Analog Devices Inc. ADG508ATCHIPS

Overview

ADG508ATCHIPS from Analog Devices is a CMOS 8-channel analog multiplexer die, designed to route one of eight bidirectional analog inputs to a common output under 3-bit binary address control with active-high enable. It operates from single (10.8 V to 16.5 V) or dual (±10.8 V to ±16.5 V) supplies, features 280 Ω typical on-resistance, 20 pA typical off-leakage, and break-before-make switching-ideal for precision data acquisition systems requiring low charge injection and wide signal range (VSS to VDD).

For engineers reviewing the ADG508ATCHIPS datasheet, ADG508ATCHIPS pinout, ADG508ATCHIPS application, or ADG508ATCHIPS equivalent, this page delivers verified specifications, die-level functional context, package-agnostic electrical behavior, and validated alternative options for high-reliability analog signal routing in industrial and test equipment.

Technical Context

The ADG508ATCHIPS implements an enhanced LC2MOS process enabling full rail-to-rail analog signal handling (VSS to VDD) and operation across 10.8 V–16.5 V single or dual supplies. Its decoder logic accepts A0–A2 and EN to select exactly one of eight source terminals (S1–S8) to connect to the drain (D), with guaranteed break-before-make timing to prevent momentary shorts.

Digital inputs are TTL and 5 V CMOS compatible (VINH ≥ 2.4 V, VINL ≤ 0.8 V), and dynamic performance includes 200 ns typical transition time, 50 ns typical open delay, and 68 dB typical off-isolation at 100 kHz. Leakage remains stable across −40°C to +85°C, supporting extended temperature applications without derating.

Key Specifications

Pinout & Package

ADG508ATCHIPS is supplied as a bare die (no packaged leads); pin functionality follows the ADG508A standard die map. Terminal assignments are defined per the 16-pin DIP/SOIC footprint layout, with no physical package dimensions or lead count applicable.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog multiplexer applications.

Compared with ADG508AKRZ, the ADG508ATCHIPS offers direct die-level integration for custom substrates and eliminates package-induced capacitance; versus ADG509A, it provides higher channel count in single-ended topology but lacks native differential pair support-selection depends on signal architecture and mechanical integration requirements.

Availability

ADG508ATCHIPS is available at Aetrix Electronics and suitable for industrial data acquisition, automated test equipment, medical instrumentation, and process control systems requiring stable component supply with traceable sourcing and long-lifecycle support.

Supply support for ADG508ATCHIPS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA, with design centers worldwide.

The ADG508A product line was developed for precision analog signal routing in demanding industrial, instrumentation, and test applications-emphasizing low leakage, rail-to-rail operation, and robust switching integrity across wide temperature and supply ranges.

FAQ

What is the maximum supply voltage rating for ADG508ATCHIPS?

The ADG508ATCHIPS has an absolute maximum VDD to VSS rating of 44 V. This allows safe operation with supply margins up to ±22 V or +32 V/–32 V extremes, though functional specification is guaranteed only from 10.8 V to 16.5 V in single- or dual-supply modes. Exceeding 16.5 V may impact R_ON stability and leakage performance beyond datasheet limits.

Does ADG508ATCHIPS support single-supply operation?

Yes, ADG508ATCHIPS supports single-supply operation with VSS connected to GND and VDD ranging from 10.8 V to 16.5 V. In this configuration, the analog signal range is 0 V to VDD, and key parameters-including 500 Ω typical R_ON, 20 pA leakage, and 300 ns typical t_TRANSITION-are fully specified and tested per Table 2 of the datasheet.

How is the ADG508ATCHIPS die mounted and interconnected?

ADG508ATCHIPS is supplied as an unpackaged silicon die with standard aluminum bond pads aligned to the 16-pin DIP/SOIC footprint. Mounting requires wire bonding or flip-chip attachment onto custom substrates or hybrid modules, with VDD, VSS, GND, and signal terminals routed per the pin function table-no solder reflow or SMT process applies.

What is the significance of break-before-make timing in ADG508ATCHIPS?

Break-before-make timing (t_OPEN ≥ 10 ns minimum) guarantees that one channel fully disconnects before another connects, preventing momentary short-circuits between analog sources. This protects sensitive sensors, avoids loading conflicts in multi-source systems, and ensures signal integrity during dynamic channel scanning in the ADG508ATCHIPS.

Can ADG508ATCHIPS replace DG508A in existing designs?

ADG508ATCHIPS is a superior functional replacement for DG508A, offering lower leakage (20 pA vs. 100 pA typ), lower R_ON (280 Ω vs. 450 Ω typ), wider supply range (10.8–16.5 V vs. 10–16.5 V), and enhanced LC2MOS process reliability. Pinout and logic are identical, but die-level implementation requires adaptation of interconnect methodology-not a drop-in PCB replacement.