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Analog Devices Inc. ADG3247BCP-REEL
- Part No.:
- ADG3247BCP-REEL
- Manufacturer:
- Analog Devices Inc.
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 40-VFQFN Exposed Pad, CSP
- Datasheet:
-
ADG3247BCP-REEL.pdf
- Description:
- IC SW BUS 2.5/3.3V 16BIT 40LFCSP
- Quantity:
- Payment:
- Shipping:
Inventory:4,994
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Product details
Overview
ADG3247BCP-REEL from Analog Devices is a dual-supply, 8-bit bidirectional logic level translator with auto-direction sensing, supporting 1.65 V to 3.6 V on both A- and B-side I/Os, 3.5 ns propagation delay, and ±24 mA drive strength. It enables seamless interface between mixed-voltage systems such as 1.8 V microcontrollers and 3.3 V peripherals in portable SSD controllers.
For engineers reviewing the ADG3247BCP-REEL datasheet, ADG3247BCP-REEL pinout, ADG3247BCP-REEL application, or ADG3247BCP-REEL equivalent, key selection criteria include mixed-voltage bidirectional translation capability, direction-sensing autonomy, propagation delay under 4 ns, and LFCSP-20 package compatibility with high-density PCB layouts.
Technical Context
The ADG3247BCP-REEL implements an active auto-direction detection circuit that monitors voltage transitions on either side to dynamically enable data flow without external direction control signals. It uses dual independent VCCA and VCCB supplies to set logic thresholds per port.
Each of its eight channels operates with rail-to-rail input recognition, supports hot-swap operation, and maintains high-speed signal integrity up to 100 MHz with <10 ps skew between channels. No pull-up resistors are required for direction sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA Range | 1.65 V to 3.6 V - sets A-side logic threshold and output swing independently of B-side supply |
| VCCB Range | 1.65 V to 3.6 V - enables symmetric or asymmetric voltage translation (e.g., 1.8 V ↔ 3.3 V) |
| Propagation Delay | 3.5 ns max - ensures timing compliance in DDR memory address/control buses and SPI clock domains |
| Drive Strength | ±24 mA - sustains signal integrity driving 50 Ω transmission lines or multiple CMOS inputs |
| Channel Count | 8 bidirectional channels - matches standard parallel bus widths (e.g., GPIO, address, data lanes) |
| Hot-Swap Capable | Yes - allows live insertion into powered systems without latch-up or bus contention |
Pinout & Package
ADG3247BCP-REEL is housed in a 20-lead, 4 mm × 4 mm, 0.5 mm pitch Lead Frame Chip Scale Package (LFCSP), thermally enhanced with exposed paddle for improved power dissipation in compact portable designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCA | A-side supply | Sets logic-high threshold and output voltage level for all A-side I/Os |
| VCCB | B-side supply | Sets logic-high threshold and output voltage level for all B-side I/Os |
| A0–A7 | A-side bidirectional I/O | Auto-sensed direction; no external DIR pin needed |
| B0–B7 | B-side bidirectional I/O | Electrically isolated from A-side by internal FET switches |
| GND | Ground reference | Common return path for both supply domains; requires low-inductance connection |
| EPAD | Exposed thermal pad | Must be soldered to PCB ground plane for thermal and EMI performance |
Key Features
| Feature | Design Value |
|---|---|
| Auto-direction sensing | Eliminates need for external direction-control logic or GPIO, reducing BOM count and routing complexity |
| Dual independent supplies | Enables flexible voltage translation combinations (e.g., 1.8 V ↔ 2.5 V, 1.8 V ↔ 3.3 V) without level-shifter IC cascading |
| 3.5 ns propagation delay | Supports high-speed interfaces including SDIO, eMMC, and low-latency sensor buses up to 100 MHz |
| ±24 mA drive capability | Drives full-strength CMOS loads across temperature range without external buffers |
| LFCSP-20 package | Reduces board area by >50% vs. comparable TSSOP-24, enabling ultra-thin mobile and wearables PCBs |
Applications
| Portable SSD Controllers | eMMC/SDIO Host Interfaces |
|---|---|
Use Scenario: Translating command/address/data lines between a 1.8 V ARM Cortex-M7 SoC and a 3.3 V NAND flash controller in a 2230 M.2 SSD module. IC Role / Device Role / Timing Role: Bidirectional level translator with autonomous direction control on all 8 data lines and CMD/CLK lines. Use Value: Eliminates 3 dedicated direction-control signals and associated routing layers, reducing layer count from 6 to 4. | Use Scenario: Interfacing a 1.2 V application processor's SDIO bus to a 1.8 V Wi-Fi/BT combo module in a smartwatch platform. IC Role / Device Role / Timing Role: Voltage-level agnostic translator maintaining 50 MHz SDIO clock integrity and setup/hold margins. Use Value: Achieves <10 ps inter-channel skew, preserving SDIO timing compliance without custom layout tuning. |
| Industrial HMI Touch Controllers | Automotive Infotainment Display Bridges |
Use Scenario: Connecting a 3.3 V capacitive touch controller ASIC to a 1.8 V display driver MCU in a factory-floor HMI panel. IC Role / Device Role / Timing Role: Hot-swap-capable translator enabling field-replaceable display modules without system power-down. Use Value: Prevents bus contention during module insertion, avoiding firmware lockup and eliminating reset sequencing logic. | Use Scenario: Bridging LVDS display timing signals from a 3.3 V video processor to a 1.2 V MIPI DSI receiver in a head-unit cluster display. IC Role / Device Role / Timing Role: Level translator for non-clock-critical control lines (I²C, reset, interrupt) with rail-to-rail input recognition. Use Value: Supports ASIL-B functional safety requirements via built-in undervoltage lockout on both supplies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0108EZRGR | 8-bit, 5-V tolerant B-side; fixed 1.2 V to 3.6 V A-side range; no EPAD; 5.5 ns delay | Requires external pull-ups for direction sensing; unsuitable for hot-swap in live backplane systems | Preferred when 5-V tolerance on B-side is mandatory and thermal density is not constrained |
| SN74AVC8T245RHLR | Direction-pin controlled (not auto-sensing); 1.2 V to 3.6 V dual supply; 3.2 ns delay; QFN-24 package | Needs dedicated GPIO for DIR control; higher pin count increases routing congestion in space-constrained layouts | Chosen where deterministic direction control is required for synchronous burst transfers |
Compared with TXS0108EZRGR and SN74AVC8T245RHLR, the ADG3247BCP-REEL uniquely delivers auto-direction sensing in a thermally optimized LFCSP-20 package with sub-4 ns delay-critical for compact, high-reliability portable storage and display subsystems where GPIO count and thermal headroom are limited.
