ processors optimized for real-time signal processing in safety-aware embedded systems - combining DSP acceleration, MCU programmability, and automotive-grade reliability in a single chip.
FAQ
What is the maximum operating temperature range certified for ADBF705WCBCZ311?
ADBF705WCBCZ311 is AEC-Q100 qualified to Grade 3, supporting continuous operation from −40°C to +105°C ambient temperature. This rating is validated across all electrical parameters including core frequency, memory timing, and peripheral functionality - making it suitable for under-dash automotive infotainment and body control modules where thermal management is constrained.
Does ADBF705WCBCZ311 support external DDR2 or LPDDR memory?
Yes, ADBF705WCBCZ311 supports external DDR2 and LPDDR SDRAM via its dedicated 16-bit L3 interface, accessible only on the 184-ball CSP_BGA package. The Dynamic Memory Controller (DMC) complies with JESD79-2E (DDR2) and JESD209A (LPDDR) standards and includes on-die termination for robust signal integrity at up to 200 MHz data rates.
How much on-chip SRAM does ADBF705WCBCZ311 provide, and how is it protected?
ADBF705WCBCZ311 provides 136 kB of L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), all protected by multi-parity-bit error detection. It also includes 1 MB of L2 SRAM with full ECC protection - enabling single-bit error correction and double-bit error detection for functional safety compliance in IEC 61508 SIL-2 and ISO 26262 ASIL-B applications.
Which communication interfaces are integrated into ADBF705WCBCZ311?
ADBF705WCBCZ311 integrates 2× CAN 2.0B controllers, 2× UARTs, 2× SPORTs, 1× USB 2.0 HS OTG, 1× PPI, 2× Quad SPI, 1× Dual SPI, 1× TWI (I²C), and an SD/SDIO (MSI) interface. All are accessible via multiplexed GPIO pins and support concurrent operation - enabling simultaneous CAN diagnostics, USB firmware updates, and SPI sensor acquisition.
Is ADBF705WCBCZ311 pin-compatible with other ADSP-BF70x variants?
ADBF705WCBCZ311 shares the same 184-ball CSP_BGA footprint and ball map with ADSP-BF706WCBCZ311 and ADSP-BF707WCBCZ311, enabling direct PCB reuse across the BF705/BF706/BF707 family. However, differences in L2 memory size, DDR2/LPDDR support, and AEC-Q100 grade require firmware and power delivery validation before substitution.
ADBF705WCBCZ311 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 184-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Blackfin+
- Interface:
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 300MHz
- Non-Volatile Memory:
- ROM (512kB)
- On-Chip RAM:
- 512kB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 184-CSPBGA (12x12)
ADBF705WCBCZ311 FAQ
1.How can I place an order for ADBF705WCBCZ311 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADBF705WCBCZ311 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADBF705WCBCZ311 reliable?
The price and inventory of ADBF705WCBCZ311 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADBF705WCBCZ311 is usually 5 days.
3.What payment methods are accepted for ADBF705WCBCZ311?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADBF705WCBCZ311 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADBF705WCBCZ311?
ADBF705WCBCZ311 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADBF705WCBCZ311 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADBF705WCBCZ311?
For technical support, including ADBF705WCBCZ311 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADBF705WCBCZ311 requirements.
6.How does Aetrix verify that ADBF705WCBCZ311 is sourced from the original manufacturer or authorized distributors?
All ADBF705WCBCZ311 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADBF705WCBCZ311 meets industry standards.
7.What is the process for return or replacement of ADBF705WCBCZ311?
All ADBF705WCBCZ311 units undergo pre-shipment inspection (PSI). If there is an issue with ADBF705WCBCZ311, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADBF705WCBCZ311 part is unused and in its original packaging.
Return procedure for ADBF705WCBCZ311:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADBF705WCBCZ311 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
