Analog Devices Inc. ADG902BCP-500RL7
- Part No.:
- ADG902BCP-500RL7
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 8-WFDFN Exposed Pad, CSP
- Datasheet:
-
ADG902BCP-500RL7.pdf
- Description:
- IC SWITCH SPST 1.65-2.75V 8LFCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ADG902BCP-500RL7 from Analog Devices is a reflective single-pole single-throw (SPST) RF switch optimized for 0 Hz to 4.5 GHz operation, delivering 40 dB off-isolation at 1 GHz, 0.8 dB insertion loss at 1 GHz, and 17 dBm P1dB compression point - enabling high-fidelity signal routing in antenna diversity and tuner modules without DC blocking capacitors.
For engineers reviewing the ADG902BCP-500RL7 datasheet, ADG902BCP-500RL7 pinout, ADG902BCP-500RL7 application, or ADG902BCP-500RL7 equivalent, key selection criteria include its reflective architecture, LFCSP-8 package thermal performance, 1.65 V–2.75 V CMOS/LVTTL control compatibility, and verified RF port handling of up to 0.5 V DC bias.
Technical Context
The ADG902BCP-500RL7 implements a reflective SPST topology with 0 Ω shunt-to-ground termination on the off port, distinguishing it from the absorptive ADG901. Its internal CMOS control logic accepts 1.65 V–2.75 V logic levels and draws <1 µA quiescent current.
It operates across DC to 4.5 GHz (−3 dB frequency), maintains 34–40 dB isolation from 100 MHz to 1 GHz, and achieves 25–28 dB return loss on the on-channel at 1 GHz - all specified over −40°C to +85°C with 8-lead LFCSP packaging and exposed pad grounding.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 4.5 GHz (−3 dB bandwidth); supports baseband-to-RF signal switching including DC-coupled IF paths. |
| Off Isolation | 40 dB typical at 1 GHz; ensures minimal crosstalk between RF1 and RF2 when switched off. |
| Insertion Loss | 0.8 dB typical at 1 GHz; preserves signal amplitude integrity in active signal paths. |
| P1dB Compression | 17 dBm at 1 GHz; defines maximum linear RF power handling before 1 dB gain compression. |
| Switching Time | tON = 3.6–6 ns, tOFF = 5.8–9.5 ns; enables fast reconfiguration in time-division duplex or multi-band systems. |
| Control Logic | CMOS/LVTTL compatible (VINH ≥ 0.65×VDD, VINL ≤ 0.35×VDD); eliminates level-shifter requirements in mixed-voltage designs. |
| DC Bias Handling | Passes DC signals up to 0.5 V; removes need for series DC-blocking capacitors in bias-t networks or envelope tracking paths. |
Pinout & Package
ADG902BCP-500RL7 uses an 8-lead Lead Frame Chip Scale Package (LFCSP), 3 mm × 3 mm body, 0.75 mm height, with exposed pad requiring connection to PCB ground plane for thermal and electrical performance. Pin 1 identifier located at top-left corner; exposed pad (EPAD) must be soldered to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VDD) | Positive supply input | Accepts 1.65 V–2.75 V; requires local 0.1 µF decoupling to GND for RF stability. |
| 2 (CTRL) | Digital control input | CMOS/LVTTL-compatible; logic high connects RF1–RF2, logic low isolates them. |
| 3,5,6,7 (GND) | Ground reference | Four dedicated ground pins minimize ground inductance and improve RF return path integrity. |
| 4 (RF1) | RF input/output port | 50 Ω matched port; bidirectional; handles DC-coupled signals ≤ 0.5 V. |
| 8 (RF2) | RF input/output port | 50 Ω matched port; bidirectional; same DC bias and RF specs as RF1. |
| EPAD | Exposed thermal pad | Mandatory connection to solid GND plane; critical for thermal dissipation (θJA = 48°C/W on 4-layer board). |
Key Features
| Feature | Design Value |
|---|---|
| Reflective SPST architecture | 0 Ω shunt-to-ground on off-port enables compact layout vs. absorptive switches; suitable where off-port VSWR is non-critical. |
| DC-coupled RF path | Supports 0 V to 0.5 V DC bias superimposed on RF; eliminates external DC-blocking capacitors in bias tee or envelope tracking circuits. |
| Ultra-low power control | <1 µA quiescent supply current (IDD) at VDD = 2.5 V; ideal for battery-powered RF front-ends and IoT transceivers. |
