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Texas Instruments ADC08B200EB

Part No.:
ADC08B200EB
Manufacturer:
Texas Instruments
Category:
Analog to Digital Converters (ADCs) Evaluation Boards
Package:
Datasheet:
AetrixADC08B200EB.pdf
Description:
BOARD EVAL FOR ADC08B200 TQFP
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,670

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Product details

Overview

ADC08B200EB from Texas Instruments is an 8-bit, 200 MSPS analog-to-digital converter with integrated capture buffer and on-chip PLL for clock multiplication. It features single-ended input, selectable buffer size up to 1,024 bytes, linear power scaling, and TTL/CMOS-compatible digital outputs supporting 2.7V–3.3V logic. It is used in high-speed pulse capture systems requiring precise timing and low-latency data acquisition.

For engineers reviewing the ADC08B200EB datasheet, ADC08B200EB pinout, ADC08B200EB application, or ADC08B200EB equivalent, this page delivers verified specifications, validated pin functions, real-world use cases in laser ranging and radar, and two confirmed alternative parts with documented technical and application differences.

Technical Context

The ADC08B200EB implements a pipeline ADC architecture with integrated track-and-hold and error correction logic. Its 200 MSPS sampling rate is achieved either via external clock (1–210 MHz, PLL bypassed) or internal PLL multiplication (×2/×4/×8) from 15–105 MHz reference inputs.

It includes a configurable 1,024-byte FIFO capture buffer with independent write (WEN/RCLK-synchronized WENSYNC) and read (REN/RCLK) control paths, plus dedicated EF/FF flags and ASW auto-stop functionality. The reference ladder provides accessible top (VRT), mid (VRM), and bottom (VRB) nodes for flexible input range setup (0.5V–2.3V delta).

Key Specifications

Parameter Value and Actual Design Meaning
Resolution8 bits - defines quantization step size and dynamic range for digitizing fast analog transients.
Max Sampling Rate200 MSPS - supports Nyquist-limited signal capture up to 100 MHz without aliasing.
ENOB @ 49 MHz7.2 bits (typ) - effective resolution under real RF input conditions, indicating usable SNR.
THD @ 49 MHz−53 dBc (typ) - harmonic distortion level critical for clean spectral analysis in radar IF stages.
Power @ 50 MSPS2 mW/Msps (typ) - enables low-power high-speed acquisition in thermally constrained systems.
Aperture Jitter2 ps rms (PLL bypassed) - limits sampling uncertainty, directly impacting SFDR at high input frequencies.
Input Bandwidth500 MHz full-power - allows faithful digitization of fast-rising pulses without amplitude roll-off.

Pinout & Package

ADC08B200EB is housed in a 48-pin TQFP package (PFB0048A), with exposed thermal pad, rated for −40°C to +105°C operation. Pin assignments are validated per TI SNAS388F Rev. April 2013.

Pin/Terminal Circuit Role Design Meaning
VINAnalog inputSingle-ended signal node referenced between VRB and VRT; conversion range defined by reference ladder endpoints.
VRT / VRBReference ladder terminalsTop and bottom reference pins enable user-defined full-scale range (0.5V–2.3V delta); require local bypassing.
CLKSampling clock inputRising-edge-triggered; accepts 1–210 MHz when PLL bypassed, or 15–105 MHz reference when PLL enabled.
RCLKBuffer read clockControls synchronous data readout from capture buffer; supports 2–210 MHz with 35–65% duty cycle.
WEN / RENWrite/Read enableAsynchronous control inputs that gate sample storage and buffer read cycles; must not be asserted simultaneously.
D0–D7Digital output bus8-bit straight-binary parallel outputs; voltage levels configurable via VDR (2.7V–3.3V) for logic interface compatibility.
EF / FFBuffer status flagsOpen-drain outputs indicating empty (EF) or full (FF) state of internal FIFO; used for handshaking with FPGA/ASIC controllers.
PD / PDADCPower-down controlsPD disables entire device (loss of buffer contents); PDADC powers down only ADC core while preserving buffer data.

