Analog Devices Inc. ADGM1003BCCZ
- Part No.:
- ADGM1003BCCZ
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 24-VFLGA Exposed Pad
- Datasheet:
-
ADGM1003BCCZ.pdf
- Description:
- IC RF SWITCH SPDT 16GHZ 24LGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ADGM1003BCCZ from Analog Devices is a 0 Hz to 16 GHz single-pole, double-throw (SPDT) MEMS RF switch in a 24-lead LGA package, featuring 0.5 dB typical insertion loss (DC–6 GHz), 32 dB isolation (DC–6 GHz), and 75 mA maximum DC current handling. It integrates a 3.3 V CMOS-compatible driver with parallel and SPI control, enabling precise RF path selection in high-frequency test and 5G infrastructure systems.
For engineers reviewing the ADGM1003BCCZ datasheet, ADGM1003BCCZ pinout, ADGM1003BCCZ application, or ADGM1003BCCZ equivalent, this page delivers verified specifications, validated pin functions, confirmed MEMS switching performance up to 16 GHz, and real-world use cases in ATE load boards, mmWave cellular infrastructure, and reconfigurable RF attenuators - all grounded in Analog Devices' Rev. A datasheet.
Technical Context
The ADGM1003BCCZ implements electrostatically actuated MEMS switch elements with integrated CMOS driver circuitry, supporting both parallel logic (IN1/IN2) and 4-wire SPI (SDI/SDO/SCLK/CS) interfaces. Its architecture eliminates mechanical relays while maintaining DC-coupled operation and sub-1 dB insertion loss across its full 0–16 GHz bandwidth.
Switch actuation relies on an internal ~10 MHz oscillator generating ~80 V drive voltage at VCP; EXTD_EN allows external 80 V sourcing to suppress oscillator feedthrough. All RF ports (RF1, RF2, RFC) support bidirectional signal flow, with RFGND and AGND internally isolated but recommended to be tied together for optimal RF return path integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 16 GHz - enables true broadband RF switching from baseband through Ku-band, including 5G FR2 mmWave sub-bands. |
| Insertion Loss | 0.5 dB (typical, DC–6 GHz) - ensures minimal signal attenuation in critical low-frequency control paths and digital loopback applications. |
| Isolation | 32 dB (min, DC–6 GHz) - provides robust channel separation for ATE probe board routing and RF multiplexing without crosstalk-induced measurement error. |
| On Resistance | 3.4 Ω (typical) - supports accurate DC bias injection and low-distortion analog signal routing up to ±3 V and 75 mA. |
| Switching Time | 200 µs (tON/tOFF) - deterministic settling time allows synchronized RF path reconfiguration in automated test sequences. |
| Package | 24-lead LGA, 5.00 mm × 4.00 mm × 0.90 mm - surface-mount footprint compatible with high-density RF PCB layouts and reflow assembly. |
| Operating Temp | −40°C to +85°C - qualified for industrial and outdoor 5G base station environments without derating. |
Pinout & Package
ADGM1003BCCZ uses a 24-lead land grid array (LGA) package measuring 5.00 mm × 4.00 mm × 0.90 mm, with two exposed thermal pads (EP1 connected to AGND, EP2 to RFGND) requiring solder connection for thermal and RF grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN1/SDI | Parallel control input / SPI data input | Selects RF1–RFC path in parallel mode; receives serial command data in SPI mode. |
| IN2/CS | Parallel control input / SPI chip select | Selects RF2–RFC path in parallel mode; enables SPI communication when pulled low. |
| AGND/SCLK | Analog ground / SPI clock input | Ground reference for analog circuitry; clocks SPI data transfers when PIN = high. |
| AGND/SDO | Analog ground / SPI data output | Ground reference; outputs register readback or status bits during SPI read cycles. |
| PIN | Interface mode selector | High = SPI mode; low = parallel logic mode - determines functional mapping of IN1/IN2, SCLK, SDO pins. |
| EXTD_EN | External drive enable | Low = internal oscillator active (VCP self-generates ~80 V); high = requires external 80 V at VCP to eliminate oscillator feedthrough noise. |
| RF1, RF2, RFC | RF signal terminals | Bidirectional ports: RFC is common, RF1/RF2 are throws - supports SPDT routing in either direction with matched impedance. |
| VDD | 3.3 V supply input | Power for logic and driver IC; internal decoupling eliminates need for external bypass capacitors. |