| High-speed switching | Sub-10 ns turn-on/turn-off times enable use in TDD systems, fast filter bank selection, and digital predistortion feedback loops. |
| Robust RF linearity | 28.5–36 dBm IP3 at 900 MHz; minimizes intermodulation distortion in multi-carrier LTE/Wi-Fi coexistence scenarios. |
Applications
| Antenna Diversity Switching | Tuner Module Signal Routing |
|---|---|
Use Scenario: Dynamically selecting between two or more antennas in mobile handsets or base stations to mitigate fading. IC Role / Device Role / Timing Role: Reflective SPST switch isolating inactive antenna paths while passing RF through active path with minimal loss. Use Value: 40 dB off-isolation prevents coupling between antennas; 0.8 dB insertion loss preserves receive sensitivity and transmit efficiency. |
Use Scenario: Routing RF signals between multiple band-select filters and mixer stages in broadcast or cellular tuners. IC Role / Device Role / Timing Role: High-speed RF path selector enabling rapid band switching without DC blocking components. Use Value: DC-coupled operation allows integration with bias tees; 4.5 GHz bandwidth covers FM, DAB, LTE, and 5G NR sub-6 GHz bands. |
| Dual-Band Transceiver Front-End | IF Switching in Digital Receivers |
Use Scenario: Sharing a single RF front-end between two frequency bands (e.g., LTE Band 1 + Band 3) using time-division multiplexing. IC Role / Device Role / Timing Role: Fast-switching SPST element toggling between band-specific filter chains during TDD guard intervals. Use Value: 6 ns typical tON/tOFF ensures clean band transitions; 17 dBm P1dB accommodates high-power PA output sampling. |
Use Scenario: Selecting between multiple IF paths (e.g., 10.7 MHz, 21.4 MHz, 70 MHz) in software-defined radio or spectrum analyzers. IC Role / Device Role / Timing Role: Low-distortion, wideband switch maintaining signal fidelity across IF frequencies up to 1 GHz. Use Value: 25–28 dB return loss ensures impedance match into downstream mixers or ADC drivers; flat insertion loss avoids gain calibration drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF SPST switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADG902BRMZ | Same die, MSOP-8 package (RM-8); θJA = 206°C/W vs. 48°C/W for LFCSP; larger footprint and higher thermal resistance. | Suitable for prototyping or lower-power layouts where thermal constraints allow larger package; not drop-in compatible due to different land pattern and exposed pad. | Select ADG902BRMZ only if MSOP-8 assembly infrastructure exists and thermal margin permits. |
| Qorvo QM11036 | Reflective SPST, 0.1–6.0 GHz, 0.6 dB IL @ 2.4 GHz, 37 dB isolation @ 2.4 GHz, 1.8–5.5 V control; no DC bias support. | Broader frequency coverage but lacks DC-coupled capability; requires external biasing for envelope tracking or bias tee integration. | Choose QM11036 when operating above 4.5 GHz or needing wider voltage control range; avoid if DC bias pass-through is required. |
Compared with ADG902BCP-500RL7, ADG902BRMZ shares identical RF performance but trades thermal efficiency for legacy package compatibility, while QM11036 extends frequency range at the cost of DC coupling - making ADG902BCP-500RL7 optimal for thermally constrained, DC-biased, sub-4.5 GHz RF routing.
Availability
ADG902BCP-500RL7 is available at Aetrix Electronics and suitable for wireless communications infrastructure, tuner modules, and antenna diversity systems requiring stable component supply, RoHS-compliant packaging, and guaranteed long-term availability.
Supply support for ADG902BCP-500RL7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, headquartered in Norwood, MA, serving precision instrumentation, communications, and industrial markets since 1965.
The ADG902BCP-500RL7 belongs to Analog Devices' wideband RF switch product line, engineered specifically for high-isolation, low-loss, DC-coupled signal routing in compact, thermally demanding wireless front-ends.
