Analog Devices Inc. ADG901SCPZ-EP
- Part No.:
- ADG901SCPZ-EP
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 8-WFDFN Exposed Pad, CSP
- Datasheet:
-
ADG901SCPZ-EP.pdf
- Description:
- IC RF SWITCH SPST 1GHZ 8LFCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ADG901SCPZ-EP from Analog Devices is a military-grade, absorptive SPST RF switch fabricated in CMOS, delivering 38 dB off-isolation at 1 GHz, 0.8 dB insertion loss at 1 GHz, and −3 dB bandwidth to 4.5 GHz under 1.65 V to 2.75 V supply. It operates across −55°C to +125°C and serves as a high-speed signal path selector in RF front-ends of defense-grade transceivers.
For engineers reviewing the ADG901SCPZ-EP datasheet, ADG901SCPZ-EP pinout, ADG901SCPZ-EP application, or ADG901SCPZ-EP equivalent, key selection criteria include its 8-lead LFCSP package, CMOS/LVTTL-compatible CTRL input, 50 Ω matched absorptive architecture, and enhanced product qualification for aerospace environments.
Technical Context
The ADG901SCPZ-EP implements an absorptive (terminated shunt-leg) topology with internal 50 Ω terminations on both RF ports, ensuring stable impedance matching and high isolation without external components. Its on-board CMOS control logic accepts direct CMOS or LVTTL signals, eliminating level-shifting circuitry.
Designed for wideband RF routing up to 4.5 GHz, it achieves sub-10 ns switching times (tON = 6.5 ns typ, tOFF = 10.5 ns typ) and maintains low video feedthrough (2.5 mVp-p)-critical for pulsed radar and time-sensitive diversity switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| −3 dB Bandwidth | 4.5 GHz - supports full-band operation through S-band without roll-off degradation. |
| Off Isolation @ 1 GHz | 38 dB typical - suppresses leakage between RF1 and RF2 in antenna diversity or filter bank selection. |
| Insertion Loss @ 1 GHz | 0.8 dB typical - minimizes signal attenuation in high-gain receiver chains. |
| Supply Voltage Range | 1.65 V to 2.75 V - compatible with modern low-voltage digital I/O domains and battery-powered systems. |
| Switching Time (tON) | 6.5 ns typical - enables rapid reconfiguration in TDD-based transceivers and fast-hopping systems. |
| Operating Temperature | −55°C to +125°C - qualified per AQEC standard for deployment in avionics, missile guidance, and space-qualified payloads. |
| Package | 8-lead LFCSP (3 mm × 3 mm, 0.75 mm height) - provides thermal efficiency (θJA = 48°C/W) and PCB area savings in compact RF modules. |
Pinout & Package
The ADG901SCPZ-EP uses an 8-lead Lead Frame Chip Scale Package (LFCSP, CP-8-13) with exposed pad requiring connection to GND for thermal and electrical integrity. Pin 1 is marked by a corner chamfer; the exposed pad must be soldered to a GND plane via ≥4 thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pin 1) | Power supply input | Accepts 1.65–2.75 V; requires local 0.1 µF decoupling to GND for RF stability. |
| CTRL (Pin 2) | Digital control input | CMOS/LVTTL-compatible; logic high connects RF1–RF2, logic low isolates them. |
| GND (Pins 3, 5, 6, 7) | Ground reference | Four dedicated ground pins minimize return-path inductance and improve RF return loss. |
| RF1 (Pin 4) | RF input port | 50 Ω matched absorptive port; bidirectional signal path when enabled. |
| RF2 (Pin 8) | RF output port | 50 Ω matched absorptive port; internally terminated when CTRL = 0. |
| EPAD | Exposed thermal pad | Mandatory GND connection; critical for thermal dissipation and RF grounding performance. |
Key Features
| Feature | Design Value |
|---|---|
| Absorptive (matched) architecture | Internal 50 Ω shunt terminations on RF1/RF2 ensure consistent impedance and eliminate need for external termination resistors. |
| Ultra-low quiescent current | <2.5 µA IDD - enables always-on RF switching in power-constrained platforms like UAV telemetry links. |
