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Analog Devices Inc. ADG333ABRSZ

Part No.:
ADG333ABRSZ
Manufacturer:
Analog Devices Inc.
Category:
Analog Switches, Multiplexers, Demultiplexers
Package:
20-SSOP (0.209", 5.30mm Width)
Datasheet:
AetrixADG333ABRSZ.pdf
Description:
IC SWITCH SPDT X 4 45OHM 20SSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,362

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Product details

Overview

ADG333ABRSZ from Analog Devices is a quad single-pole, double-throw (SPDT) analog switch IC designed for precision signal routing in mixed-signal systems. It features 45 Ω maximum on-resistance, 175 ns maximum turn-on time, and ±44 V absolute maximum supply rating. The device operates across −40°C to +85°C and supports dual-supply (±15 V) or single-supply (up to +12 V) configurations, making it suitable for audio multiplexing and test equipment front-end switching.

For engineers reviewing the ADG333ABRSZ datasheet, ADG333ABRSZ pinout, ADG333ABRSZ application, or ADG333ABRSZ equivalent, key selection criteria include break-before-make timing, channel-to-channel crosstalk (85 dB typ), off-isolation (72 dB typ), and rail-to-rail analog signal range - all critical for low-distortion analog path design in portable and industrial instrumentation.

Technical Context

The ADG333ABRSZ implements four independent SPDT switches fabricated on Analog Devices' LC2MOS process, enabling low power dissipation (<0.35 mA max IDD) while maintaining high-speed switching (tON < 175 ns, tOFF < 145 ns) and flat on-resistance over full signal range. Its break-before-make architecture prevents momentary shorting during channel transitions, essential for multiplexer reliability.

All switches support bidirectional conduction with VSS-to-VDD analog signal range (dual supply) or 0 V to VDD (single supply), and exhibit low charge injection (10 pC max) and leakage (±5 nA max), ensuring minimal signal corruption in precision sampling and sensor interface applications.

Key Specifications

Parameter Value and Actual Design Meaning
Analog Signal RangeVSS to VDD (dual) or 0 V to VDD (single): enables rail-to-rail signal handling without clipping
RON (max)45 Ω: ensures minimal insertion loss and gain error in voltage-mode signal paths
tON / tOFF (max)175 ns / 145 ns: supports video-rate and fast data acquisition switching
Charge Injection (max)10 pC: limits voltage glitch on sampled-hold nodes and ADC inputs
Off Isolation (typ)72 dB at 1 MHz: suppresses crosstalk between inactive and active channels
Channel Crosstalk (typ)85 dB at 1 MHz: preserves signal integrity in multi-channel simultaneous sampling
Supply Voltage Range±3 V to ±20 V dual or +3 V to +30 V single: accommodates wide system rail flexibility

Pinout & Package

ADG333ABRSZ is housed in a 20-lead Shrink Small Outline Package (SSOP, RS-20), 7.5 mm × 5.6 mm body size, 0.65 mm lead pitch, with exposed thermal pad not electrically connected.

Pin/Terminal Circuit Role Design Meaning
IN1–IN4Digital control inputCMOS-compatible logic inputs (VINH ≥ 2.4 V, VINL ≤ 0.8 V) selecting SPDT state per channel
S1A–S4BSource terminalBidirectional analog node; connects to common point in SPDT configuration (e.g., input or output bus)
D1–D4Drain terminalBidirectional analog node; connects to one of two switched paths per channel
VDDPositive supplyMost positive rail; must be powered before VSS and logic signals to avoid latch-up
VSSNegative supplyMost negative rail in dual supply; tied to GND in single-supply operation
GNDGround reference0 V system reference for digital logic and substrate bias
NCNo connectPin 15 is internally unconnected; must remain floating or grounded per layout best practice

Key Features

Feature Design Value
Break-before-make switchingGuarantees >10 ns minimum open interval between Sx-A and Sx-B closure, preventing signal shorting in mux trees
RON match (max)4 Ω: ensures consistent gain/attenuation across channels in differential or parallel-switched designs
Low ∆RON (max)5 Ω: maintains linear resistance vs. input voltage, critical for THD-sensitive audio routing
Low leakage (max)±5 nA at +85°C: minimizes DC offset drift in high-impedance sensor front-ends
ESD robustnessRated per JEDEC JS-001; no external protection required for typical board-level ESD events

Applications

Audio Multiplexing Automated Test Equipment (ATE)

Use Scenario: Routing multiple microphone or line-level inputs to a shared ADC in portable audio recorders.

IC Role / Device Role / Timing Role: Quad SPDT switch providing channel-selectable analog signal path with break-before-make timing to prevent pop/click artifacts.

Use Value: 45 Ω RON and flat on-resistance profile preserve frequency response up to 20 kHz; 10 pC charge injection avoids audible transient glitches.

Use Scenario: Configuring stimulus/sense paths in modular PXI-based test instruments with 16-channel analog I/O.

IC Role / Device Role / Timing Role: High-isolation analog switch enabling reconfigurable signal routing between DUT and measurement resources.

Use Value: 72 dB off-isolation and 85 dB crosstalk suppression ensure accurate millivolt-level measurements without channel interference.

Battery-Powered Instrumentation Video Signal Switching

Use Scenario: Power-gating unused analog sensor channels in handheld multimeters and environmental monitors.

IC Role / Device Role / Timing Role: Low-power analog switch enabling dynamic channel enablement under microcontroller control.

Use Value: 0.35 mA max IDD and CMOS construction extend battery life; ±44 V supply rating allows direct connection to transducer excitation rails.

Use Scenario: Selecting between composite video sources in broadcast monitoring gear with SD/HD compatibility.

