Analog Devices Inc. ADG918BRM-500RL7
- Part No.:
- ADG918BRM-500RL7
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
ADG918BRM-500RL7.pdf
- Description:
- IC RF SWITCH SPDT 2GHZ 8MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,225
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADG918BRM-500RL7 from Analog Devices is an absorptive 2:1 RF SPDT switch IC designed for high-isolation signal routing in wireless front ends. It delivers 43 dB off-isolation at 1 GHz, 0.8 dB insertion loss at 1 GHz, and operates from a single 1.65 V to 2.75 V CMOS supply. Its matched 50 Ω shunt legs enable low-reflection switching in antenna diversity and transceiver T/R paths.
For engineers reviewing the ADG918BRM-500RL7 datasheet, ADG918BRM-500RL7 pinout, ADG918BRM-500RL7 application, or ADG918BRM-500RL7 equivalent, key selection criteria include absorptive port matching, sub-10 ns switching times, −40°C to +85°C industrial temperature range, and MSOP-8 package compatibility with 50 Ω RF layout constraints.
Technical Context
The ADG918BRM-500RL7 implements an absorptive (matched) RF switch architecture with internally terminated 50 Ω shunt legs on RF1 and RF2, ensuring stable VSWR regardless of switch state. Its on-board CMOS/LVTTL-compatible control logic eliminates external level-shifting circuitry.
It supports DC–4 GHz operation with −3 dB bandwidth, maintains <1 μA quiescent current, and achieves 28.5 dBm IP3 at 900 MHz - enabling use in low-power, high-linearity digital transceiver front ends without external bias networks or matching components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Off Isolation | 43 dB @ 1 GHz (RFC-to-RF1/RF2); ensures strong signal blocking between transmit/receive paths) |
| Insertion Loss | 0.8 dB @ 1 GHz (S21/S12); minimizes RF path attenuation in active signal routing) |
| Switching Time | tON = 10 ns max; enables fast mode reconfiguration in time-division duplex systems) |
| Supply Voltage | 1.65 V to 2.75 V; compatible with 1.8 V and 2.5 V logic domains without level shifters) |
| IP3 | 28.5 dBm @ 900 MHz; supports clean multi-tone operation in FDD/TDD receivers) |
| Return Loss (On) | 22 dB @ 1 GHz (S11/S22); confirms good 50 Ω match into active channel for minimal reflection) |
| Package | 8-lead MSOP (RM-8); 3 mm × 3 mm footprint with exposed thermal pad for RF grounding) |
Pinout & Package
ADG918BRM-500RL7 uses an 8-lead Mini Small Outline Package (MSOP, RM-8) with exposed thermal pad tied to GND. The package supports standard reflow profiles and requires decoupling capacitance on VDD.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pin 1) | Power supply input | 1.65 V–2.75 V supply rail; must be decoupled to GND with 0.1 µF capacitor near pin |
| CTRL (Pin 2) | Digital control input | CMOS/LVTTL-compatible logic signal; high selects RF1→RFC, low selects RF2→RFC |
| GND (Pins 3, 6, 7) | Ground reference | Common RF and digital ground; all three pins must connect to low-inductance ground plane |
| RFC (Pin 4) | Common RF port | 50 Ω-terminated RF output/input; connects to antenna, PA, or LNA in T/R applications |
| RF1 (Pin 5) | RF port 1 | 50 Ω-terminated input/output; used for TX path or primary filter branch in absorptive configuration |
| RF2 (Pin 8) | RF port 2 | 50 Ω-terminated input/output; used for RX path or secondary filter branch in absorptive configuration |
Key Features
| Feature | Design Value |
|---|---|
| Matched absorptive architecture | 50 Ω shunt termination on RF1/RF2 ensures consistent VSWR <1.3:1 in both ON/OFF states, eliminating need for external matching |
| Ultra-low power consumption | <1 μA IDD enables battery-powered IoT and metering applications without duty cycling overhead |
| High linearity | 28.5 dBm IP3 and 17 dBm P−1dB support multi-carrier LTE/Wi-Fi signals without distortion-induced adjacent-channel interference |
| Fast, symmetric switching | 6.6 ns tON / 6.5 ns tOFF with 6.1 ns rise/fall times enable precise timing in burst-mode protocols like NB-IoT |
| Wideband RF performance | −3 dB bandwidth to 4 GHz allows reuse across 700 MHz–2.7 GHz bands without redesign |
Applications
| Antenna Diversity Switching | Transmit/Receive Front-End Switching |
|---|---|
