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Analog Devices Inc. ADG3245BCP

Part No.:
ADG3245BCP
Manufacturer:
Analog Devices Inc.
Category:
Signal Switches, Multiplexers, Decoders
Package:
20-WFQFN Exposed Pad, CSP
Datasheet:
AetrixADG3245BCP.pdf
Description:
IC SW BUS 2.5/3.3V 8BIT 20LFCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,039

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Product details

Overview

ADG3245BCP from Analog Devices is an 8-bit, 2-port, bidirectional digital bus switch with integrated level translation capability. It operates from 2.5 V or 3.3 V supplies, delivers 225 ps propagation delay, supports 1.244 Gbps data rate, and enables selectable voltage translation (3.3 V ↔ 2.5 V, 3.3 V ↔ 1.8 V, 2.5 V ↔ 1.8 V) in systems such as ADC-to-microcontroller interfacing.

For engineers reviewing the ADG3245BCP datasheet, ADG3245BCP pinout, ADG3245BCP application, or ADG3245BCP equivalent, key selection criteria include verified level-shifting configurations, sub-nanosecond timing performance, on-resistance matching under multiple supply/SEL conditions, thermal behavior in LFCSP package, and hot-swap isolation capability without external buffering.

Technical Context

The ADG3245BCP implements a low-voltage CMOS NMOS-only switch architecture with no PMOS devices, enabling fast switching and low ground bounce. Its internal SEL-controlled VCC reduction path allows true 3.3 V-to-1.8 V translation when SEL = 0 V and VCC = 3.3 V, distinct from passive resistor-based solutions.

Propagation delay is dominated by RON–CL time constant (typ. 4.5 Ω × 50 pF = 225 ps), not logic gate delay; bus enable/disable times vary with SEL state (e.g., tPZH = 0.5–3.3 ns when SEL = 0 V), confirming dynamic control of translation mode and isolation timing.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage2.3 V to 3.6 V - supports dual-rail operation across 2.5 V and 3.3 V system domains
Propagation Delay (A↔B)225 ps typ. at CL = 50 pF - enables high-speed serial links up to 1.244 Gbps without retiming
On Resistance (RON)4.5 Ω typ. at VA = 0 V, VCC = 3 V, SEL = VCC - ensures minimal signal attenuation and voltage drop in active path
Level Translation Modes3.3 V ↔ 2.5 V, 3.3 V ↔ 1.8 V, 2.5 V ↔ 1.8 V - selected via SEL pin; no external components required
Small Signal Bandwidth610 MHz - supports clean analog video or high-frequency digital waveform pass-through
Off-State Leakage±1 μA max - maintains signal integrity during bus isolation and hot-swap events
Package Options20-lead LFCSP (4 mm × 4 mm) and TSSOP - LFCSP reduces PCB area by 57% vs. TSSOP

Pinout & Package

The ADG3245BCP is available in a 20-lead LFCSP (CP-20-6) package with exposed thermal pad (EP), optimized for space-constrained and thermally demanding applications. Pin 1 indicator and flow-through layout (A-port inputs on left, B-port outputs on right) simplify PCB routing and reduce crosstalk.

Pin/TerminalCircuit RoleDesign Meaning
BEBus Enable (Active Low)Asserting low connects A↔B ports; high places both ports in high-Z isolation state
SELLevel Translation SelectLow enables 3.3 V-to-1.8 V translation; high enables 3.3 V-to-2.5 V or 2.5 V-to-1.8 V modes
A0–A7Port A Bidirectional I/OConnects to source-side bus (e.g., 3.3 V ADC); direction determined by BE and signal flow
B0–B7Port B Bidirectional I/OConnects to sink-side bus (e.g., 2.5 V microcontroller); voltage level set by VCC and SEL state
VCCPositive SupplyPrimary power rail (2.3–3.6 V); sets maximum output clamping voltage per translation mode
GNDGround Reference0 V return path; EP pad must be soldered to grounded copper plane for thermal compliance