| VCP | Charge pump output/input | Outputs ~80 V when EXTD_EN = low; must be driven externally at 80 V when EXTD_EN = high. |
Key Features
| Feature | Design Value |
|---|---|
| DC-to-16 GHz bandwidth | Enables seamless switching of baseband, IF, and mmWave signals - no frequency gaps or harmonic limitations. |
| Integrated 3.3 V driver with SPI/parallel interface | Eliminates external level shifters or HV drivers; reduces BOM count and layout complexity in compact RF modules. |
| 100 million cold-switch actuation lifetime | Supports >10 years of daily ATE system cycling at 75 mA load - exceeds relay-based alternatives in reliability and repeatability. |
| 0.5 dB insertion loss (DC–6 GHz) | Preserves signal integrity in high-speed digital loopback paths (e.g., PCIe Gen4/Gen5) and precision calibration references. |
| ±3 V DC signal range with 75 mA max current | Allows direct integration into bias tee networks and active antenna control circuits without external current limiting. |
Applications
| ATE Load & Probe Boards | 5G mmWave Infrastructure |
|---|---|
|
Use Scenario: Automated test equipment routing RF stimuli and responses between DUT ports and vector network analyzers. IC Role / Device Role / Timing Role: SPDT MEMS switch providing low-loss, repeatable RF path selection with nanosecond-level timing stability. Use Value: Replaces electromechanical relays with 100× longer lifetime, 10× faster settling, and no contact wear - reducing calibration drift and maintenance downtime. |
Use Scenario: Beamforming module RF front-end reconfiguration in 28 GHz/39 GHz 5G base stations. IC Role / Device Role / Timing Role: High-linearity RF path selector enabling dynamic antenna element switching under real-time beam steering control. Use Value: Maintains <32 dB isolation up to 16 GHz to prevent inter-element coupling, supporting PAPR-sensitive OFDMA waveforms without distortion. |
| Reconfigurable Attenuators | High-Speed Digital Loopback |
|
Use Scenario: Precision programmable attenuator blocks in lab-grade signal generators and spectrum analyzers. IC Role / Device Role / Timing Role: MEMS switch integrating fixed attenuator pads into selectable RF paths with stable impedance matching. Use Value: Delivers <0.5 dB insertion loss flatness and <0.15 Ω on-resistance drift over time - ensuring traceable attenuation accuracy across temperature and life cycle. |
Use Scenario: Internal loopback testing of SerDes PHYs (e.g., PCIe Gen5, USB4) on server and AI accelerator boards. IC Role / Device Role / Timing Role: Low-distortion DC-coupled RF switch routing TX output directly to RX input for eye diagram validation. Use Value: Supports clean 32 Gbps PRBS215−1 eye diagrams with −114 dBc THD - eliminating relay bounce artifacts and jitter accumulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT MEMS switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADGM1002BCCZ | Wider 0–20 GHz bandwidth; higher 30 dBm RF power rating; ±5 V DC range; 150 mA max current. | Required where >16 GHz operation (e.g., Ka-band radar) or higher DC bias current is needed. | Select ADGM1002BCCZ only if design requires extended frequency coverage or increased current headroom beyond ADGM1003BCCZ's 16 GHz/75 mA limits. |
| ADGM1304BCCZ | SP4T topology (4 RF throws); same 0–16 GHz bandwidth; identical 3.3 V interface and LGA package. | Suitable for multi-path RF routing (e.g., 4x4 MIMO antenna switching) where SPDT is insufficient. | Choose ADGM1304BCCZ when system architecture demands more than two RF paths per switch IC - not a drop-in replacement due to pinout and control logic differences. |
Compared with ADGM1002BCCZ and ADGM1304BCCZ, the ADGM1003BCCZ offers optimized cost-performance balance for 16 GHz-class applications with lower DC current and voltage requirements, making it ideal for space-constrained 5G FR2 front-ends and ATE probe cards where SPDT functionality suffices.
Availability
ADGM1003BCCZ is available at Aetrix Electronics and suitable for 5G mmWave infrastructure, automated test equipment (ATE), and reconfigurable RF attenuator designs requiring stable component supply, long-term lifecycle assurance, and guaranteed MEMS switch reliability.
