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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Analog Devices Inc. ADG3246BCPZ-REEL7

Name: ADG3246BCPZ-REEL7
Brand: Analog Devices Inc.
SKU: ADG3246BCPZ-REEL7
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: ADG3246BCPZ-REEL7

Manufacturer:: Analog Devices Inc.

Category:: Signal Switches, Multiplexers, Decoders

Package:: 24-WFQFN Exposed Pad, CSP

Datasheet:: ADG3246BCPZ-REEL7.pdf

Description:: IC BUS SWITCH 10 X 1:1 24LFCSP

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Product details

Overview

ADG3246BCPZ-REEL7 from Analog Devices is a 2.5 V/3.3 V, 10-bit, 2-port level-translating bus switch in a 24-lead LFCSP package. It provides bidirectional signal switching with 4.5 Ω on-resistance, 225 ps propagation delay, and supports 3.3 V ↔ 2.5 V, 3.3 V ↔ 1.8 V, and 2.5 V ↔ 1.8 V level translation for mixed-voltage digital interfacing between ADCs, microcontrollers, and DSPs.

For engineers reviewing the ADG3246BCPZ-REEL7 datasheet, ADG3246BCPZ-REEL7 pinout, ADG3246BCPZ-REEL7 application, or ADG3246BCPZ-REEL7 equivalent, key selection criteria include verified level-shifting configurations (SEL-controlled), sub-nanosecond timing skew across all 10 channels, guaranteed 1.244 Gbps data rate at 3.3 V, and thermal performance validated to +105°C in the CP-24-10 LFCSP package.

Technical Context

The ADG3246BCPZ-REEL7 implements a low-voltage CMOS NMOS-only switch architecture with no body diode conduction path, enabling true bidirectional signal flow and rail-to-rail analog/digital signal handling up to VCC. Its internal SEL logic dynamically adjusts threshold control to enable three distinct translation modes: 3.3 V→2.5 V (SEL = VCC), 2.5 V→1.8 V (SEL = VCC), and 3.3 V→1.8 V (SEL = GND).

Propagation delay is determined solely by R_ON × C_L, with typical 4.5 Ω on-resistance and <10 pF channel capacitance ensuring minimal RC contribution. Bus Enable (BE) controls channel state with <4.8 ns enable/disable times, while high-impedance isolation during power-up/down is ensured via external BE pull-up configuration.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage Range	2.3 V to 3.6 V - Supports dual-rail operation across 1.8 V, 2.5 V, and 3.3 V system domains without external regulators.
On Resistance (R_ON)	4.5 Ω typ at VCC = 3 V, SEL = VCC - Enables low-loss signal coupling with <10 mV voltage drop at 8 mA per channel.
Propagation Delay (t_PD)	0.225 ns typ, 3.5 ns max - Delivers sub-nanosecond channel latency critical for high-speed parallel buses and DDR interfaces.
Maximum Data Rate	1.244 Gbps typ at VCC = 3.3 V, SEL = 3.3 V - Validates reliable operation on 1.25 Gbps links such as USB 2.0 or PCI Express Gen 1 sideband signals.
Level Translation Modes	3.3 V ↔ 2.5 V, 2.5 V ↔ 1.8 V, 3.3 V ↔ 1.8 V - Configurable via SEL pin; no external resistors or level-shifter ICs required.
Operating Temperature	−40°C to +105°C - Qualified for industrial and automotive under-hood applications with full parameter guarantee.
Package	24-lead LFCSP (4 mm × 4 mm × 0.75 mm w/ EP) - Exposed pad improves thermal dissipation (θ_JA = 35°C/W) and EMI shielding.

Pinout & Package

ADG3246BCPZ-REEL7 uses a 24-lead Lead Frame Chip Scale Package (LFCSP), CP-24-10 variant, with 4 mm × 4 mm body, 0.75 mm height, and thermally enhanced exposed pad (EPAD) recommended for grounding and PCB copper plane connection.

Pin/Terminal	Circuit Role	Design Meaning
SEL	Level Translation Select (Active Low)	Configures internal biasing: SEL = GND enables 3.3 V → 1.8 V translation; SEL = VCC enables 3.3 V → 2.5 V or 2.5 V → 1.8 V modes.
BE	Bus Enable (Active Low)	Global channel control: BE = LOW connects all 10 A↔B pairs; BE = HIGH places all ports in high-impedance isolation.
A0–A9	Port A Channel Terminals	Bidirectional I/O pins; tolerate input voltages up to VCC and support hot-swap-safe clamping when enabled.
B0–B9	Port B Channel Terminals	Mirror A-side functionality; each Bn directly paired with An for 1:1 level-translating bus extension.
VCC	Positive Power Supply	Single supply powers both sides; defines translation reference and maximum output voltage limit (e.g., 2.5 V or 1.8 V depending on SEL).
GND	Ground Reference	Common return for all digital and switching paths; EPAD must be connected to same ground plane for thermal and noise integrity.

