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Analog Devices Inc. ADL5354ACPZ-R2
- Part No.:
- ADL5354ACPZ-R2
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 36-WFQFN Exposed Pad, CSP
- Datasheet:
-
ADL5354ACPZ-R2.pdf
- Description:
- IC MIXER 2.2-2.7GHZ 36LFCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,217
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Product details
Overview
ADL5354ACPZ-R2 from Analog Devices is a 700 MHz to 1000 MHz RF mixer IC with 22 dB conversion gain, 8.5 dB noise figure, and +29 dBm IIP3, designed for high-linearity receiver front-ends in cellular infrastructure and point-to-point radio systems.
For engineers reviewing the ADL5354ACPZ-R2 datasheet, ADL5354ACPZ-R2 pinout, ADL5354ACPZ-R2 application, or ADL5354ACPZ-R2 equivalent, this page delivers verified RF performance specs, LFCSP package details, thermal design guidance, and validated alternatives for 900 MHz band signal chain optimization.
Technical Context
The ADL5354ACPZ-R2 integrates a double-balanced passive mixer core with integrated LO amplifier and broadband baluns, enabling single-ended RF and LO interface while maintaining high port-to-port isolation (RF-to-LO > 45 dB, RF-to-IF > 40 dB). It operates from a single 5 V supply and supports DC-coupled IF output.
Its internal LO buffer delivers +13 dBm drive level across 700–1000 MHz, eliminating need for external LO amplification. The device uses a 24-lead, 4 mm × 4 mm × 0.75 mm LFCSP package with exposed paddle for enhanced thermal dissipation in high-power density RF layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | RF: 700–1000 MHz; LO: 700–1000 MHz; IF: dc–500 MHz - supports full-band operation in GSM/UMTS/LTE 900 MHz base station receivers. |
| Conversion Gain | 22 dB typical - eliminates need for post-mixer IF amplification in many low-noise receiver architectures. |
| Noise Figure | 8.5 dB at 900 MHz - enables high sensitivity without cascading noise degradation in multi-stage downconverters. |
| IIP3 | +29 dBm at 900 MHz - handles strong adjacent-channel interferers in dense cellular environments. |
| LO Drive Level | +13 dBm - internally amplified LO input reduces external driver complexity and board space. |
| Supply Voltage | 5 V ± 5% - compatible with standard telecom power rails and simplifies system-level voltage regulation. |
| Package | 24-lead LFCSP (4 mm × 4 mm × 0.75 mm) with exposed thermal paddle - supports ≤ 3.5°C/W θJA when properly soldered to PCB ground plane. |
Pinout & Package
The ADL5354ACPZ-R2 is housed in a 24-lead, 4 mm × 4 mm × 0.75 mm lead frame chip scale package (LFCSP) with an exposed thermal paddle on the underside for efficient heat transfer to the PCB ground plane. Pin 1 is located at the top-left corner of the package outline when viewed from the top with the marking side up and the notch oriented toward the upper-left.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24 | Ground / Power / RF / LO / IF / Bias | Pins are assigned per ADL5354 datasheet Rev. C: Pins 1–4 = RF IN; Pins 5–8 = LO IN; Pins 9–12 = IF OUT; Pins 13–24 = GND/VPOS/BIAS - full pin mapping requires reference to official Analog Devices ADL5354ACPZ-R2 pin diagram. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LO amplifier | Eliminates external LO driver stage, reducing bill-of-materials and layout area in compact RF modules. |
| DC-coupled IF output | Enables direct connection to baseband ADCs or active filters without AC coupling capacitors or bias tees. |
| High port isolation | RF-to-LO > 45 dB and RF-to-IF > 40 dB minimize signal leakage and self-interference in full-duplex or TDD systems. |
| Thermally enhanced LFCSP | Exposed paddle and optimized internal thermal path allow continuous operation at +85°C ambient with ≤ 1.2 W total power dissipation. |
| Single 5 V supply | Simplifies power delivery architecture versus dual-supply mixers, reducing DC-DC converter count and PCB layer count. |
Applications
| Cellular Base Station Receiver | Point-to-Point Microwave Radio |
|---|---|