Key Features

FeatureDesign Value
Sub-250 ps propagation delayEnables direct connection between high-speed interfaces (e.g., FPGA I/O and memory bus) without timing budget penalty
Selectable translation modesSingle SEL pin configures three distinct voltage domain crossings-eliminates need for multiple discrete translators
610 MHz small-signal bandwidthPreserves edge integrity for NRZ data up to 1.244 Gbps and supports analog video switching without distortion
4.5 Ω typical on-resistanceMinimizes IR drop and reflection-induced jitter in point-to-point digital links with 50 pF load
LFCSP thermal performanceJA = 30.4°C/W enables stable operation at +85°C ambient in compact industrial enclosures without heatsinking

Applications

ADC-to-Microcontroller InterfaceHot-Swap Backplane Isolation

Use Scenario: Interfacing a 3.3 V SAR ADC to a 2.5 V microcontroller with non-3.3 V-tolerant GPIO.

IC Role / Device Role / Timing Role: Bidirectional level-translating bus switch that clamps ADC outputs to 2.5 V while preserving timing integrity.

Use Value: Eliminates need for external level shifters or series resistors; maintains 225 ps propagation delay and <50 ps channel jitter.

Use Scenario: Protecting a live backplane during insertion of a peripheral card with mismatched supply domains.

IC Role / Device Role / Timing Role: High-Z isolation switch controlled by hot-plug controller to decouple card I/O before physical mating.

Use Value: Limits inrush current and prevents bus contention; output clamping (e.g., 3.3 V → 1.8 V) avoids overvoltage damage to downstream logic.

Multi-Voltage Memory SubsystemVideo Signal Routing

Use Scenario: Sharing a common address/data bus between 3.3 V flash memory and 1.8 V LPDDR2 controller.

IC Role / Device Role / Timing Role: Direction-agnostic bus switch enabling bidirectional translation with SEL = 0 V for 3.3 V ↔ 1.8 V operation.

Use Value: Supports simultaneous read/write cycles across voltage domains without clock-domain crossing logic or FIFO buffering.

Use Scenario: Routing RGB video signals from a 3.3 V graphics processor to a 1.8 V display driver IC.

IC Role / Device Role / Timing Role: Analog-capable digital switch leveraging 610 MHz bandwidth and low on-capacitance (10 pF) for minimal signal degradation.

Use Value: Maintains >95% eye width at 1.244 Gbps; eliminates need for dedicated analog switches with higher cost and larger footprint.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus-switching and level-translation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74AVC8T245RHLR8-bit dual-supply translator with separate VCCA/VCCB rails; no internal SEL-driven VCC scaling; RON ≈ 6.5 ΩRequires two independent supplies; lacks single-pin 3.3 V→1.8 V mode; better for fixed dual-rail systemsChoose when board already provides isolated 1.8 V and 3.3 V rails and deterministic direction control is preferred
TXS0108EPRJRAuto-direction sensing; open-drain I/O; higher RON (12 Ω typ.); no guaranteed 1.244 Gbps operationDesigned for I²C/SPI with weak pull-ups; unsuitable for high-speed parallel buses or analog signalsChoose only for low-speed, multi-master digital buses where direction detection simplifies firmware

Compared with SN74AVC8T245RHLR and TXS0108EPRJR, the ADG3245BCP uniquely integrates SEL-configurable translation, sub-250 ps delay, and 610 MHz analog bandwidth-making it the only option supporting simultaneous high-speed digital and analog signal routing across three voltage pairs in a single 4 mm × 4 mm package.

Availability

ADG3245BCP is available at Aetrix Electronics and suitable for ADC interfacing, hot-swap backplanes, multi-voltage memory subsystems, and video signal routing requiring stable component supply and RoHS-compliant packaging.

Supply support for ADG3245BCP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and healthcare markets.