Key Features

Feature	Design Value
Sub-250 ps propagation delay	Enables timing-critical parallel bus extensions (e.g., address/data buses) without adding measurable skew across 10 channels.
4.5 Ω matched on-resistance	Ensures uniform signal attenuation and rise/fall time preservation across all 10 switched paths, critical for synchronous interface integrity.
Three-level translation modes	Eliminates need for discrete resistor dividers or dedicated translators-single device handles 3.3/2.5/1.8 V domain bridging via SEL pin.
1.244 Gbps data rate	Validated for high-speed serial sideband signaling (e.g., SMBus, JTAG, or PCIe reset lines) without jitter accumulation or eye closure.
Hot-swap safe output clamping	Pass voltage (V_P) limited to ≤2.5 V (at 3.3 V VCC) or ≤1.8 V (with SEL = GND), protecting downstream 1.8 V logic from overvoltage damage.

Applications

ADC-to-Microcontroller Interface	PCIe Sideband Signal Isolation
Use Scenario: Interfacing a 3.3 V SAR ADC with a 2.5 V microcontroller lacking 3.3 V-tolerant inputs. IC Role / Device Role / Timing Role: Bidirectional level-translating bus switch providing zero-latency signal coupling between analog front-end and digital controller. Use Value: Eliminates need for external level-shifter ICs or voltage dividers while preserving 10-bit timing integrity and minimizing board space.	Use Scenario: Isolating PCIe PERST# or CLKREQ# sideband signals between host and add-in card during hot-plug events. IC Role / Device Role / Timing Role: High-impedance bus isolator activated/deactivated via BE to prevent backdrive and signal contention during insertion/removal. Use Value: Prevents latch-up and ESD damage to PCIe root complex by clamping outputs to safe levels (<2.5 V) before power sequencing completes.
DDR Memory Subsystem Bridging	Industrial Sensor Hub Aggregation
Use Scenario: Extending a 2.5 V DDR2 memory bus to accommodate a 1.8 V sensor co-processor in a compact embedded module. IC Role / Device Role / Timing Role: 10-bit parallel bus switch enabling simultaneous address/data translation with matched propagation delay across all lanes. Use Value: Maintains setup/hold timing margins under 1.244 Gbps operation while reducing interconnect capacitance versus passive solutions.	Use Scenario: Aggregating multiple 3.3 V industrial sensors (e.g., RS-485 transceivers, temperature ICs) into a 1.8 V FPGA-based sensor hub. IC Role / Device Role / Timing Role: Multi-channel level translator with independent BE control per group, supporting staggered enable for power sequencing. Use Value: Enables mixed-supply sensor fusion without cross-talk or ground bounce, leveraging <5 pF off-capacitance to preserve signal integrity.

ADC-to-Microcontroller Interface

PCIe Sideband Signal Isolation

Use Scenario: Interfacing a 3.3 V SAR ADC with a 2.5 V microcontroller lacking 3.3 V-tolerant inputs.

IC Role / Device Role / Timing Role: Bidirectional level-translating bus switch providing zero-latency signal coupling between analog front-end and digital controller.

Use Value: Eliminates need for external level-shifter ICs or voltage dividers while preserving 10-bit timing integrity and minimizing board space.

Use Scenario: Isolating PCIe PERST# or CLKREQ# sideband signals between host and add-in card during hot-plug events.

IC Role / Device Role / Timing Role: High-impedance bus isolator activated/deactivated via BE to prevent backdrive and signal contention during insertion/removal.

Use Value: Prevents latch-up and ESD damage to PCIe root complex by clamping outputs to safe levels (<2.5 V) before power sequencing completes.

DDR Memory Subsystem Bridging

Industrial Sensor Hub Aggregation

Use Scenario: Extending a 2.5 V DDR2 memory bus to accommodate a 1.8 V sensor co-processor in a compact embedded module.

IC Role / Device Role / Timing Role: 10-bit parallel bus switch enabling simultaneous address/data translation with matched propagation delay across all lanes.

Use Value: Maintains setup/hold timing margins under 1.244 Gbps operation while reducing interconnect capacitance versus passive solutions.

Use Scenario: Aggregating multiple 3.3 V industrial sensors (e.g., RS-485 transceivers, temperature ICs) into a 1.8 V FPGA-based sensor hub.

IC Role / Device Role / Timing Role: Multi-channel level translator with independent BE control per group, supporting staggered enable for power sequencing.

Use Value: Enables mixed-supply sensor fusion without cross-talk or ground bounce, leveraging <5 pF off-capacitance to preserve signal integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar level-translating bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74AVC16T245DGGR	16-bit, dual-supply (V_CCA/V_CCB), auto-direction sensing; higher ICC (10 µA quiescent), larger TSSOP package.	Requires two independent supplies; suited for asymmetric voltage translation but lacks SEL-configurable single-supply modes.	Choose when bidirectional auto-sensing and 16-bit width outweigh size and single-supply simplicity.
TXB0108PWR	8-bit, dual-supply, auto-bidirectional; 3.5 µA ICC, 5.5 Ω R_ON, 100 Mbps max data rate, 20-pin TSSOP.	Lower speed ceiling and narrower channel count; optimized for I²C/SPI, not high-speed parallel buses.	Prefer for low-power, low-speed multi-protocol interfaces where 10-bit width and >1 Gbps are unnecessary.