| High linearity (IP3) | 36 dBm typical at 900 MHz - preserves signal fidelity in multi-carrier LTE and 5G NR front-ends. |
| Enhanced product qualification | AQEC-compliant with single fab/test site, controlled baseline, and military temperature range - reduces supply chain risk for defense programs. |
| Fast switching with low feedthrough | tRISE/tFALL ≤ 5.5 ns / 9.5 ns; video feedthrough ≤ 2.5 mVp-p - prevents false triggering in pulse-Doppler radar receivers. |
Applications
| Antenna Diversity Switching | Dual-Band Tuner Modules |
|---|---|
Use Scenario: Selecting between two physically separated antennas in SATCOM terminals to mitigate multipath fading. IC Role / Device Role / Timing Role: Absorptive SPST switch routing RF signal from LNA output to one of two transmit/receive paths based on RSSI feedback. Use Value: 38 dB isolation prevents coupling-induced desensitization; 0.8 dB insertion loss preserves link budget in narrowband satellite channels. | Use Scenario: Enabling simultaneous reception on GPS L1 (1.575 GHz) and GLONASS G1 (1.602 GHz) bands using shared frontend hardware. IC Role / Device Role / Timing Role: High-speed RF path selector toggling between band-specific SAW filters before downconversion. Use Value: 4.5 GHz −3 dB bandwidth covers both bands; sub-10 ns switching allows dynamic reconfiguration during acquisition phase. |
| Digital Transceiver Front-End | IF Switching in Radar Receivers |
Use Scenario: Isolating PA output from LNA input during TDD burst transmission in tactical radios. IC Role / Device Role / Timing Role: Transmit/receive (T/R) switch controlling signal flow between antenna, PA, and LNA under baseband timing control. Use Value: 28.5 dBm IP3 handles high-power PA harmonics; −55°C to +125°C rating ensures operation in vehicle-mounted radios. | Use Scenario: Routing IF outputs from multiple mixer stages to a common ADC in phased-array radar receivers. IC Role / Device Role / Timing Role: Low-distortion signal path selector enabling time-multiplexed digitization of beam-formed channels. Use Value: 2.5 mVp-p video feedthrough avoids DC offset corruption of baseband IF samples; 50 Ω match ensures flat group delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC646LP2E | Requires dual supply (−2.5 V/+5 V); GaAs process; higher P1dB (+27 dBm). | Targeted at higher-power infrastructure; not suitable for low-voltage portable systems. | Select HMC646LP2E only when >20 dBm handling is required and negative rail is available. |
| ADGM1304 | MEMS-based; 13 GHz bandwidth; higher switching time (10 µs); no DC bias needed. | Better for ultra-wideband test equipment; unsuitable for fast-TDD or pulsed radar. | Choose ADGM1304 for DC–13 GHz coverage where speed is secondary to bandwidth. |
Compared with HMC646LP2E and ADGM1304, the ADG901SCPZ-EP uniquely balances low-voltage CMOS compatibility, military temperature range, and nanosecond switching-making it optimal for size-, power-, and reliability-constrained defense electronics where GaAs complexity or MEMS latency is prohibitive.
Availability
ADG901SCPZ-EP is available at Aetrix Electronics and suitable for defense avionics, secure SATCOM terminals, and ruggedized IoT gateways requiring stable component supply across extended temperature and long production lifecycles.
Supply support for ADG901SCPZ-EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and aerospace markets since 1965.
The ADG901SCPZ-EP belongs to Analog Devices' Enhanced Product (EP) RF switch family, engineered specifically for mission-critical defense and aerospace applications demanding extended temperature operation, controlled manufacturing, and AQEC compliance.
FAQ
What is the maximum RF input power the ADG901SCPZ-EP can handle before compression?