The ADG3245BCP belongs to Analog Devices' precision bus switch and level translation product line, engineered specifically for seamless interoperability between mixed-voltage digital subsystems without compromising speed, signal fidelity, or thermal efficiency.

FAQ

What voltage translation modes does the ADG3245BCP support?

The ADG3245BCP supports three translation modes: 3.3 V ↔ 2.5 V (SEL = VCC), 2.5 V ↔ 1.8 V (SEL = VCC, VCC = 2.5 V), and 3.3 V ↔ 1.8 V (SEL = 0 V, VCC = 3.3 V). Each mode is validated per the ADG3245BCP datasheet's DC electrical characteristics and pass-voltage tables, with output clamping confirmed at 2.5 V, 1.8 V, and 1.8 V respectively under specified load conditions.

How does the SEL pin affect ADG3245BCP operation?

The SEL pin on the ADG3245BCP controls internal VCC scaling: when low, it activates circuitry that reduces effective VCC to enable 3.3 V-to-1.8 V translation; when high, it permits standard 3.3 V-to-2.5 V or 2.5 V-to-1.8 V operation. The ADG3245BCP truth table explicitly defines BE/SEL combinations and their functional outcomes, including isolation state when BE is high regardless of SEL.

What is the maximum data rate supported by the ADG3245BCP?

The ADG3245BCP supports a maximum data rate of 1.244 Gbps, measured under conditions of VCC = SEL = 3.3 V and VA/VB = 2 V input swing. This rating is validated by eye diagram testing (TPC 20) and jitter characterization (TPC 18), with 50 ps p-p channel jitter and >95% eye width at 1.244 Gbps-performance metrics directly tied to the ADG3245BCP's 225 ps propagation delay and 610 MHz bandwidth.

Can the ADG3245BCP be used in analog signal paths?

Yes, the ADG3245BCP is qualified for analog switching applications due to its 610 MHz small-signal bandwidth, 10 pF on-capacitance, and low 4.5 Ω on-resistance. Application note figures (TPC 13–15) confirm frequency response, crosstalk (<−70 dB at 100 MHz), and off-isolation (>−70 dB), validating use in RGB video routing and other analog signal paths where the ADG3245BCP's NMOS-only architecture preserves signal integrity without distortion.

What thermal considerations apply to the ADG3245BCP in LFCSP package?

The ADG3245BCP in LFCSP (CP-20-6) has a junction-to-ambient thermal resistance (θJA) of 30.4°C/W. To maintain operation within the −40°C to +85°C industrial range, the exposed pad (EP) must be soldered to a solid grounded copper plane per the ADG3245BCP pin configuration guidelines. Failure to thermally connect EP results in excessive junction temperature rise, potentially exceeding the 150°C absolute maximum rating during sustained 1.244 Gbps operation.

ADG3245BCP Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
20-WFQFN Exposed Pad, CSP
Packaging:
Bag
Product Status:
Obsolete
Type:
FET Bus Switch
Circuit:
8 x 1:1
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-LFCSP (4x4)

ADG3245BCP FAQ

1.How can I place an order for ADG3245BCP through Aetrix?

Please submit a Request for Quotation (RFQ) for ADG3245BCP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADG3245BCP reliable?

The price and inventory of ADG3245BCP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADG3245BCP is usually 5 days.

3.What payment methods are accepted for ADG3245BCP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADG3245BCP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADG3245BCP?

ADG3245BCP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADG3245BCP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADG3245BCP?

For technical support, including ADG3245BCP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADG3245BCP requirements.

6.How does Aetrix verify that ADG3245BCP is sourced from the original manufacturer or authorized distributors?

All ADG3245BCP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADG3245BCP meets industry standards.

7.What is the process for return or replacement of ADG3245BCP?

All ADG3245BCP units undergo pre-shipment inspection (PSI). If there is an issue with ADG3245BCP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADG3245BCP part is unused and in its original packaging.

Return procedure for ADG3245BCP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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