Use Scenario: Selecting between two spatially separated antennas in mobile handsets or smart meters to mitigate fading. IC Role / Device Role / Timing Role: Absorptive SPDT switch routing RF signal from selected antenna to tuner/LNA while terminating unused antenna port to 50 Ω. Use Value: Maintains 43 dB isolation and <1.3:1 VSWR on both ports, preventing desense and ensuring consistent receive sensitivity across antennas. | Use Scenario: Isolating transmit and receive paths in half-duplex ISM-band transceivers (e.g., ADF7020-based utility meters). IC Role / Device Role / Timing Role: T/R switch controlled by baseband logic; routes PA output to antenna during TX and LNA input to antenna during RX. Use Value: 43 dB RFC-to-RF1/RF2 isolation prevents TX leakage from saturating LNA; absorptive design avoids reflected energy damaging PA. |
| Tuner Module Input Selection | High-Speed Filter Bank Switching |
Use Scenario: Switching between cable TV feed and terrestrial antenna inputs in set-top box tuners. IC Role / Device Role / Timing Role: 2:1 RF multiplexer selecting either RF source to common tuner IF stage, with CTRL pin synchronized to channel change command. Use Value: 0.8 dB insertion loss preserves SNR; 22 dB return loss ensures minimal mismatch ripple across 50–860 MHz CATV band. | Use Scenario: Routing RF signals among multiple bandpass filters in software-defined radio or spectrum analyzers. IC Role / Device Role / Timing Role: Demultiplexer directing one of two filter outputs to common measurement path, reconfigured in <10 ns for rapid sweep modes. Use Value: Sub-10 ns switching enables >100 kHz filter update rates; 43 dB isolation prevents crosstalk between adjacent filter channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF SPDT switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADG919BRM-500RL7 | Reflective (0 Ω shunt) architecture; 37 dB isolation @ 1 GHz (RM package); higher crosstalk (33 dB) | Suitable where VSWR on off-port is not critical (e.g., filter selection), but not recommended for antenna or T/R paths requiring low reflections | Select ADG919BRM-500RL7 only when board layout cannot accommodate absorptive termination or when cost is prioritized over return loss |
| Qorvo QM11036 | 3.3 V supply; 45 dB isolation @ 1 GHz; 0.7 dB IL; 3.5 ns switching; GaAs process | Requires level-shifting for 1.8 V control; better for high-power PA output switching due to higher P1dB (+30 dBm) | Choose QM11036 when operating above 2.75 V supply or needing faster switching and higher power handling than ADG918BRM-500RL7 supports |
Compared with ADG919BRM-500RL7 and QM11036, ADG918BRM-500RL7 uniquely balances ultra-low voltage operation (1.65 V), absorptive matching, and industrial temperature range in a compact MSOP - making it optimal for space-constrained, battery-sensitive, and reflection-critical RF routing where 43 dB isolation and <1 μA quiescent current are mandatory.
Availability
ADG918BRM-500RL7 is available at Aetrix Electronics and suitable for wireless metering, antenna diversity systems, and digital transceiver front ends requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for ADG918BRM-500RL7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and industrial markets since 1965.
The ADG9xx product line delivers wideband, low-distortion RF switches optimized for wireless infrastructure, consumer tuners, and IoT connectivity - with the ADG918BRM-500RL7 specifically engineered for absorptive, low-voltage, high-isolation signal routing in compact portable devices.
FAQ
What is the maximum RF input power the ADG918BRM-500RL7 can handle before compression?
The ADG918BRM-500RL7 has a P−1 dB of 17 dBm at 1000 MHz, meaning its insertion loss increases by 1 dB when the RF input power reaches +17 dBm. This value is measured under typical conditions (VDD = 2.5 V, TA = 25°C) and remains ≥16 dBm across the full −40°C to +85°C operating range. Engineers should verify headroom against system-level peak-to-average power ratios when deploying ADG918BRM-500RL7 in burst-mode transmitters.
Does the ADG918BRM-500RL7 require external matching components for 50 Ω operation?
No, the ADG918BRM-500RL7 does not require external matching components. Its absorptive architecture integrates 50 Ω shunt terminations on RF1 and RF2 ports, delivering 22 dB return loss on the active channel and 16–20 dB on the off channel at 1 GHz. This internal matching eliminates discrete baluns, capacitors, or resistors typically needed with reflective switches - simplifying PCB layout and reducing bill-of-materials cost for ADG918BRM-500RL7 implementations.
