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Analog Devices Inc. ADGM1003BCCZ-RL7
- Part No.:
- ADGM1003BCCZ-RL7
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 24-VFLGA Exposed Pad
- Datasheet:
-
ADGM1003BCCZ-RL7.pdf
- Description:
- IC RF SWITCH SPDT 16GHZ 24LGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,301
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Product details
Overview
ADGM1003BCCZ-RL7 from Analog Devices is a 0 Hz to 16 GHz single-pole, double-throw (SPDT) MEMS RF switch in a 24-lead LGA package, featuring 0.5 dB insertion loss (DC–6 GHz), 32 dB isolation (DC–6 GHz), and 75 mA maximum DC current handling. It integrates a 3.3 V CMOS-compatible driver with parallel and SPI control, enabling precise RF path selection in high-frequency test and communication systems.
For engineers reviewing the ADGM1003BCCZ-RL7 datasheet, ADGM1003BCCZ-RL7 pinout, ADGM1003BCCZ-RL7 application, or ADGM1003BCCZ-RL7 equivalent, this page delivers verified specifications, validated pin functions, confirmed RF performance across 0–16 GHz, real-world switching lifetime data (100 million cold-switch cycles), and direct alternative part comparisons for ATE, 5G mmWave, and reconfigurable filter designs.
Technical Context
The ADGM1003BCCZ-RL7 implements electrostatically actuated MEMS switch elements controlled by an integrated driver IC that generates ~80 V internal charge-pump voltage. Its dual-mode interface supports independent parallel logic (IN1/IN2) or daisy-chainable SPI (SDI/SDO/SCLK/CS), with EXTD_EN enabling external 80 V drive to eliminate oscillator feedthrough.
It operates over –40°C to +85°C with ±3 V DC signal range and 27 dBm max RF power into 50 Ω. On-resistance is 3.4 Ω (typical), stable over 100 million actuations at 75 mA load, and exhibits <0.15 Ω on-resistance drift over time per channel - critical for precision DC-coupled RF routing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Bandwidth | 0 Hz to 16 GHz - enables true DC-coupled RF switching, including baseband, sub-6 GHz, and 28 GHz 5G FR2 bands |
| Insertion Loss | 0.5 dB (DC–6 GHz), 0.7 dB (10–16 GHz) - preserves signal integrity in high-speed digital loopback and mmWave front-end paths |
| Isolation | 32 dB (DC–6 GHz), 24 dB (10–16 GHz) - ensures minimal crosstalk between RF1/RF2 paths during channel switching |
| On Resistance | 3.4 Ω (typical) - supports low-loss DC bias injection and precision analog signal routing without significant voltage drop |
| Switching Time | 200 µs (tON/tOFF) - deterministic settling for synchronized ATE stimulus/response timing |
| Max DC Current | 75 mA - sufficient for biasing LNAs, PA drivers, and active antenna elements in compact RF modules |
| Actuation Lifetime | 100 million cold-switch cycles - validated reliability for automated test equipment with frequent path reconfiguration |
Pinout & Package
ADGM1003BCCZ-RL7 uses a 5.00 mm × 4.00 mm × 0.90 mm, 24-lead land grid array (LGA) package with two exposed thermal pads (EP1 = AGND, EP2 = RFGND). The layout supports coplanar waveguide routing and requires tight ground stitching around RF ports.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN1/SDI | Parallel control input / SPI data input | Selects RF1–RFC path in parallel mode; receives register commands in SPI mode |
| IN2/CS | Parallel control input / SPI chip select | Selects RF2–RFC path in parallel mode; enables SPI frame synchronization |
| AGND/SCLK | Analog ground / SPI clock input | Ground reference for analog circuitry; clocks SPI data transfer when PIN=high |
| AGND/SDO | Analog ground / SPI data output | Ground reference; outputs status registers and fault flags in SPI read cycles |
| PIN | Interface mode selector | Low = parallel control (IN1/IN2 active); high = SPI mode (SDI/SDO/SCLK/CS active) |
| EXTD_EN | External drive enable | High disables internal oscillator and requires external 80 V on VCP - eliminates RF feedthrough noise |
| RF1, RF2, RFC | RF signal terminals | Three-port SPDT topology: RFC is common port; RF1/RF2 are selectable throw ports |
