Analog Devices Inc. ADG467BRZ-REEL

Overview

ADG467BRZ-REEL from Analog Devices is an octal channel protector IC designed for fault-tolerant analog signal path protection in industrial and test equipment. It features ±40 V overvoltage tolerance, 62 Ω typical on-resistance, ±1 nA max channel leakage at +25°C, and operates from ±4.5 V to ±20 V dual supplies. It protects sensitive ADC inputs during hot insertion or power sequencing faults.

For engineers reviewing the ADG467BRZ-REEL datasheet, ADG467BRZ-REEL pinout, ADG467BRZ-REEL application, or ADG467BRZ-REEL equivalent, this page delivers verified specifications, SOIC-18 package details, fault-clamping behavior under ±40 V transients, latch-up-proof trench-isolated MOSFET architecture, and real-world use cases in ATE and rack-mounted measurement systems.

Technical Context

The ADG467BRZ-REEL implements eight independent channel protectors, each composed of two N-channel and two P-channel MOSFETs in series with trench isolation-eliminating latch-up risk. Each channel behaves as a 62 Ω series resistor during normal operation (VSS + 1.5 V < VSx < VDD − 1.5 V) and clamps output to VDD − 1.5 V or VSS + 1.5 V during overvoltage events.

It supports both bipolar (±15 V) and unipolar (e.g., +10 V/0 V) supply configurations. With power off (VDD = VSS = 0 V), it presents open-circuit behavior with ±0.5 nA typical input leakage-enabling safe hot-plug operation without external biasing or sequencing control.

Key Specifications

Pinout & Package

ADG467BRZ-REEL is housed in an 18-lead SOIC_W (RW-18) package per JEDEC MS-013-AB, with 1.27 mm pitch, 10.0–10.65 mm body width, and 7.4–7.6 mm body length. Pin 1 is VD1; pins 9 and 18 are VSS and VDD respectively; pins 10–17 are VS8 through VS1; pins 1–8 are VD1 through VD8.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar channel protection applications.

Compared with ADG467BRZ (tube version), ADG467BRZ-REEL offers identical electrical performance with optimized packaging for high-volume production; versus ADG469BRZ-REEL, it provides superior ±40 V fault resilience and 38% lower RON-critical for precision measurement integrity under worst-case surge conditions.

Availability

ADG467BRZ-REEL is available at Aetrix Electronics and suitable for automated test equipment, industrial I/O modules, and hot-insertion rack systems requiring stable component supply across extended product lifecycles.

Supply support for ADG467BRZ-REEL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and healthcare markets since 1965.

The ADG467BRZ-REEL belongs to Analog Devices' precision protection portfolio, engineered specifically for fault-resilient analog signal routing in environments where power sequencing cannot be controlled-such as ATE, instrumentation, and modular computing infrastructure.

FAQ

What is the maximum overvoltage the ADG467BRZ-REEL can withstand with power supplies disconnected?

The ADG467BRZ-REEL withstands continuous analog input overvoltages from −40 V to +40 V when VDD and VSS are at 0 V. Under this condition, all internal MOSFETs are fully off, limiting input leakage to ±2 nA maximum-making it ideal for hot-swap applications where power sequencing is uncontrolled. This rating is specified in Table 2 (Absolute Maximum Ratings) of the ADG467 Rev. B datasheet.

Does the ADG467BRZ-REEL require external components to function as a channel protector?

No, the ADG467BRZ-REEL operates as a complete channel protector with only VDD and VSS supplies-no external resistors, capacitors, or diodes are needed for basic overvoltage clamping or power-off isolation. Its trench-isolated MOSFET structure provides inherent latch-up immunity and bidirectional signal flow. External filtering may be added for EMI suppression, but is not required for core protection functionality of the ADG467BRZ-REEL.

Can the ADG467BRZ-REEL be used with single-supply operation?

Yes, the ADG467BRZ-REEL supports single-supply operation: tie VSS to ground and apply VDD between +4.5 V and +20 V. In this configuration, the lower clamp threshold becomes 1.5 V (VSS + 1.5 V), and the upper clamp remains VDD − 1.5 V. The on-resistance and leakage specs remain valid per the "Dual Supply" section of the datasheet-confirmed for VDD = +10 V, VSS = 0 V in Figure 7 and Table 1.

What is the thermal resistance (θJA) of the ADG467BRZ-REEL in its SOIC-18 package?

For the ADG467BRZ-REEL in the 18-lead SOIC_W (RW-18) package, the junction-to-ambient thermal resistance (θJA) is 160°C/W, as specified in Table 2 (Absolute Maximum Ratings) of the ADG467 Rev. B datasheet. This value assumes standard JEDEC 2-layer board conditions (1 sq in copper pad, 1 oz Cu). No heatsink or forced airflow is required given the device's 0.8 μW typical power dissipation.

How does the ADG467BRZ-REEL differ from the ADG467BRSZ-REEL variant?

The ADG467BRZ-REEL uses an 18-lead SOIC_W (RW-18) package, while ADG467BRSZ-REEL uses a 20-lead SSOP (RS-20) package. Both share identical die, electrical specs, and temperature range (−40°C to +85°C). The SOIC version has larger pitch (1.27 mm) and body size-suited for manual rework and legacy layouts; the SSOP offers higher density but requires finer pitch placement. Pin functions are not identical between packages-refer to Figures 2 and 3 in the ADG467 datasheet for mapping.