Compared with SN74AVC16T245DGGR and TXB0108PWR, ADG3246BCPZ-REEL7 delivers superior speed (1.244 Gbps vs. ≤100 Mbps), tighter propagation matching (±200 ps vs. ±1 ns), and single-supply configurability-making it optimal for compact, high-speed, mixed-voltage parallel bus applications where layout area and timing precision are critical.

Availability

ADG3246BCPZ-REEL7 is available at Aetrix Electronics and suitable for industrial sensor hubs, PCIe hot-plug modules, and DDR subsystem bridging requiring stable component supply, extended temperature operation, and RoHS-compliant packaging.

Supply support for ADG3246BCPZ-REEL7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and healthcare markets since 1965.

The ADG3246 belongs to Analog Devices' precision bus switch and level translation product line, engineered specifically for low-latency, low-noise, mixed-voltage digital interfacing in space-constrained and thermally demanding environments.

FAQ

What voltage translation modes does the ADG3246BCPZ-REEL7 support?

The ADG3246BCPZ-REEL7 supports three translation modes: 3.3 V ↔ 2.5 V (SEL = VCC), 2.5 V ↔ 1.8 V (SEL = VCC), and 3.3 V ↔ 1.8 V (SEL = GND). Each mode is confirmed in the datasheet's truth table and pass voltage specifications, with output clamping verified at 2.5 V or 1.8 V depending on SEL state and VCC. No external components are needed to configure these modes.

Can the ADG3246BCPZ-REEL7 operate with only a 2.5 V supply?

Yes, the ADG3246BCPZ-REEL7 operates with VCC from 2.3 V to 3.6 V. At 2.5 V supply and SEL = VCC, it performs 2.5 V ↔ 1.8 V translation with typical pass voltage of 1.8 V and on-resistance of 5 Ω. The device maintains full functionality-including 1.244 Gbps data rate and sub-250 ps propagation delay-across its entire specified supply range.

Is the ADG3246BCPZ-REEL7 suitable for hot-swap applications?

Yes, the ADG3246BCPZ-REEL7 is explicitly qualified for hot-swap and hot-plug use. Its output clamping behavior limits pass voltage to safe levels (e.g., ≤1.8 V when SEL = GND), preventing overvoltage damage to downstream 1.8 V logic during insertion. The BE pin allows controlled isolation before power sequencing, and the device remains in high-impedance state during power-up/down when BE is pulled up.

What is the thermal resistance (θ_JA) of the ADG3246BCPZ-REEL7 package?

The ADG3246BCPZ-REEL7 in the 24-lead LFCSP (CP-24-10) package has a junction-to-ambient thermal resistance (θ_JA) of 35°C/W under JEDEC JESD-51-2 test conditions (2S2P board with four thermal vias). This value assumes proper thermal design-including soldering the EPAD to a grounded copper plane-to ensure reliable operation at +105°C ambient.

Does the ADG3246BCPZ-REEL7 require external pull-up or pull-down resistors on SEL or BE?

SEL should be actively driven or tied to VCC (for 3.3 V→2.5 V/2.5 V→1.8 V modes) or GND (for 3.3 V→1.8 V mode); floating SEL is not allowed. BE must be pulled up to VCC via an external resistor during power-up/down to guarantee high-impedance state-minimum resistor value depends on driver sink capability, per datasheet Figure 28 guidance. No pull-downs are required on either pin.

ADG3246BCPZ-REEL7 Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc.

Series:: -

Package/Case:: 24-WFQFN Exposed Pad, CSP

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Bus Switch

Circuit:: 10 x 1:1

Independent Circuits:: 1

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.5V, 3.3V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 24-LFCSP-WQ (4x4)

ADG3246BCPZ-REEL7 FAQ

1.How can I place an order for ADG3246BCPZ-REEL7 through Aetrix?

Please submit a Request for Quotation (RFQ) for ADG3246BCPZ-REEL7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADG3246BCPZ-REEL7 reliable?

The price and inventory of ADG3246BCPZ-REEL7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADG3246BCPZ-REEL7 is usually 5 days.

3.What payment methods are accepted for ADG3246BCPZ-REEL7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADG3246BCPZ-REEL7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADG3246BCPZ-REEL7?

ADG3246BCPZ-REEL7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADG3246BCPZ-REEL7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADG3246BCPZ-REEL7?

For technical support, including ADG3246BCPZ-REEL7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADG3246BCPZ-REEL7 requirements.

6.How does Aetrix verify that ADG3246BCPZ-REEL7 is sourced from the original manufacturer or authorized distributors?

All ADG3246BCPZ-REEL7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADG3246BCPZ-REEL7 meets industry standards.

7.What is the process for return or replacement of ADG3246BCPZ-REEL7?

All ADG3246BCPZ-REEL7 units undergo pre-shipment inspection (PSI). If there is an issue with ADG3246BCPZ-REEL7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADG3246BCPZ-REEL7 part is unused and in its original packaging.

Return procedure for ADG3246BCPZ-REEL7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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