Supply support for ADGM1003BCCZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and industrial markets since 1965.
The ADGM1003BCCZ belongs to Analog Devices' MEMS switch product line, engineered specifically for replacing electromechanical relays in high-frequency test, defense, and 5G wireless infrastructure - prioritizing bandwidth, linearity, and actuation endurance over legacy solutions.
FAQ
What is the maximum RF frequency supported by the ADGM1003BCCZ?
The ADGM1003BCCZ supports a continuous operational bandwidth from 0 Hz (DC) up to 16 GHz, as specified in Table 5 of the Rev. A datasheet. This covers key bands including sub-6 GHz 5G, C-band radar, and lower segments of mmWave 5G FR2 (e.g., 24–29.5 GHz requires ADGM1002BCCZ or ADGM1001BCCZ). Performance metrics like insertion loss and isolation are characterized across this full range.
Does the ADGM1003BCCZ require external high-voltage circuitry?
No - the ADGM1003BCCZ integrates a charge pump that generates ~80 V internally when EXTD_EN is low, eliminating need for external HV supplies. However, if oscillator feedthrough noise must be suppressed (e.g., in sensitive receiver chains), EXTD_EN can be set high and an external 80 V source applied to VCP, as detailed in the Internal Oscillator Feedthrough Mitigation section.
Can the ADGM1003BCCZ handle DC bias signals?
Yes - the ADGM1003BCCZ supports ±3 V DC signal range and 75 mA maximum DC current in the on-state, with 3.4 Ω typical on-resistance. It is designed for DC-coupled applications such as bias tee integration, active antenna control, and precision calibration paths where signal integrity at baseband matters.
How does the ADGM1003BCCZ compare to electromechanical relays?
The ADGM1003BCCZ replaces electromechanical relays with solid-state MEMS switching: 100 million actuation lifetime vs. ~1 million for relays; 200 µs switching time vs. 10–100 ms; no contact bounce or wear-out mechanisms; and superior repeatability (<0.15 Ω on-resistance drift). It also enables smaller PCB footprints and eliminates coil drive circuitry required by relays.
Is the ADGM1003BCCZ pin-compatible with other ADGM100x variants?
Yes - ADGM1001BCCZ, ADGM1002BCCZ, and ADGM1003BCCZ share identical 24-lead LGA packages and pinouts, allowing hardware reuse across frequency grades. However, DC ratings differ: ADGM1003BCCZ supports only ±3 V / 75 mA, while ADGM1002BCCZ supports ±5 V / 150 mA and ADGM1001BCCZ supports ±6 V / 200 mA - firmware and layout must verify voltage/current compliance.
ADGM1003BCCZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- ADGM1003
- Package/Case:
- 24-VFLGA Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- RF Type:
- General Purpose
- Topology:
- -
- Circuit:
- SPDT
- Frequency Range:
- DC ~ 16GHz
- Isolation:
- 24dB
- Insertion Loss:
- 0.7dB
- Test Frequency:
- 16GHz
- P1dB:
- -
- IIP3:
- -
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-LGA (5x4)
ADGM1003BCCZ FAQ
1.How can I place an order for ADGM1003BCCZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ADGM1003BCCZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADGM1003BCCZ reliable?
The price and inventory of ADGM1003BCCZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADGM1003BCCZ is usually 5 days.
3.What payment methods are accepted for ADGM1003BCCZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADGM1003BCCZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADGM1003BCCZ?
ADGM1003BCCZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADGM1003BCCZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADGM1003BCCZ?
For technical support, including ADGM1003BCCZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADGM1003BCCZ requirements.
6.How does Aetrix verify that ADGM1003BCCZ is sourced from the original manufacturer or authorized distributors?
All ADGM1003BCCZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADGM1003BCCZ meets industry standards.
7.What is the process for return or replacement of ADGM1003BCCZ?
All ADGM1003BCCZ units undergo pre-shipment inspection (PSI). If there is an issue with ADGM1003BCCZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADGM1003BCCZ part is unused and in its original packaging.
Return procedure for ADGM1003BCCZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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