Analog Devices Inc. ADG3245BCPZ

Overview

ADG3245BCPZ from Analog Devices is an 8-bit, 2-port, bidirectional digital bus switch with integrated level translation capability. It supports 3.3 V/2.5 V supply operation, delivers 225 ps propagation delay, enables 1.244 Gbps data rate, and provides selectable 3.3 V→2.5 V, 3.3 V→1.8 V, or 2.5 V→1.8 V voltage translation - ideal for interfacing ADCs to microcontrollers across mixed-voltage domains.

For engineers reviewing the ADG3245BCPZ datasheet, ADG3245BCPZ pinout, ADG3245BCPZ application, or ADG3245BCPZ equivalent, key selection criteria include verified level-shifting directionality, sub-nanosecond propagation delay matching, on-resistance consistency under varying input voltages, thermal performance of the 4 mm × 4 mm LFCSP package, and BE/SEL control timing behavior across temperature and supply conditions.

Technical Context

The ADG3245BCPZ implements a low-voltage CMOS NMOS-only switch architecture with no PMOS devices, enabling rail-to-rail analog-compatible signal pass-through while limiting maximum output voltage via internal clamping. Its bidirectional switching is controlled by an active-low bus enable (BE) signal, and level translation mode is selected via the SEL pin - low for 3.3 V→1.8 V, high for 3.3 V→2.5 V or 2.5 V→1.8 V translation.

Propagation delay is dominated by R_ON–C_L time constant rather than logic gate delay; typical R_ON ranges from 4.5 Ω to 28 Ω depending on input voltage and SEL state, and off-capacitance is 5 pF per port. The device maintains high-impedance isolation during power-up when BE is pulled high, and supports hot-swap protection by clamping outputs below V_CC.

Key Specifications

Pinout & Package

The ADG3245BCPZ is packaged in a 20-lead LFCSP_WQ (4 mm × 4 mm, CP-20-6) with exposed pad (EP) for thermal and electrical grounding. Pin 1 is marked by a dot; EP must be soldered to a grounded copper plane for optimal thermal performance (θ_JA = 30.4°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital bus switching applications.

Compared with SN74AVC8T245RHLR and TXS0108EPRJR, the ADG3245BCPZ offers uniquely low propagation delay, true bidirectional operation without direction control, and configurable translation modes - making it the optimal choice for timing-critical, mixed-voltage parallel bus bridging where layout simplicity and signal fidelity are prioritized.

Availability

ADG3245BCPZ is available at Aetrix Electronics and suitable for industrial embedded systems, telecom line cards, and medical data acquisition equipment requiring stable component supply and long-term lifecycle support.

Supply support for ADG3245BCPZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA.

The ADG3245BCPZ belongs to Analog Devices' precision bus switch and level translation product line, engineered specifically for low-latency, low-noise voltage domain bridging in high-reliability industrial and communications infrastructure.

FAQ

What is the maximum data rate supported by the ADG3245BCPZ?

The ADG3245BCPZ supports a maximum data rate of 1.244 Gbps when operated with V_CC = SEL = 3.3 V and input swing of 2 V_p-p. This is validated using PRBS31 test patterns with measured jitter of 50 ps_p-p and eye width exceeding 85% at that rate. Performance degrades at lower supplies: at V_CC = SEL = 2.5 V, the usable rate is ~1 Gbps per the eye diagram characterization in the datasheet.

How does the SEL pin configure level translation modes in the ADG3245BCPZ?

The SEL pin selects translation behavior in the ADG3245BCPZ: when SEL = 0 V (logic low), the device performs 3.3 V → 1.8 V translation; when SEL = V_CC (logic high), it supports either 3.3 V → 2.5 V or 2.5 V → 1.8 V translation depending on the applied V_CC. SEL must be tied to V_CC if unused, and SEL = 0 V is only permitted when V_CC = 3.3 V ± 10%, as specified in the Absolute Maximum Ratings table.

Can the ADG3245BCPZ be used for analog signal switching?

Yes, the ADG3245BCPZ can be used for analog switching applications such as video graphics routing, provided signal amplitudes remain within the device's pass-voltage limits (e.g., ≤2.1 V for 2.5 V operation). Its 10 pF on-capacitance, 610 MHz small-signal bandwidth, and low R_ON variation make it suitable for DC-coupled analog paths - but it lacks rail-to-rail output swing due to NMOS-only architecture, so AC-coupled or clamped designs may be needed for full-scale signals.

What is the thermal resistance (θ_JA) of the ADG3245BCPZ in its LFCSP package?

The ADG3245BCPZ in the 20-lead LFCSP_WQ package (CP-20-6) has a junction-to-ambient thermal resistance (θ_JA) of 30.4°C/W when the exposed pad (EP) is properly soldered to a grounded copper plane. This value assumes standard JEDEC 2-layer board conditions; inadequate EP thermal connection increases θ_JA significantly and risks thermal shutdown under sustained 1.244 Gbps operation.

Does the ADG3245BCPZ require external pull-up or pull-down resistors on BE or SEL?

The BE pin should be pulled high via an external resistor (value determined by driver sink strength) to ensure high-impedance state during power-up/power-down. SEL has no internal bias; if unused, it must be hard-wired to V_CC (not left floating) to guarantee predictable translation mode. Neither pin requires pull-down resistors - BE is active-low and SEL is referenced to V_CC, so logic levels are defined solely by connection to V_CC or GND.