Analog Devices Inc. ADL5363ACPZ-R7
- Part No.:
- ADL5363ACPZ-R7
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 20-WQFN Exposed Pad, CSP
- Datasheet:
-
ADL5363ACPZ-R7.pdf
- Description:
- IC MIXER 2.3-2.9GHZ 20LFCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ADL5363ACPZ-R7 from Analog Devices is a 2300–2900 MHz balanced passive mixer IC with integrated RF balun and dual LO switch, delivering 7.7 dB power conversion loss, 7.6 dB SSB noise figure, and +31 dBm input IP3 at 5 V supply. It supports TDD cellular base station receivers and transmit observation paths requiring high linearity and LO-to-RF isolation better than −30 dBm.
For engineers reviewing the ADL5363ACPZ-R7 datasheet, ADL5363ACPZ-R7 pinout, ADL5363ACPZ-R7 application, or ADL5363ACPZ-R7 equivalent, key selection criteria include RF frequency range (2300–2900 MHz), IF bandwidth (dc–450 MHz), LO drive sensitivity (−6 to +10 dBm), power-down capability (<200 µA), and 20-lead 5 mm × 5 mm LFCSP package with exposed thermal pad.
Technical Context
The ADL5363ACPZ-R7 integrates a doubly balanced passive MOSFET mixer core with on-die RF balun and SPDT LO switch, enabling single-ended 50 Ω RF/LO interface while maintaining >60 dB IIP2 and >−32 dBm LO-to-RF leakage. Its BiCMOS process supports simultaneous high linearity and low noise across −40°C to +85°C.
LO subsystem includes a three-stage limiting amplifier and bias-controlled current path (via external resistor), allowing dynamic adjustment of IIP3 and conversion loss trade-offs. The VGS0/VGS1 pins enable gate bias tuning for optimized performance in varying RF power conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 2300–2900 MHz: Full specified performance over entire band without retuning. |
| IF Frequency Range | dc to 450 MHz: Supports baseband and low-IF architectures with differential output. |
| Power Conversion Loss | 7.7 dB (typ, 5 V): Includes PCB and 1:1 IF transformer loss; enables predictable gain budgeting. |
| Input IP3 | +31 dBm (typ, 5 V): Enables robust operation in presence of strong in-band blockers in LTE/5G base stations. |
| SSB Noise Figure | 7.6 dB (typ, 5 V): Directly impacts receiver sensitivity in high-dynamic-range applications. |
| LO Drive Range | −6 to +10 dBm: Wide tolerance simplifies synthesizer interface and reduces need for external amplification. |
| Supply Voltage | 3.3 V to 5 V: Dual-voltage support allows optimization for power-constrained or performance-critical designs. |
Pinout & Package
ADL5363ACPZ-R7 is housed in a 5 mm × 5 mm, 20-lead LFCSP package with exposed thermal pad (EPAD) that must be soldered to ground for thermal and electrical performance. Pin 10 and Pin 20 are no-connect; EPAD is DC ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VPMX (Pin 1) | Positive supply voltage | Main 3.3–5 V supply for RF/mixer core; decoupling required near pin. |
| RFIN (Pin 2) | RF input | Single-ended 50 Ω port; requires AC coupling capacitor per datasheet recommendation. |
| RFCT (Pin 3) | RF balun center tap | AC ground reference for internal balun; must be connected to system ground via low-inductance path. |
| COMM (Pins 4,5,16) | Device common | DC ground connection points; critical for return path integrity and EMI control. |
| LOI1 / LOI2 (Pins 11,15) | LO inputs | Two independent single-ended 50 Ω LO ports; selected via LOSW logic control. |
| LOSW (Pin 9) | LO switch control | Logic-selectable SPDT switch: 0 V selects LOI1, 3 V selects LOI2; <40 ns switching time. |
| VGS0 / VGS1 (Pins 12,13) | Mixer gate bias controls | 3 V logic inputs; grounding sets nominal bias; enables fine-tuning of linearity vs. noise trade-off. |