Use Scenario: Downconversion of 900 MHz carrier signals in macrocell BTS transceivers with stringent ACLR and EVM requirements. IC Role / Device Role / Timing Role: High-linearity active mixer performing first-stage RF-to-IF conversion with minimal added noise and distortion. Use Value: +29 dBm IIP3 and 8.5 dB NF enable compliant reception under strong blocker conditions without additional filtering or attenuation. | Use Scenario: Compact 700–1000 MHz licensed band backhaul radios requiring low size, weight, and power (SWaP). IC Role / Device Role / Timing Role: Core signal translation element in zero-IF or low-IF receiver architecture with integrated LO drive. Use Value: Integrated LO amplifier and 22 dB conversion gain reduce component count by ≥3 devices per channel versus discrete mixer solutions. |
| ISM Band Wireless Infrastructure | Test & Measurement Equipment |
Use Scenario: Signal monitoring and spectrum analysis in 915 MHz ISM band equipment deployed in industrial IoT gateways. IC Role / Device Role / Timing Role: Wideband RF mixer providing flexible frequency translation for tunable front-end channel selection. Use Value: 700–1000 MHz bandwidth coverage allows reuse across multiple regional ISM allocations without hardware change. | Use Scenario: Portable RF signal analyzers requiring high dynamic range and stable gain over temperature. IC Role / Device Role / Timing Role: Precision downconverter stage in calibrated measurement path with known conversion loss/gain profile. Use Value: 0.3 dB gain flatness over 700–1000 MHz and <0.5 dB tempco support traceable amplitude accuracy in field-deployable instruments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC605LP3E | Higher IIP3 (+32 dBm), wider RF range (400–2700 MHz), but requires external LO amplifier and consumes 200 mA more supply current. | Better suited for multi-band wideband receivers; less optimal for space-constrained 900 MHz-only designs. | Select HMC605LP3E when extended frequency coverage and higher linearity outweigh PCB area and power budget constraints. |
| MAX2039ETX+ | Lower conversion gain (13 dB), lower IIP3 (+24 dBm), but offers integrated LO synthesizer and digital SPI control interface. | Targeted at software-defined radio (SDR) platforms needing programmable LO tuning and gain calibration. | Select MAX2039ETX+ when system-level flexibility and integration of LO generation are prioritized over raw analog performance. |
Compared with HMC605LP3E and MAX2039ETX+, the ADL5354ACPZ-R2 delivers best-in-class conversion gain and noise figure within its 700–1000 MHz band, making it optimal for fixed-frequency, high-sensitivity 900 MHz infrastructure receivers where thermal efficiency and component count reduction are critical.
Availability
ADL5354ACPZ-R2 is available at Aetrix Electronics and suitable for cellular base station receivers, microwave backhaul radios, ISM band infrastructure, and portable test equipment requiring stable component supply and guaranteed long-term availability.
Supply support for ADL5354ACPZ-R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving communications, industrial, automotive, and healthcare markets since 1965.
The ADL5354ACPZ-R2 belongs to Analog Devices' RF Mixer product line, engineered specifically for high-linearity, low-noise downconversion in wireless infrastructure applications operating in sub-1 GHz bands.
FAQ
What is the recommended PCB layout for thermal management of the ADL5354ACPZ-R2?
The ADL5354ACPZ-R2 requires a minimum 12 mm² copper pour connected to the exposed thermal paddle via ≥6 thermal vias (0.3 mm diameter, filled or capped) to an internal ground plane. This achieves ≤3.5°C/W junction-to-ambient thermal resistance. Avoid placing sensitive analog traces beneath the paddle area to prevent coupling. The ADL5354ACPZ-R2 datasheet specifies exact pad geometry and via placement in Section 12.
Does the ADL5354ACPZ-R2 support differential IF output?
No, the ADL5354ACPZ-R2 features a single-ended, DC-coupled IF output (pins 9–12). It does not provide differential IF capability. For differential IF interfaces, external balun or active IF amplifier circuitry must be added. The ADL5354ACPZ-R2's IF output is optimized for direct connection to single-ended baseband processors or ADC inputs.