| VDD | 3.3 V supply input | Powers internal logic and driver; no external decoupling needed (integrated capacitors) |
| VCP | Charge-pump voltage node | Outputs 80 V (normal mode) or accepts 80 V (EXTD_EN=high); must not be externally loaded |
Key Features
| Feature | Design Value |
|---|---|
| DC-to-16 GHz bandwidth | Enables seamless switching of baseband, IF, and mmWave signals without frequency gaps or harmonic distortion |
| Integrated 3.3 V driver with 80 V charge pump | Eliminates need for external high-voltage generators - simplifies PCB layout and reduces BOM count |
| Parallel + SPI dual-interface control | Supports both simple GPIO-based switching and scalable daisy-chained configuration in dense ATE racks |
| 24-lead LGA with dual exposed pads | Provides low-inductance RF grounding and efficient thermal dissipation for continuous 27 dBm operation |
| ±3 V DC signal range & 75 mA current rating | Permits direct connection to DAC outputs, sensor interfaces, and low-power RFIC bias networks |
Applications
| ATE Load Board Switching | 5G mmWave Beamforming Calibration |
|---|---|
Use Scenario: High-density probe card routing where multiple DUTs require dynamic RF path assignment during wafer-level testing. IC Role / Device Role / Timing Role: SPDT MEMS switch selecting between calibration standards (open/short/load) and DUT RF ports under microsecond timing control. Use Value: 0.5 dB insertion loss below 6 GHz and 200 µs switching ensure measurement repeatability and throughput in production ATE. |
Use Scenario: Phased-array antenna module requiring real-time RF path reconfiguration during beam steering and calibration sequences. IC Role / Device Role / Timing Role: Low-loss RF switch routing signals between TRX ICs and antenna elements in 28 GHz/39 GHz bands. Use Value: 16 GHz bandwidth and 24 dB isolation at 10–16 GHz support accurate S-parameter characterization of mmWave front-ends. |
| Reconfigurable Filter Banks | PCIe Gen5/Gen6 Signal Integrity Testing |
Use Scenario: Software-defined radio (SDR) platform needing programmable band selection via switched filter arrays in sub-6 GHz bands. IC Role / Device Role / Timing Role: MEMS switch enabling/disabling filter sections in ladder or lattice topologies with minimal insertion loss variation. Use Value: 3.4 Ω on-resistance and <0.15 Ω on-resistance drift preserve filter Q-factor and center frequency stability over temperature and lifetime. |
Use Scenario: High-speed interconnect test fixture validating PCIe Gen5 (32 GT/s) and Gen6 (64 GT/s) link training and equalization. IC Role / Device Role / Timing Role: SPDT switch inserting/deleting reference channels or injecting jitter in controlled eye diagram measurements. Use Value: DC coupling and <0.7 dB insertion loss up to 16 GHz maintain signal fidelity for PRBS31 eye opening analysis at 32+ Gbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT MEMS switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADGM1002BCCZ-RL7 | Wider 0–20 GHz bandwidth, 30 dBm RF power rating, ±5 V DC range, 150 mA max current | Better suited for 26 GHz 5G FR2 and higher-power RF front-ends where ADGM1003BCCZ-RL7's 16 GHz limit is insufficient | Select ADGM1002BCCZ-RL7 when operating above 16 GHz or requiring >75 mA DC current handling |
| ADGM1304BCCZ-RL7 | SP4T topology, same 0–16 GHz bandwidth, identical 24-lead LGA package, but adds two extra RF paths | Enables 4:1 multiplexing in compact space-constrained modules where ADGM1003BCCZ-RL7's SPDT topology is limiting | Choose ADGM1304BCCZ-RL7 for multi-source RF routing without adding board area or layer count |
Compared with ADGM1003BCCZ-RL7, ADGM1002BCCZ-RL7 extends usable bandwidth and power handling at the cost of higher current draw, while ADGM1304BCCZ-RL7 doubles routing flexibility within identical footprint and frequency limits - making each optimal for distinct system-level trade-offs in test density, mmWave coverage, or path count.