| PWDN (Pin 17) | Power-down enable | Active-high logic input; drives quiescent current to <200 µA when pulled to ≥3.0 V (valid only ≤3.6 V supply). |
| IFOP / IFON (Pins 18,19) | Differential IF outputs | True differential 33 Ω || −0.3 pF output impedance; requires 1:1 transformer or balun for single-ended interface. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated RF balun | Enables single-ended 50 Ω RF input with <1 dB insertion loss and optimal balance across 2300–2900 MHz. |
| Dual-path LO switch | High-isolation SPDT switch supports rapid TDD frequency hopping with <40 ns settling and >60 dB isolation between LOI1/LOI2. |
| Adjustable linearity | VGS0/VGS1 pins allow real-time optimization of IIP3 and noise figure without hardware change. |
| Low-voltage power-down | PWDN pin reduces supply current to <200 µA under ≤3.6 V operation-critical for burst-mode or sleep-state power management. |
| Robust ESD protection | 1500 V HBM / 1250 V FICDM rating ensures reliability during handling and board assembly. |
Applications
| Cellular Base Station Receiver | Transmit Observation Receiver |
|---|---|
Use Scenario: Downconverting 2600 MHz LTE signals in macrocell remote radio heads with co-located high-power transmitters. IC Role / Device Role / Timing Role: High-linearity passive mixer providing RF-to-IF translation with minimal added noise and distortion. Use Value: +31 dBm IIP3 and −32 dBm LO-to-RF leakage prevent degradation from adjacent-channel interferers and transmitter leakage. | Use Scenario: Monitoring PA output spectrum in real time during active transmission using coupled RF sample path. IC Role / Device Role / Timing Role: Mixer in feedback loop capturing instantaneous PA output for digital predistortion (DPD) calibration. Use Value: Dual LO inputs (LOI1/LOI2) enable seamless switching between main and observation LOs without timing gaps or phase discontinuity. |
| Radiolink Downconverter | TDD Infrastructure Front-End |
Use Scenario: Converting 2.5 GHz point-to-point microwave link signals to 70 MHz IF for demodulation in backhaul equipment. IC Role / Device Role / Timing Role: Core downconversion element with dc–450 MHz IF bandwidth supporting wide-channel modulation schemes. Use Value: 7.7 dB conversion loss and 7.6 dB noise figure ensure sufficient SNR margin for 256-QAM demodulation over long distances. | Use Scenario: Enabling time-division duplexing in small-cell base stations where RX and TX share same antenna and frequency band. IC Role / Device Role / Timing Role: Mixer with fast-switching LO path and PWDN control synchronized to TDD frame timing. Use Value: <40 ns LO switching and <200 µA power-down current minimize inter-TDD-slot power consumption and latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADL5353ACPZ-R7 | Same 2300–2900 MHz RF range but includes integrated IF amplifier; higher conversion loss (8.5 dB) and lower IIP3 (+27 dBm). | Targeted at systems needing amplified IF output without external gain stages; less suitable for ultra-low-noise receiver front-ends. | Select ADL5353ACPZ-R7 only if IF amplification is required and 0.8 dB higher conversion loss is acceptable. |
| ADL5365ACPZ-R7 | Broader RF range (1200–2500 MHz); different balun design; slightly lower IIP3 (+29 dBm) and higher noise figure (8.1 dB). | Optimized for PCS/UMTS bands rather than 2.6 GHz LTE; not validated for 2600–2900 MHz operation. | Choose ADL5365ACPZ-R7 only for sub-2.5 GHz applications; avoid for 2.6/2.7 GHz deployments due to unverified performance. |
Compared with ADL5363ACPZ-R7, ADL5353ACPZ-R7 trades passive mixer simplicity for integrated IF gain-increasing power and noise-but ADL5365ACPZ-R7 shifts frequency coverage away from the 2.6–2.9 GHz band, making it unsuitable as a direct functional replacement.