FAQ
What is the maximum DC voltage that can be passed through ADG902BCP-500RL7 without damage?
The ADG902BCP-500RL7 supports DC-coupled operation up to 0.5 V on RF1 or RF2 ports under normal conditions. Exceeding this voltage risks violating absolute maximum ratings - specifically, RFx inputs must remain within −0.5 V to VDD − 0.5 V. At VDD = 2.75 V, the safe DC range is −0.5 V to +2.25 V, but functional DC pass-through is limited to 0.5 V per the datasheet's operational specification. Always verify bias network compliance with Table 3's input voltage limits.
Is ADG902BCP-500RL7 pin-compatible with ADG901BCPZ-500RL7?
No, ADG902BCP-500RL7 is not pin-compatible with ADG901BCPZ-500RL7 despite identical LFCSP-8 packaging and pinout numbering. The ADG901 is an absorptive switch with 50 Ω shunt terminations, while the ADG902 is reflective with 0 Ω shunts - resulting in fundamentally different RF port behavior, VSWR characteristics, and system-level matching requirements. Swapping them requires redesign of surrounding impedance-matching networks and may degrade isolation or return loss.
Does ADG902BCP-500RL7 require external DC-blocking capacitors in RF signal paths?
No, ADG902BCP-500RL7 does not require external DC-blocking capacitors when passing DC voltages ≤ 0.5 V superimposed on RF signals. Its internal architecture allows true DC-coupled operation, enabling direct integration into bias tee networks, envelope tracking paths, and DC-biased mixer interfaces - reducing bill-of-materials count and preserving signal integrity at baseband frequencies.
What is the thermal resistance (θJA) of ADG902BCP-500RL7 in standard PCB layouts?
The ADG902BCP-500RL7 has a junction-to-ambient thermal resistance (θJA) of 48°C/W when mounted on a 4-layer PCB with proper thermal vias connecting the exposed pad to internal ground planes. On a 2-layer board, θJA rises to 84°C/W. These values assume full EPAD soldering to GND and conform to JEDEC standards MO-229-WEED-4. Thermal performance degrades significantly if the exposed pad is left unconnected or undersized.
Can ADG902BCP-500RL7 operate with a 1.8 V supply, and how does that affect RF performance?
Yes, ADG902BCP-500RL7 is fully specified for operation from 1.65 V to 2.75 V, including 1.8 V. At 1.8 V, insertion loss increases by ~0.1–0.2 dB across 100 MHz–1 GHz versus 2.5 V operation, and off-isolation decreases by ~2–3 dB at 1 GHz. P1dB drops to ~16 dBm. All timing parameters (tON, tOFF) remain within spec. System-level validation is recommended when operating at minimum VDD.
ADG902BCP-500RL7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad, CSP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Topology:
- Reflective
- Circuit:
- SPST
- Frequency Range:
- -
- Isolation:
- -
- Insertion Loss:
- -
- Test Frequency:
- -
- P1dB:
- 17dBm (typ) P1dB
- IIP3:
- 36dBm (typ)
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 1.65V ~ 2.75V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-LFCSP (3x3)
ADG902BCP-500RL7 FAQ
1.How can I place an order for ADG902BCP-500RL7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADG902BCP-500RL7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADG902BCP-500RL7 reliable?
The price and inventory of ADG902BCP-500RL7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADG902BCP-500RL7 is usually 5 days.
3.What payment methods are accepted for ADG902BCP-500RL7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADG902BCP-500RL7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADG902BCP-500RL7?
ADG902BCP-500RL7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADG902BCP-500RL7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADG902BCP-500RL7?
For technical support, including ADG902BCP-500RL7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADG902BCP-500RL7 requirements.
6.How does Aetrix verify that ADG902BCP-500RL7 is sourced from the original manufacturer or authorized distributors?
All ADG902BCP-500RL7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADG902BCP-500RL7 meets industry standards.
7.What is the process for return or replacement of ADG902BCP-500RL7?
All ADG902BCP-500RL7 units undergo pre-shipment inspection (PSI). If there is an issue with ADG902BCP-500RL7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADG902BCP-500RL7 part is unused and in its original packaging.
Return procedure for ADG902BCP-500RL7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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