The ADG901SCPZ-EP has a 1 dB input compression point (P1dB) of 17 dBm at 1 GHz, meaning its insertion loss increases by 1 dB when the RF input reaches this level. This value is measured with dc bias not applied and reflects real-world limits for linear operation in receiver front-ends. Exceeding P1dB risks distortion and degraded SNR in the ADG901SCPZ-EP signal path.
Does the ADG901SCPZ-EP require external termination resistors for proper absorptive operation?
No, the ADG901SCPZ-EP integrates 50 Ω shunt terminations on both RF1 and RF2 ports, making it a fully absorptive switch. External termination resistors are unnecessary-this internal matching ensures high off-isolation and stable return loss without additional components, simplifying layout in space-constrained RF modules containing the ADG901SCPZ-EP.
Can the ADG901SCPZ-EP operate with a 1.8 V supply, and how does that affect RF performance?
Yes, the ADG901SCPZ-EP is fully specified from 1.65 V to 2.75 V, including 1.8 V. At 1.8 V, insertion loss increases slightly (e.g., 0.95 dB at 1 GHz vs. 0.8 dB at 2.5 V), and off-isolation decreases modestly (36 dB vs. 38 dB), but all parameters remain within guaranteed specifications across −55°C to +125°C. This makes the ADG901SCPZ-EP ideal for battery-powered defense radios using 1.8 V logic rails.
What is the role of the exposed pad (EPAD) on the ADG901SCPZ-EP, and how must it be connected?
The EPAD on the ADG901SCPZ-EP serves as the primary thermal and electrical ground path. It must be soldered to a solid GND plane on the PCB using at least four thermal vias. Failure to connect the EPAD degrades thermal resistance (θJA rises from 48°C/W), increases junction temperature, and compromises RF return loss-directly impacting reliability and performance of the ADG901SCPZ-EP in high-power or high-temperature deployments.
How does the ADG901SCPZ-EP differ from commercial-grade ADG901 variants?
The ADG901SCPZ-EP differs from commercial ADG901 versions through AQEC-standard qualification: extended temperature range (−55°C to +125°C), single-fab/single-test-site manufacturing, controlled process baseline, and enhanced change notification. These attributes ensure supply chain integrity and long-term reliability-critical for programs where the ADG901SCPZ-EP replaces commercial parts in flight-critical or deployed defense systems.
ADG901SCPZ-EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad, CSP
- Packaging:
- Tray
- Product Status:
- Active
- RF Type:
- -
- Topology:
- -
- Circuit:
- SPST
- Frequency Range:
- 0Hz ~ 1GHz
- Isolation:
- 38dB
- Insertion Loss:
- 0.8dB
- Test Frequency:
- 1GHz
- P1dB:
- 17dBm
- IIP3:
- 36dBm
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 1.65V ~ 2.75V
- Operating Temperature:
- -55°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-LFCSP (3x3)
ADG901SCPZ-EP FAQ
1.How can I place an order for ADG901SCPZ-EP through Aetrix?
Please submit a Request for Quotation (RFQ) for ADG901SCPZ-EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADG901SCPZ-EP reliable?
The price and inventory of ADG901SCPZ-EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADG901SCPZ-EP is usually 5 days.
3.What payment methods are accepted for ADG901SCPZ-EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADG901SCPZ-EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADG901SCPZ-EP?
ADG901SCPZ-EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADG901SCPZ-EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADG901SCPZ-EP?
For technical support, including ADG901SCPZ-EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADG901SCPZ-EP requirements.
6.How does Aetrix verify that ADG901SCPZ-EP is sourced from the original manufacturer or authorized distributors?
All ADG901SCPZ-EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADG901SCPZ-EP meets industry standards.
7.What is the process for return or replacement of ADG901SCPZ-EP?
All ADG901SCPZ-EP units undergo pre-shipment inspection (PSI). If there is an issue with ADG901SCPZ-EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADG901SCPZ-EP part is unused and in its original packaging.
Return procedure for ADG901SCPZ-EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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