Analog Devices Inc. ADG3246BCP
- Part No.:
- ADG3246BCP
- Manufacturer:
- Analog Devices Inc.
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-WFQFN Exposed Pad, CSP
- Datasheet:
-
ADG3246BCP.pdf
- Description:
- IC SW BUS 2.5/3.3V 10BIT 24LFCSP
- Quantity:
- Payment:

- Shipping:

Inventory:10,166
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Product details
Overview
ADG3246BCP from Analog Devices is a 2.5 V/3.3 V, 10-bit, 2-port level-translating bus switch with 4.5 Ω on-resistance, 225 ps propagation delay, and support for 1.244 Gbps data rates. It enables bidirectional voltage translation between 3.3 V ↔ 2.5 V, 2.5 V ↔ 1.8 V, and 3.3 V ↔ 1.8 V domains in mixed-supply digital interfaces.
For engineers reviewing the ADG3246BCP datasheet, ADG3246BCP pinout, ADG3246BCP application, or ADG3246BCP equivalent, this device serves as a low-latency, low-capacitance interface solution for ADC-to-microcontroller bridging, hot-swap isolation, and high-speed bus domain partitioning where precise level control and timing integrity are critical.
Technical Context
The ADG3246BCP implements a single-pole, single-throw NMOS-based switch architecture per channel, with internal level-shifting circuitry controlled by the active-low SEL pin. Its operation relies on VCC-supplied rail clamping to enforce output voltage limits-2.5 V when VCC = 3.3 V and SEL = high, 1.8 V when SEL = low, and 1.8 V when VCC = 2.5 V and SEL = high.
It features true bidirectional signal flow with no direction pin, 5 pF off-capacitance per port, and sub-2 ns enable/disable times across temperature. The device maintains high-impedance during power-up/down when BE is pulled up to VCC, and supports hot-plug protection via inherent output voltage limiting below VCC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 2.3 V to 3.6 V - Enables interoperability across 2.5 V and 3.3 V system rails without external regulators. |
| On Resistance (RON) | 4.5 Ω typ at VCC = 3 V, SEL = VCC - Ensures minimal IR drop and signal distortion for 8 mA drive capability. |
| Propagation Delay (tPD) | 0.225 ns typ at CL = 50 pF - Delivers near-zero added latency in high-speed serial or parallel bus paths. |
| Max Data Rate | 1.244 Gbps typ at VCC = 3.3 V - Supports multi-gigabit signaling in DDR, PCIe Gen1, or high-speed sensor interfaces. |
| Level Translation Modes | 3.3 V ↔ 2.5 V, 2.5 V ↔ 1.8 V, 3.3 V ↔ 1.8 V - Configurable via SEL pin; no external logic required for voltage domain bridging. |
| Off Capacitance (CA/B OFF) | 5 pF - Minimizes loading on source and destination buses during isolation, preserving signal integrity. |
| Operating Temperature | −40°C to +105°C - Qualified for industrial and automotive under-hood applications requiring extended thermal range. |
Pinout & Package
The ADG3246BCP is housed in a 24-lead LFCSP package (4 mm × 4 mm × 0.75 mm) with exposed pad (EPAD) for thermal and electrical grounding. Pin 1 is SEL (Level Translation Select, active low); pins 2–6 and 20–24 are bidirectional A-port signals (A0–A9); pins 8–17 are bidirectional B-port signals (B0–B9); pin 18 is BE (Bus Enable, active low); pin 19 is VCC; pin 7 is GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SEL | Level Translation Select | Active-low control that configures internal clamping: SEL = 0 enables 3.3 V → 1.8 V translation; SEL = 1 enables 3.3 V → 2.5 V or 2.5 V → 1.8 V modes. |
| BE | Bus Enable | Active-low global enable: asserts conduction path between A and B ports when low; places all channels in high-Z when high. |
| A0–A9, B0–B9 | Bidirectional Data Ports | 10 independent, fully bidirectional switch channels-no directionality constraint; each connects A[n] ↔ B[n] when BE = low. |
| VCC | Positive Supply | Single supply input (2.3 V–3.6 V) powering both logic and analog switch sections; defines translation reference and output clamp level. |
| GND / EPAD | Ground Reference & Thermal Pad | Primary ground return and thermal dissipation path; EPAD must be soldered to PCB ground plane for thermal compliance (θJA = 35°C/W). |