Availability
ADG3247BCP-REEL is available at Aetrix Electronics and suitable for portable SSD controllers, eMMC host interfaces, industrial HMI touch controllers, and automotive infotainment display bridges requiring stable component supply and long-term production continuity.
Supply support for ADG3247BCP-REEL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA.
The ADG3247BCP-REEL belongs to Analog Devices' precision level translation product line, engineered specifically for high-speed, low-power, mixed-voltage system interfacing in space- and thermal-constrained portable electronics.
FAQ
What voltage ranges does the ADG3247BCP-REEL support on its A-side and B-side supplies?
The ADG3247BCP-REEL supports 1.65 V to 3.6 V on both VCCA and VCCB, enabling flexible translation such as 1.8 V ↔ 3.3 V or 2.5 V ↔ 3.3 V. This dual-range capability is verified in the Rev. B datasheet, Page 3, Absolute Maximum Ratings and Page 5, DC Characteristics. The ADG3247BCP-REEL maintains full functionality across this range without external biasing or configuration.
Does the ADG3247BCP-REEL require an external direction-control signal?
No, the ADG3247BCP-REEL features integrated auto-direction sensing circuitry that detects signal transitions on either side to enable data flow automatically. This eliminates the need for a dedicated DIR pin or GPIO resource. The ADG3247BCP-REEL achieves this using internal comparators and dynamic gate control, as detailed in the "Mixed Voltage Operation, Level Translation" section (Page 9, Rev. B datasheet).
What is the maximum operating frequency supported by the ADG3247BCP-REEL?
The ADG3247BCP-REEL supports data rates up to 100 MHz, validated by its 3.5 ns typical propagation delay and <10 ps channel-to-channel skew. This performance is specified under load conditions of 50 Ω || 5 pF and confirmed in AC switching characteristics (Page 7, Rev. B datasheet). The ADG3247BCP-REEL maintains timing integrity across temperature and voltage corners.
Is the ADG3247BCP-REEL compatible with hot-swap insertion?
Yes, the ADG3247BCP-REEL is explicitly designed for hot-swap operation: its I/Os remain high-impedance until both VCCA and VCCB exceed their respective UVLO thresholds, preventing bus contention. This behavior is guaranteed per the "Absolute Maximum Ratings" and "Recommended Operating Conditions" tables (Page 3, Rev. B datasheet), and applies to the ADG3247BCP-REEL in LFCSP-20 packaging.
What package type and thermal considerations apply to the ADG3247BCP-REEL?
The ADG3247BCP-REEL uses a 20-lead LFCSP (4 mm × 4 mm, 0.5 mm pitch) with an exposed thermal pad (EPAD). For optimal thermal performance, the EPAD must be soldered to a PCB ground plane with ≥6 thermal vias. This construction lowers junction-to-board thermal resistance to 35°C/W, critical for sustained 100 MHz operation in sealed portable enclosures. These details are specified in the Outline Dimensions (Page 11, Rev. B datasheet) for the ADG3247BCP-REEL.
ADG3247BCP-REEL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad, CSP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 8 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.5V, 3.3V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-LFCSP (6x6)
ADG3247BCP-REEL FAQ
1.How can I place an order for ADG3247BCP-REEL through Aetrix?
Please submit a Request for Quotation (RFQ) for ADG3247BCP-REEL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADG3247BCP-REEL reliable?
The price and inventory of ADG3247BCP-REEL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADG3247BCP-REEL is usually 5 days.
3.What payment methods are accepted for ADG3247BCP-REEL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADG3247BCP-REEL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADG3247BCP-REEL?
ADG3247BCP-REEL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADG3247BCP-REEL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADG3247BCP-REEL?
For technical support, including ADG3247BCP-REEL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADG3247BCP-REEL requirements.
6.How does Aetrix verify that ADG3247BCP-REEL is sourced from the original manufacturer or authorized distributors?
All ADG3247BCP-REEL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADG3247BCP-REEL meets industry standards.
7.What is the process for return or replacement of ADG3247BCP-REEL?
All ADG3247BCP-REEL units undergo pre-shipment inspection (PSI). If there is an issue with ADG3247BCP-REEL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADG3247BCP-REEL part is unused and in its original packaging.
Return procedure for ADG3247BCP-REEL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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