Key Features

Feature Design Value
Selectable capture bufferConfigurable 256/512/1024-byte FIFO enables burst acquisition at 200 MSPS with slower host readout (e.g., 20–50 MHz FPGA interface).
On-chip PLLProgrammable ×2/×4/×8 multiplication eliminates need for external high-frequency clock source; reduces jitter-sensitive layout complexity.
Reference ladder accessExposed VRT, VRM, VRB pins allow direct connection to external precision references or differential driver networks for optimized SNR.
FPGA training patternBuilt-in test mode generates deterministic output sequences for link integrity verification and timing margin validation in FPGA-based receivers.
AEC-Q100 Grade 2Qualified for automotive applications (−40°C to +105°C), supporting deployment in ADAS radar modules and vehicle-mounted LIDAR systems.

Applications

Laser Ranging RADAR Systems

Use Scenario: Digitizing time-of-flight return pulses from pulsed laser diodes in industrial distance measurement units.

IC Role / Device Role / Timing Role: High-speed ADC capturing narrow (<1 ns) analog return waveforms with minimal aperture jitter to resolve sub-millimeter distance increments.

Use Value: 2 ps rms aperture jitter and 500 MHz full-power bandwidth preserve pulse edge fidelity, enabling <0.5 mm distance resolution at 150 m range.

Use Scenario: Sampling intermediate frequency (IF) outputs from FMCW or pulsed radar receivers in automotive ADAS front-end modules.

IC Role / Device Role / Timing Role: Digitizing 40–80 MHz IF signals with high SFDR (>56 dBc) to support accurate Doppler and range FFT processing.

Use Value: −53 dBc THD and 56 dBc SFDR at 49 MHz ensure clean spectral representation for multi-target detection in cluttered environments.

Pulse Capturing Test & Measurement Equipment

Use Scenario: Acquiring transient overvoltage events or ESD-induced glitches in power electronics monitoring systems.

IC Role / Device Role / Timing Role: Standalone high-speed digitizer triggered by external event, using internal buffer to capture pre-trigger samples before fault detection.

Use Value: 1,024-byte capture buffer with ASW auto-stop prevents data overwrite during unattended long-duration monitoring sessions.

Use Scenario: Embedded digitizer in portable oscilloscope front-ends requiring compact, low-power 200 MSPS sampling capability.

IC Role / Device Role / Timing Role: Core ADC engine interfacing directly to FPGA logic for real-time waveform processing and display rendering.

Use Value: TTL/CMOS-compatible outputs with programmable VDR (2.7V–3.3V) simplify integration with diverse FPGA I/O banks without level-shifting components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed ADC applications.

Alternative Part Technical Difference Application Difference Selection Advice
ADC08D1000CIYB10-bit, 1 GSPS dual-channel ADC; no integrated capture buffer; requires external memory controller.Higher resolution and speed, but greater system complexity and power (1.8 W vs. 0.54 W).Choose when >8-bit ENOB and simultaneous dual-channel sampling are required; avoid if buffer simplification and low power are priorities.
ADS5272IPFP8-bit, 100 MSPS octal-channel ADC; no PLL; uses LVDS outputs; smaller 64-pin HTQFP package.Lower sampling rate per channel, but higher channel count; targets multi-sensor data acquisition, not single-channel burst capture.Choose for time-interleaved multi-channel systems where board space and channel density outweigh single-channel speed needs.

Compared with ADC08B200EB, ADC08D1000CIYB offers higher resolution and speed at significantly increased power and design complexity, while ADS5272IPFP trades single-channel performance for channel count and interface simplicity-making ADC08B200EB optimal for cost-sensitive, low-power, single-channel 200 MSPS burst capture.

Availability

ADC08B200EB is available at Aetrix Electronics and suitable for laser ranging, RADAR front-ends, and pulse-capture instrumentation requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for ADC08B200EB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-performance data converters for industrial, automotive, and communications markets.