Availability
ADGM1003BCCZ-RL7 is available at Aetrix Electronics and suitable for automated test equipment (ATE), 5G mmWave infrastructure, reconfigurable RF filters, and high-speed serial compliance testing requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for ADGM1003BCCZ-RL7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and industrial markets since 1965.
The ADGM100x family was designed specifically for high-reliability, wideband RF switching in automated test, defense EW systems, and next-generation wireless infrastructure - replacing electromechanical relays with MEMS technology for superior speed, linearity, and longevity.
FAQ
What is the maximum RF frequency supported by ADGM1003BCCZ-RL7?
ADGM1003BCCZ-RL7 supports a continuous operational bandwidth from 0 Hz (DC) up to 16 GHz. This is explicitly specified in Table 5 of the Rev. A datasheet and validated by insertion loss, isolation, and return loss performance curves up to 16 GHz. Operation beyond 16 GHz is not characterized or guaranteed.
Does ADGM1003BCCZ-RL7 support DC-coupled signal paths?
Yes, ADGM1003BCCZ-RL7 fully supports DC-coupled RF paths, with a specified DC-to-16 GHz bandwidth and ±3 V DC signal range. Its MEMS switch architecture has no blocking capacitors, enabling true 0 Hz operation - confirmed by THD/THD+N measurements at 1 kHz and DC bias capability up to ±3 V.
Can ADGM1003BCCZ-RL7 be used with SPI daisy-chaining?
Yes, ADGM1003BCCZ-RL7 supports SPI daisy-chaining via its SDI (pin 1) and SDO (pin 4) pins. When PIN is high, the device enters SPI mode; multiple units can be cascaded using a single SCLK/CS bus, with SDO of one feeding SDI of the next - detailed in Figures 2 and 3 of the datasheet.
What is the on-resistance specification for ADGM1003BCCZ-RL7?
ADGM1003BCCZ-RL7 has a typical on-resistance (RON) of 3.4 Ω, measured at 50 mA drain-source current and 1 ms after first actuation at 25°C. The datasheet specifies a maximum of 6.5 Ω over temperature (–40°C to +85°C) and confirms <0.15 Ω drift over time - critical for precision DC bias applications.
How does ADGM1003BCCZ-RL7 handle thermal management in continuous operation?
ADGM1003BCCZ-RL7 uses a 24-lead LGA package with two exposed thermal pads (EP1 = AGND, EP2 = RFGND) and a documented θJCB of 123.5°C/W. For continuous 27 dBm RF operation, Analog Devices recommends connecting both EP1 and EP2 to a solid internal ground plane with ≥6 thermal vias to minimize junction temperature rise.
ADGM1003BCCZ-RL7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- ADGM1003
- Package/Case:
- 24-VFLGA Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- General Purpose
- Topology:
- -
- Circuit:
- SPDT
- Frequency Range:
- DC ~ 16GHz
- Isolation:
- 24dB
- Insertion Loss:
- 0.7dB
- Test Frequency:
- 16GHz
- P1dB:
- -
- IIP3:
- -
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-LGA (5x4)
ADGM1003BCCZ-RL7 FAQ
1.How can I place an order for ADGM1003BCCZ-RL7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADGM1003BCCZ-RL7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADGM1003BCCZ-RL7 reliable?
The price and inventory of ADGM1003BCCZ-RL7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADGM1003BCCZ-RL7 is usually 5 days.
3.What payment methods are accepted for ADGM1003BCCZ-RL7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADGM1003BCCZ-RL7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADGM1003BCCZ-RL7?
ADGM1003BCCZ-RL7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADGM1003BCCZ-RL7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADGM1003BCCZ-RL7?
For technical support, including ADGM1003BCCZ-RL7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADGM1003BCCZ-RL7 requirements.
6.How does Aetrix verify that ADGM1003BCCZ-RL7 is sourced from the original manufacturer or authorized distributors?
All ADGM1003BCCZ-RL7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADGM1003BCCZ-RL7 meets industry standards.
7.What is the process for return or replacement of ADGM1003BCCZ-RL7?
All ADGM1003BCCZ-RL7 units undergo pre-shipment inspection (PSI). If there is an issue with ADGM1003BCCZ-RL7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADGM1003BCCZ-RL7 part is unused and in its original packaging.
Return procedure for ADGM1003BCCZ-RL7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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