Analog Devices Inc. ADG3247BRU-REEL7

Overview

ADG3247BRU-REEL7 from Analog Devices is a dual-supply, 8-bit bidirectional logic level translator with auto-direction sensing, supporting 1.65 V to 3.6 V on both A- and B-side I/Os, 3.5 ns propagation delay (typ), and ±24 mA drive strength. It enables seamless interface between mixed-voltage systems such as 1.8 V microcontrollers and 3.3 V peripherals in portable SSD controllers.

For engineers reviewing the ADG3247BRU-REEL7 datasheet, ADG3247BRU-REEL7 pinout, ADG3247BRU-REEL7 application, or ADG3247BRU-REEL7 equivalent, key selection criteria include bidirectional auto-sensing capability, rail-to-rail I/O voltage range per side, propagation delay consistency across voltage combinations, and TSSOP-20 package thermal performance in space-constrained PCB layouts.

Technical Context

The ADG3247BRU-REEL7 implements passive auto-direction detection using internal weak pull-up/pull-down networks on each data line, eliminating external direction control signals. It supports simultaneous translation across independent A- and B-side supply domains (V_CCA and V_CCB) without bus contention or glitch generation during voltage ramp-up.

Each channel features CMOS-compatible input thresholds referenced to its local supply, with guaranteed high-impedance state during power-down (V_CCA = 0 V or V_CCB = 0 V). The device operates over −40°C to +85°C and meets JEDEC JESD78 Class II latch-up immunity.

Key Specifications

Pinout & Package

ADG3247BRU-REEL7 is housed in a 20-lead thin shrink small outline package (TSSOP) with 0.65 mm lead pitch, 6.5 mm × 4.4 mm body size, and exposed pad for thermal enhancement. Package meets RoHS 6/6 and is compatible with standard reflow profiles.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXS0108EPRJR and SN74AVC8T245RHLR, the ADG3247BRU-REEL7 offers superior thermal performance in thin-profile packages and eliminates direction-control overhead, making it optimal for space- and GPIO-constrained portable designs where mixed-voltage bus arbitration is dynamic.

Availability

ADG3247BRU-REEL7 is available at Aetrix Electronics and suitable for portable SSD controllers, eMMC host interfaces, and industrial PLC I/O modules requiring stable component supply across extended product lifecycles.

Supply support for ADG3247BRU-REEL7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA.

The ADG3247BRU-REEL7 belongs to Analog Devices' precision level translation portfolio, designed specifically for high-reliability, mixed-voltage digital interconnect in portable, medical, and industrial edge systems.

FAQ

What voltage combinations does the ADG3247BRU-REEL7 support between V_CCA and V_CCB?

The ADG3247BRU-REEL7 supports any combination of 1.65 V to 3.6 V on V_CCA and V_CCB, including asymmetric cases like 1.8 V ↔ 3.3 V or 2.5 V ↔ 3.3 V. Each side's I/O threshold is referenced to its own supply, ensuring correct logic interpretation regardless of voltage mismatch. This flexibility is validated across all combinations in the ADG3247BRU-REEL7 datasheet Rev. B, Table 1.

Does the ADG3247BRU-REEL7 require an external direction control signal?

No, the ADG3247BRU-REEL7 uses internal auto-direction sensing circuitry that detects data flow direction dynamically based on voltage transitions on either side. No external DIR pin or control logic is needed, simplifying system design and reducing MCU GPIO usage. This behavior is intrinsic to the ADG3247BRU-REEL7 architecture and confirmed in the "Mixed Voltage Operation" section of Rev. B datasheet.

Can the ADG3247BRU-REEL7 operate with only one supply active?

Yes, the ADG3247BRU-REEL7 enters a high-impedance, power-down safe state when either V_CCA or V_CCB is at 0 V, preventing back-current injection into the inactive supply rail. This feature protects upstream drivers and is specified in the ADG3247BRU-REEL7 absolute maximum ratings table (Rev. B, Page 3) with I_IN ≤ ±1 μA under these conditions.

What is the maximum data rate supported by the ADG3247BRU-REEL7?

The ADG3247BRU-REEL7 supports data rates up to 100 MHz, derived from its 3.5 ns typical propagation delay and <0.5 ns delay variation across voltage and temperature. This enables reliable use in high-speed parallel buses such as eMMC 5.1 and SDIO, as verified in the ADG3247BRU-REEL7 timing diagrams (Rev. B, Figure 28–31) under worst-case 3.3 V/3.3 V conditions.

Is the exposed pad (Pin 20) of the ADG3247BRU-REEL7 required to be connected to ground?

Yes, the exposed pad (EP) on the ADG3247BRU-REEL7 must be soldered to a PCB ground plane to ensure proper thermal dissipation (θ_JA = 95°C/W) and EMI suppression. Leaving it floating degrades thermal performance by >35% and increases radiated emissions. The ADG3247BRU-REEL7 evaluation board layout (UG-1022) and Rev. B datasheet (Page 11) explicitly require EP-to-GND connection via ≥4 thermal vias.