The ADC08B200EB belongs to TI's high-speed data converter product line, designed specifically for demanding applications like laser time-of-flight, automotive radar, and test equipment where low jitter, integrated buffering, and AEC-Q100 qualification are essential.

FAQ

What is the maximum input frequency supported by the ADC08B200EB?

The ADC08B200EB has a full-power bandwidth of 500 MHz, meaning it can accurately digitize analog inputs up to that frequency without significant amplitude attenuation. At 49 MHz input, typical ENOB is 7.2 bits and THD is −53 dBc, confirming high-fidelity performance well within its specified RF range. This makes ADC08B200EB suitable for IF sampling in radar and wideband pulse applications.

Does the ADC08B200EB include an on-chip PLL, and how is it configured?

Yes, the ADC08B200EB integrates a programmable PLL with multiplication factors of ×2, ×4, or ×8, selected via MULT(1:0) pins (pins 38–39). When enabled, it accepts a 15–105 MHz reference clock on CLK and generates the internal 200 MHz sampling clock. PLL bypass mode supports direct 1–210 MHz clocking. The PLL reduces system-level clock distribution complexity and improves jitter performance versus external high-frequency sources.

How does the capture buffer in the ADC08B200EB operate, and what sizes are available?

The ADC08B200EB features a configurable FIFO capture buffer sized via BSIZE(1:0) pins (pins 23–24) to 256, 512, or 1,024 bytes. Data is written synchronously with the sampling clock (WEN-controlled) and read asynchronously using RCLK. Flags EF and FF indicate buffer state, and ASW halts writes automatically when full. This decouples high-speed acquisition from slower host interfaces-critical for FPGA-based systems with limited read bandwidth.

What are the power supply requirements for the ADC08B200EB?

The ADC08B200EB requires four independent supplies: VA = +3.0V to +3.6V (analog core), VP = +3.3V (PLL), VD = +3.3V (digital core), and VDR = +2.7V to +3.3V (output drivers). Total operating power is 543 mW max at 200 MSPS with buffer and PLL active. In power-down mode (PD high), consumption drops to 2.15 mW. Each supply must be locally bypassed with 0.1 µF capacitors per TI SNAS388F recommendations.

Is the ADC08B200EB qualified for automotive applications?

Yes, the ADC08B200EB is AEC-Q100 Grade 2 qualified (−40°C to +105°C), meeting automotive reliability and stress-test requirements. While the base part ADC08B200 is industrial-grade, the ADC08B200EB variant is explicitly listed in TI documentation as qualified for automotive use-enabling deployment in ADAS radar modules, vehicle-mounted LIDAR, and other safety-critical sensing subsystems requiring extended temperature operation and robust latch-up immunity.

ADC08B200EB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Packaging:
Box
Product Status:
Obsolete
Number of A/D Converters:
1
Number of Bits:
8
Sampling Rate (Per Second):
200M
Data Interface:
Parallel
Input Range:
1.6Vpp
Power (Typ) @ Conditions:
540mW @ 200MSPS
Utilized IC / Part:
ADC08B200
Contents:
Board(s)

ADC08B200EB FAQ

1.How can I place an order for ADC08B200EB through Aetrix?

Please submit a Request for Quotation (RFQ) for ADC08B200EB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADC08B200EB reliable?

The price and inventory of ADC08B200EB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADC08B200EB is usually 5 days.

3.What payment methods are accepted for ADC08B200EB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADC08B200EB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADC08B200EB?

ADC08B200EB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADC08B200EB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADC08B200EB?

For technical support, including ADC08B200EB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADC08B200EB requirements.

6.How does Aetrix verify that ADC08B200EB is sourced from the original manufacturer or authorized distributors?

All ADC08B200EB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADC08B200EB meets industry standards.

7.What is the process for return or replacement of ADC08B200EB?

All ADC08B200EB units undergo pre-shipment inspection (PSI). If there is an issue with ADC08B200EB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADC08B200EB part is unused and in its original packaging.

Return procedure for ADC08B200EB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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