Key Features
| Feature | Design Value |
|---|---|
| Sub-250 ps propagation delay | Enables use in >1 Gbps serial links without introducing measurable timing skew or jitter degradation. |
| 4.5 Ω matched on-resistance | Ensures uniform signal attenuation and rise/fall time preservation across all 10 channels for parallel bus integrity. |
| Three-level translation modes | Eliminates need for discrete level shifters or dual-supply translators in mixed-voltage SoC, FPGA, or microcontroller interconnects. |
| 5 pF off-capacitance per port | Reduces bus loading by >50% vs. standard logic buffers, enabling longer trace lengths and higher fan-out without signal degradation. |
| Hot-swap safe output clamping | Prevents overvoltage stress on downstream 1.8 V or 2.5 V receivers during live insertion by limiting VB to ≤1.8 V or ≤2.5 V regardless of VA. |
Applications
| ADC-to-Microcontroller Interface | PCIe Gen1 Bus Isolation |
|---|---|
Use Scenario: Interfacing a 3.3 V SAR ADC to a 2.5 V microcontroller with non-3.3 V-tolerant I/O. IC Role / Device Role / Timing Role: Bidirectional level translator and bus switch that passes sampled data while clamping outputs to 2.5 V. Use Value: Eliminates external voltage dividers or dedicated level shifter ICs; preserves 1.244 Gbps timing margin for parallel 10-bit data capture. |
Use Scenario: Isolating PCIe Gen1 (2.5 Gbps) control lines between hot-pluggable add-in cards and host backplane. IC Role / Device Role / Timing Role: High-speed, low-capacitance bus switch enabling dynamic enable/disable of sideband signals (CLKREQ#, PERST#) during insertion. Use Value: Prevents bus contention and ground bounce during hot-swap events; 5 pF off-capacitance avoids violating PCIe AC timing specs. |
| FPGA I/O Domain Bridging | Docking Station Power Sequencing |
Use Scenario: Connecting 3.3 V peripheral I/O (USB PHY, SD card) to a 1.8 V FPGA bank requiring level translation. IC Role / Device Role / Timing Role: Configurable level translator activated via SEL to deliver 3.3 V → 1.8 V conversion for bidirectional data lanes. Use Value: Single-chip solution replaces multiple discrete translators; 225 ps delay ensures setup/hold timing margins remain intact at 100 MHz I/O speeds. |
Use Scenario: Enabling/disabling USB 2.0 and DisplayPort auxiliary channels in laptop docking stations during attach/detach. IC Role / Device Role / Timing Role: Hot-swap isolation switch that disconnects legacy peripherals before main power sequencing begins. Use Value: Output voltage clamping protects 1.8 V DP AUX receivers from 3.3 V transients; BE-controlled enable allows firmware-synchronized isolation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar level-translating bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AVC16T245DGGR | 16-bit, dual-supply (1.2 V–3.6 V), auto-direction sensing; higher ICC (20 μA typ), 6.5 Ω RON, 3.5 ns tPD. | Requires separate VCCA/VCCB supplies; suited for asymmetric voltage translation but lacks SEL-configurable clamping. | Choose for wider supply flexibility and directionless auto-sensing; avoid when strict 225 ps delay or single-supply simplicity is required. |
| TXS0108EPRJR | 8-bit, dual-supply (1.2 V–3.6 V), push-pull output; 10 ns tPD, 10 Ω RON, no SEL pin, open-drain compatible. | Designed for I²C/SMBus translation; not rated for >1 Gbps or hot-swap clamping; lacks B-port isolation control. | Choose only for low-speed, open-drain bus translation; unsuitable for high-speed parallel data or hot-swap protection roles of ADG3246BCP. |
Compared with SN74AVC16T245DGGR and TXS0108EPRJR, the ADG3246BCP delivers superior speed (225 ps vs. ≥3.5 ns), lower on-resistance (4.5 Ω vs. ≥6.5 Ω), and unique SEL-driven 3.3 V→1.8 V clamping-making it the only option qualified for simultaneous high-speed, hot-swap-safe, single-supply level translation in 10-bit parallel interfaces.