Can the ADG918BRM-500RL7 operate from a 1.8 V supply, and how does that affect RF performance?
Yes, the ADG918BRM-500RL7 is fully specified for 1.65 V to 2.75 V operation, including 1.8 V. At 1.8 V, insertion loss increases by ≤0.1 dB versus 2.5 V (e.g., 0.9 dB vs. 0.8 dB @ 1 GHz), isolation degrades by ≤2 dB (41 dB vs. 43 dB @ 1 GHz), and switching times remain within spec (tON ≤ 10 ns). This makes ADG918BRM-500RL7 ideal for 1.8 V SoC interfaces without level translation, preserving RF integrity in low-voltage IoT designs.
How is the exposed thermal pad on the ADG918BRM-500RL7 MSOP package intended to be connected?
Per Analog Devices' RM-8 package drawing, the exposed thermal pad on the ADG918BRM-500RL7 is internally connected to substrate and GND. It must be soldered directly to a low-impedance PCB ground plane using a thermally robust stencil pattern (≥60% copper fill) to ensure mechanical reliability and optimal RF grounding. Failure to connect this pad degrades thermal resistance (θJA rises from 206°C/W to >300°C/W) and compromises isolation and return loss performance in ADG918BRM-500RL7 layouts.
Is the ADG918BRM-500RL7 pin-compatible with other members of the ADG918/ADG919 family?
Yes, the ADG918BRM-500RL7 shares identical pinout and footprint with all ADG918 and ADG919 variants in the RM-8 (MSOP) package, including ADG918BRM, ADG919BRM, and their RoHS-compliant Z-versions. This allows direct substitution within the same package variant - though functional differences exist (e.g., ADG919 is reflective), so schematic and layout validation is required before swapping ADG918BRM-500RL7 for ADG919BRM-500RL7 in absorptive-critical applications.
ADG918BRM-500RL7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- ADG918
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- RF Type:
- General Purpose
- Topology:
- Absorptive
- Circuit:
- SPDT
- Frequency Range:
- DC ~ 2GHz
- Isolation:
- 33dB
- Insertion Loss:
- 0.8dB
- Test Frequency:
- 1GHz
- P1dB:
- 17dBm
- IIP3:
- 36dBm
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 1.65V ~ 2.75V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
ADG918BRM-500RL7 FAQ
1.How can I place an order for ADG918BRM-500RL7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADG918BRM-500RL7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADG918BRM-500RL7 reliable?
The price and inventory of ADG918BRM-500RL7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADG918BRM-500RL7 is usually 5 days.
3.What payment methods are accepted for ADG918BRM-500RL7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADG918BRM-500RL7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADG918BRM-500RL7?
ADG918BRM-500RL7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADG918BRM-500RL7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADG918BRM-500RL7?
For technical support, including ADG918BRM-500RL7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADG918BRM-500RL7 requirements.
6.How does Aetrix verify that ADG918BRM-500RL7 is sourced from the original manufacturer or authorized distributors?
All ADG918BRM-500RL7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADG918BRM-500RL7 meets industry standards.
7.What is the process for return or replacement of ADG918BRM-500RL7?
All ADG918BRM-500RL7 units undergo pre-shipment inspection (PSI). If there is an issue with ADG918BRM-500RL7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADG918BRM-500RL7 part is unused and in its original packaging.
Return procedure for ADG918BRM-500RL7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADG918BRM-500RL7 Tags

-
BGS13SN8E6327XTSA1
Infineon Technologies

-
BGS12WN6E6327XTSA1
Infineon Technologies

-
BGS12P2L6E6327XTSA1
Infineon Technologies

-
BGS12PN10E6327XTSA1
Infineon Technologies

-
NJG1801K75-TE1
Nisshinbo Micro Devices Inc.

-
BGS14PN10E6327XTSA1
Infineon Technologies

-
SKY13348-374LF
Skyworks Solutions Inc.

-
4259-63
pSemi

-
PE42421SCAA-Z
pSemi

-
AS179-92LF
Skyworks Solutions Inc.

-
SKY13351-378LF
Skyworks Solutions Inc.

-
AS215-92LF
Skyworks Solutions Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