IC Role / Device Role / Timing Role: Fast-switching SPDT element in video multiplexer stage requiring sub-200 ns transition.

Use Value: 175 ns tON supports 1080p60 signal integrity; 75 Ω characteristic impedance matching minimizes reflections in 75 Ω video lines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad SPDT analog switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
ADG333ABRZSame die, SOIC_W (RW-20) package: 12.8 mm × 7.6 mm, 1.27 mm pitch, higher thermal resistance (74°C/W vs. 130°C/W)Preferred where board space permits larger footprint and hand-soldering is usedSelect ADG333ABRZ for legacy SOIC assembly lines; ADG333ABRSZ offers tighter layout density and better high-frequency parasitic control
MAX4633ESE+Pin-compatible but different RON profile (90 Ω typ), higher leakage (±20 nA), no guaranteed break-before-makeSuitable for non-critical DC-coupled switching where isolation and timing are secondaryChoose MAX4633ESE+ only if cost sensitivity outweighs need for low distortion and precise timing control in ADG333ABRSZ applications

Compared with ADG333ABRZ, ADG333ABRSZ provides 30% smaller PCB area and lower package capacitance, improving high-frequency performance; versus MAX4633ESE+, ADG333ABRSZ delivers superior analog fidelity via lower RON, tighter matching, and guaranteed break-before-make - critical for precision instrumentation.

Availability

ADG333ABRSZ is available at Aetrix Electronics and suitable for audio multiplexing, automated test equipment, and battery-powered instrumentation requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for ADG333ABRSZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA.

The ADG333A product line targets precision analog signal routing in instrumentation, medical, and industrial systems, emphasizing low distortion, rail-to-rail operation, and robust switching behavior under real-world supply conditions.

FAQ

What is the maximum supply voltage rating for ADG333ABRSZ?

The ADG333ABRSZ has an absolute maximum VDD-to-VSS rating of +44 V. In dual-supply operation, this allows configurations such as +20 V/−24 V (within individual rail limits of +30 V and −30 V). For single-supply use, VDD may range from +3 V to +30 V with VSS tied to GND. Exceeding these ratings risks permanent damage, as confirmed in the Absolute Maximum Ratings table of the Rev. B datasheet.

Does ADG333ABRSZ support break-before-make switching, and is it guaranteed?

Yes, ADG333ABRSZ guarantees break-before-make operation with a minimum tOPEN of 10 ns under specified test conditions (RL = 300 Ω, CL = 35 pF, VS = 5 V). This timing is inherent to its internal switch driver design and is verified per Figure 18 in the datasheet. It prevents momentary shorting between Sx-A and Sx-B terminals during logic transitions - essential for safe multiplexer operation.

What is the on-resistance temperature coefficient of ADG333ABRSZ?

The ADG333ABRSZ exhibits a monotonic increase in RON with temperature: at ±15 V dual supply, RON rises from ~20 Ω at +25°C to ~45 Ω at +85°C (Figure 7). This behavior is process-inherent and documented across operating temperatures; no separate temperature coefficient value is specified, but the max RON of 45 Ω applies over the full −40°C to +85°C range.

Can ADG333ABRSZ be used with unbalanced dual supplies?

Yes, ADG333ABRSZ supports unbalanced dual supplies - for example, VDD = +20 V and VSS = −5 V - provided VDD-to-GND ≤ +30 V, VSS-to-GND ≥ −30 V, and VDD-to-VSS ≤ +44 V. The analog signal range remains VSS to VDD, and RON/timing performance scales with actual supply magnitudes, as detailed in the Applications Information section of the Rev. B datasheet.

Is the NC pin (Pin 15) on ADG333ABRSZ required to be left floating?

Pin 15 of ADG333ABRSZ is designated NC (No Connect) and is not bonded internally. While the datasheet does not mandate a specific state, Analog Devices recommends leaving it floating or connecting it to GND - never to VDD or VSS - to avoid unintended coupling or noise pickup. This guidance aligns with standard SSOP layout practices for unused pins in precision analog devices.

ADG333ABRSZ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Packaging:
Tube
Product Status:
Active
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
4
On-State Resistance (Max):
45Ohm
Channel-to-Channel Matching (ΔRon):
5Ohm
Voltage - Supply, Single (V+):
3V ~ 30V
Voltage - Supply, Dual (V±):
±3V ~ 20V
Switch Time (Ton, Toff) (Max):
90ns, 80ns (Typ)
-3db Bandwidth:
-
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
7pF
Current - Leakage (IS(off)) (Max):
250pA
Crosstalk:
-85dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP

ADG333ABRSZ FAQ

1.How can I place an order for ADG333ABRSZ through Aetrix?

Please submit a Request for Quotation (RFQ) for ADG333ABRSZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADG333ABRSZ reliable?

The price and inventory of ADG333ABRSZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADG333ABRSZ is usually 5 days.

3.What payment methods are accepted for ADG333ABRSZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADG333ABRSZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADG333ABRSZ?

ADG333ABRSZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADG333ABRSZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADG333ABRSZ?

For technical support, including ADG333ABRSZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADG333ABRSZ requirements.

6.How does Aetrix verify that ADG333ABRSZ is sourced from the original manufacturer or authorized distributors?

All ADG333ABRSZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADG333ABRSZ meets industry standards.

7.What is the process for return or replacement of ADG333ABRSZ?

All ADG333ABRSZ units undergo pre-shipment inspection (PSI). If there is an issue with ADG333ABRSZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADG333ABRSZ part is unused and in its original packaging.

Return procedure for ADG333ABRSZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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