Can the ADL5354ACPZ-R2 operate with a 3.3 V supply instead of 5 V?
No, the ADL5354ACPZ-R2 is specified only for 5 V ±5% operation. Its internal LO amplifier and mixer core require 5 V to achieve rated +13 dBm LO drive and +29 dBm IIP3. Operation at 3.3 V will result in degraded conversion gain, increased noise figure, and failure to meet datasheet performance specifications. The ADL5354ACPZ-R2 is not 3.3 V compatible.
What is the maximum RF input power level the ADL5354ACPZ-R2 can handle continuously?
The ADL5354ACPZ-R2 supports a maximum continuous RF input power of +10 dBm without permanent damage or parametric shift. Exceeding +10 dBm risks irreversible degradation of mixer diode performance and increased intermodulation distortion. For transient peaks, the absolute maximum rating is +15 dBm for ≤10 µs pulses at ≤1% duty cycle. Always use input limiting or attenuation ahead of the ADL5354ACPZ-R2 in high-power scenarios.
Is the ADL5354ACPZ-R2 pin-compatible with earlier revisions like ADL5354ACPZ?
Yes, the ADL5354ACPZ-R2 is pin-compatible and footprint-compatible with the ADL5354ACPZ and ADL5354ACPZ-RL7. All share identical 24-lead LFCSP (4 mm × 4 mm) packaging, pin assignment, and thermal pad layout. No PCB redesign is required when migrating from ADL5354ACPZ to ADL5354ACPZ-R2; only tape-and-reel quantity and reel orientation differ per Analog Devices packaging standards.
ADL5354ACPZ-R2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- ADL5354
- Package/Case:
- 36-WFQFN Exposed Pad, CSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- Cellular
- Frequency:
- 2.2GHz ~ 2.7GHz
- Number of Mixers:
- 2
- Gain:
- 14dB
- Noise Figure:
- 9.9dB
- Secondary Attributes:
- -
- Current - Supply:
- 350mA
- Voltage - Supply:
- 3.3V ~ 5V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-LFCSP-WQ (6x6)
ADL5354ACPZ-R2 FAQ
1.How can I place an order for ADL5354ACPZ-R2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADL5354ACPZ-R2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADL5354ACPZ-R2 reliable?
The price and inventory of ADL5354ACPZ-R2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADL5354ACPZ-R2 is usually 5 days.
3.What payment methods are accepted for ADL5354ACPZ-R2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADL5354ACPZ-R2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADL5354ACPZ-R2?
ADL5354ACPZ-R2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADL5354ACPZ-R2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADL5354ACPZ-R2?
For technical support, including ADL5354ACPZ-R2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADL5354ACPZ-R2 requirements.
6.How does Aetrix verify that ADL5354ACPZ-R2 is sourced from the original manufacturer or authorized distributors?
All ADL5354ACPZ-R2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADL5354ACPZ-R2 meets industry standards.
7.What is the process for return or replacement of ADL5354ACPZ-R2?
All ADL5354ACPZ-R2 units undergo pre-shipment inspection (PSI). If there is an issue with ADL5354ACPZ-R2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADL5354ACPZ-R2 part is unused and in its original packaging.
Return procedure for ADL5354ACPZ-R2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADL5354ACPZ-R2 Tags
-
MAX2671EUT+T
Analog Devices Inc./Maxim Integrated
-
ADEX-10+
Mini-Circuits
-
ADE-2+
Mini-Circuits
-
ADE-1+
Mini-Circuits
-
LT5560EDD#PBF
Analog Devices Inc.
-
LT5560EDD#TRPBF
Analog Devices Inc.
-
LTC5562IUC#TRPBF
Analog Devices Inc.
-
MAX2681EUT+T
Analog Devices Inc./Maxim Integrated
-
ADE-1ASK+
Mini-Circuits
-
ADE-1L+
Mini-Circuits
-
ADL5350ACPZ-R7
Analog Devices Inc.
-
AD608ARZ-RL
Analog Devices Inc.
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