Availability
ADG3246BCP is available at Aetrix Electronics and suitable for industrial automation interfaces, high-speed data acquisition systems, and embedded docking station designs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for ADG3246BCP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, communications, and industrial markets since 1965.
The ADG3246BCP belongs to Analog Devices' high-speed bus switch product line, engineered specifically for low-latency, low-noise voltage domain bridging in mixed-supply digital systems where timing integrity and hot-swap safety are design-critical.
FAQ
What is the maximum operating temperature range for the ADG3246BCP?
The ADG3246BCP is rated for continuous operation from −40°C to +105°C, as confirmed in the Ordering Guide and Absolute Maximum Ratings table. This full industrial temperature range is supported across all specified electrical parameters including on-resistance, propagation delay, and level translation accuracy-making ADG3246BCP suitable for under-hood automotive modules and factory-floor controllers where ambient heat exceeds 85°C.
How does the SEL pin configure level translation in the ADG3246BCP?
The SEL pin on the ADG3246BCP is an active-low control that selects internal clamping thresholds: when SEL = 0 V (low), the ADG3246BCP enables 3.3 V → 1.8 V translation; when SEL = VCC (high), it supports either 3.3 V → 2.5 V or 2.5 V → 1.8 V translation depending on VCC. This configuration is explicitly defined in Table 6 (Truth Table) and validated in Figures 29–34 of the datasheet-no external components are needed to set translation mode.
Can the ADG3246BCP be used for analog signal switching?
Yes-the ADG3246BCP supports analog signal switching up to 610 MHz small-signal bandwidth and exhibits 5 pF off-capacitance, as stated in the Features and Specifications sections. Its NMOS-only switch architecture provides low THD and flat frequency response within its bandwidth limit, making ADG3246BCP appropriate for video graphics routing, audio multiplexing, and sensor signal conditioning where DC coupling and low distortion are required.
What is the recommended layout practice for the EPAD on the ADG3246BCP?
The exposed pad (EPAD) on the ADG3246BCP must be soldered to a solid PCB ground plane using ≥4 thermal vias, as specified in Table 3 (Thermal Resistance) and Package and Pinout section. This connection provides both thermal dissipation (θJA = 35°C/W) and low-impedance grounding for noise suppression. Leaving the EPAD unconnected or floating violates JEDEC JESD-51 thermal test conditions and risks exceeding junction temperature limits under sustained load.
Does the ADG3246BCP support hot-swap protection, and how is it implemented?
Yes-the ADG3246BCP provides inherent hot-swap protection via output voltage clamping: when VCC = 3.3 V and SEL = 0, outputs are limited to ≤1.8 V; when VCC = 3.3 V and SEL = 1, outputs are limited to ≤2.5 V. This behavior is documented in Applications Information (pp. 14–15) and verified in Figures 30, 32, and 34. It prevents overvoltage damage to downstream 1.8 V or 2.5 V receivers during live insertion-no external TVS or current-limiting circuits are required for basic hot-swap safety.
ADG3246BCP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 24-WFQFN Exposed Pad, CSP
- Packaging:
- Bag
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.5V, 3.3V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-LFCSP-WQ (4x4)
ADG3246BCP FAQ
1.How can I place an order for ADG3246BCP through Aetrix?
Please submit a Request for Quotation (RFQ) for ADG3246BCP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADG3246BCP reliable?
The price and inventory of ADG3246BCP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADG3246BCP is usually 5 days.
3.What payment methods are accepted for ADG3246BCP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADG3246BCP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADG3246BCP?
ADG3246BCP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADG3246BCP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADG3246BCP?
For technical support, including ADG3246BCP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADG3246BCP requirements.
6.How does Aetrix verify that ADG3246BCP is sourced from the original manufacturer or authorized distributors?
All ADG3246BCP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADG3246BCP meets industry standards.
7.What is the process for return or replacement of ADG3246BCP?
All ADG3246BCP units undergo pre-shipment inspection (PSI). If there is an issue with ADG3246BCP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADG3246BCP part is unused and in its original packaging.
Return procedure for ADG3246BCP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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