Availability
ADL5363ACPZ-R7 is available at Aetrix Electronics and suitable for cellular infrastructure, radiolink equipment, and TDD-based small-cell deployments requiring stable component supply, full temperature range (−40°C to +85°C), and RoHS-compliant packaging.
Supply support for ADL5363ACPZ-R7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and aerospace markets with precision signal processing solutions.
The ADL5363ACPZ-R7 belongs to Analog Devices' high-linearity RF mixer product line, designed specifically for demanding wireless infrastructure applications where dynamic range, LO switching agility, and thermal stability are critical.
FAQ
What is the recommended LO drive level for ADL5363ACPZ-R7?
The ADL5363ACPZ-R7 operates optimally with 0 dBm LO drive, but its LO subsystem accepts −6 dBm to +10 dBm input power while maintaining specified conversion loss and IIP3. Performance remains functional below −6 dBm, though conversion loss increases by ~0.5 dB per 2 dB reduction in LO power.
Can ADL5363ACPZ-R7 operate from a 3.3 V supply?
Yes, ADL5363ACPZ-R7 supports 3.3 V operation with reduced quiescent current (60 mA vs. 100 mA at 5 V) and slightly degraded linearity (IIP3 = +26 dBm) and noise figure (6.8 dB). Power-down mode (<200 µA) is only enabled when VS ≤ 3.6 V, making 3.3 V ideal for low-power TDD burst operation.
How does the ADL5363ACPZ-R7 achieve high LO-to-RF isolation?
ADL5363ACPZ-R7 achieves >−30 dBm LO-to-RF isolation through its doubly balanced passive mixer topology and integrated RF balun, which suppresses common-mode LO feedthrough. Measured isolation is typically −32 dBm at 2535 MHz RF and 2738 MHz LO, verified across temperature and supply voltage.
What is the function of the VGS0 and VGS1 pins on ADL5363ACPZ-R7?
VGS0 and VGS1 are mixer gate bias control inputs that set the operating point of the passive FET switches. Grounding both pins provides nominal performance; applying logic levels enables fine-tuning of IIP3 and noise figure trade-offs-e.g., VGS0=3 V/VGS1=0 V improves IIP3 by ~1.5 dB at slight NF penalty.
Is an external balun required for the IF output of ADL5363ACPZ-R7?
No external balun is required for basic operation-the ADL5363ACPZ-R7 provides fully differential IF outputs (IFOP/IFON) with 33 Ω || −0.3 pF impedance. However, a 1:1 IF transformer is recommended in the evaluation board design to convert to single-ended for ADC interfacing and improve common-mode rejection.
ADL5363ACPZ-R7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 20-WQFN Exposed Pad, CSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- Cellular
- Frequency:
- 2.3GHz ~ 2.9GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 7.6dB
- Secondary Attributes:
- -
- Current - Supply:
- 100mA
- Voltage - Supply:
- 3.3V ~ 5V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-LFCSP-WQ (5x5)
ADL5363ACPZ-R7 FAQ
1.How can I place an order for ADL5363ACPZ-R7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADL5363ACPZ-R7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADL5363ACPZ-R7 reliable?
The price and inventory of ADL5363ACPZ-R7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADL5363ACPZ-R7 is usually 5 days.
3.What payment methods are accepted for ADL5363ACPZ-R7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADL5363ACPZ-R7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADL5363ACPZ-R7?
ADL5363ACPZ-R7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADL5363ACPZ-R7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADL5363ACPZ-R7?
For technical support, including ADL5363ACPZ-R7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADL5363ACPZ-R7 requirements.
6.How does Aetrix verify that ADL5363ACPZ-R7 is sourced from the original manufacturer or authorized distributors?
All ADL5363ACPZ-R7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADL5363ACPZ-R7 meets industry standards.
7.What is the process for return or replacement of ADL5363ACPZ-R7?
All ADL5363ACPZ-R7 units undergo pre-shipment inspection (PSI). If there is an issue with ADL5363ACPZ-R7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADL5363ACPZ-R7 part is unused and in its original packaging.
Return procedure for ADL5363ACPZ-R7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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