Analog Devices Inc. ADP1196ACBZ-R7
- Part No.:
- ADP1196ACBZ-R7
- Manufacturer:
- Analog Devices Inc.
- Package:
- 6-WFBGA, WLCSP
- Datasheet:
-
ADP1196ACBZ-R7.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:1 6WLCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ADP1196ACBZ-R7 from Analog Devices is a logic-controlled, dual-mode (high-side or low-side) N-channel load switch IC designed for 0 V to 5.5 V input operation with 3 A continuous current capability at 70°C, 10 mΩ typical RDS(ON), and integrated overtemperature protection. It serves as a precision power-path controller in compact battery-powered systems requiring controlled inrush current and ultralow quiescent power.
For engineers reviewing the ADP1196ACBZ-R7 datasheet, ADP1196ACBZ-R7 pinout, ADP1196ACBZ-R7 application, or ADP1196ACBZ-R7 equivalent, key selection criteria include its 1.0 mm × 1.5 mm WLCSP package, bias-supply-flexible enable interface (VB_EN), constant RDS(ON) across voltage range, thermal shutdown hysteresis, and 26 µA ground current at VIN ≤ 3.4 V.
Technical Context
The ADP1196ACBZ-R7 integrates an internal charge pump powered by the higher of VIN or VB_EN, enabling robust gate drive for its N-channel MOSFET regardless of input voltage level. Its on-resistance remains stable across 0.1 V to 5.5 V VIN and 1.83 V to 5.5 V VB_EN, eliminating voltage-dependent conduction loss.
It features programmable turn-on delay (~2 ms), slew-rate-controlled output rise time, and dual-stage protection: current limiting at ±4 A and thermal shutdown activation at 125°C with 15°C hysteresis. The VB_EN pin includes built-in hysteresis and VIN-referenced thresholds to reject noise during enable transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 0 V to 5.5 V - supports direct connection to Li-ion, USB, or logic rails without external level shifting. |
| RDS(ON) | 10 mΩ typ. - minimizes conduction loss and self-heating at 3 A, enabling high-efficiency power gating. |
| Continuous Current | 3 A at TA ≤ 70°C - sustains full-rated load in thermally constrained portable designs. |
| Quiescent Ground Current | 26 µA at VIN ≤ 3.4 V - extends battery life in always-on subsystems such as sensor wake-up circuits. |
| Shutdown Current | <3.5 µA - ensures negligible leakage when disabled, critical for zero-power standby modes. |
| Thermal Shutdown Threshold | 125°C with 15°C hysteresis - provides reliable fault recovery without latch-up during transient overloads. |
| Enable Input Threshold | VIH = 1.2 V (VIN ≥ 1.8 V); VIL = 0.4 V - compatible with 1.8 V CMOS logic without pull-up resistors. |
Pinout & Package
ADP1196ACBZ-R7 uses a 1.0 mm × 1.5 mm, 6-ball, 0.5 mm pitch Wafer Level Chip Scale Package (WLCSP, CB-6-2), with ball A1 marked for orientation. Total PCB footprint is <1.5 mm² and height is 0.60 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (A1, B1) | Main power input | Accepts 0–5.5 V supply; powers internal charge pump when higher than VB_EN. |
| VOUT (A2, B2) | Switched output | Delivers regulated load current; connects to downstream circuitry or TEC load. |
| VB_EN (C1) | Enable/bias control input | Logic-level input (1.2 V/0.4 V thresholds); drives internal gate driver and selects charge pump source. |
| GND (C2) | Power and signal reference | Common return path for VIN, VOUT, and internal circuitry; must be low-impedance for thermal performance. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-mode topology support | Configurable as high-side or low-side switch via external layout - eliminates need for separate part numbers for each configuration. |
| Constant RDS(ON) | 10 mΩ independent of VIN or VB_EN voltage - ensures predictable power loss and thermal behavior across full operating range. |
| Controlled turn-on timing | ~2 ms delay + slew-limited rise - suppresses inrush current into large capacitive loads (e.g., 100 µF) without external RC networks. |
| Integrated thermal protection | 125°C trip with 15°C hysteresis - autonomously cycles output during sustained overload, preventing permanent damage without system intervention. |
| Ultralow shutdown leakage | <3.5 µA - enables true zero-power disable state, essential for energy harvesting and long-life coin-cell applications. |
Applications
| Thermoelectric Cooler (TEC) Control | Fine-Line Core Voltage Sequencing |
|---|---|
Use Scenario: Bidirectional TEC driver where polarity reversal enables heating and cooling modes in medical diagnostic instruments. IC Role / Device Role / Timing Role: High-side or low-side load switch controlling TEC current direction and magnitude; provides precise power enable/disable with thermal foldback. Use Value: Enables compact, single-chip TEC polarity control without discrete H-bridge components, leveraging constant RDS(ON) for symmetric heating/cooling efficiency. |
Use Scenario: Inrush current limiting during FPGA or ASIC core rail power-up in space-constrained test equipment. IC Role / Device Role / Timing Role: Low-side load switch inserted between PMIC output and core rail capacitor bank; manages dV/dt during startup. Use Value: Prevents voltage droop and system reset by limiting peak inrush to <1 A while maintaining 3 A steady-state delivery after soft-start. |
| Portable Medical Sensor Hub | Industrial IoT Edge Node |
Use Scenario: Power gating for disposable biosensor interface modules in handheld analyzers to extend single-charge battery life. IC Role / Device Role / Timing Role: Always-on load switch enabling microamp-level sleep mode; activated only during measurement cycles. Use Value: Reduces average system current by >95% during idle periods using 26 µA quiescent current and sub-µA shutdown state. |
Use Scenario: Selective power delivery to wireless transceiver, sensor array, and MCU subsystems in battery-operated condition monitoring nodes. IC Role / Device Role / Timing Role: High-side switch isolating RF section during low-power sensing intervals; coordinated via microcontroller GPIO. Use Value: Eliminates cross-talk and standby leakage paths while supporting fast (<5 ms) wake-up response via logic-compatible VB_EN interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCK107AG,314 (Toshiba) | 12 mΩ RDS(ON), 2 A rating, 1.2 V logic-compatible EN, no internal charge pump - requires external gate drive for low-VIN operation. | Limited to VIN ≥ 1.8 V; unsuitable for sub-1.8 V TEC or ultra-low-voltage bias scenarios. | Choose for cost-sensitive 2 A applications where VIN stays above 1.8 V and board area allows larger 1.6 × 1.6 mm DFN. |
| MCP1643-I/MC (Microchip) | 15 mΩ RDS(ON), 2.5 A rating, integrated soft-start but no thermal shutdown hysteresis - relies on external thermal monitoring. | Lacks autonomous thermal cycling; requires host MCU intervention for fault recovery. | Prefer when soft-start timing must be externally adjustable and thermal management is handled at system level. |
Compared with TCK107AG,314 and MCP1643-I/MC, ADP1196ACBZ-R7 uniquely delivers 3 A capability with 10 mΩ RDS(ON) down to 0.1 V VIN, autonomous thermal foldback with hysteresis, and true 1.83 V logic compatibility - making it optimal for miniaturized, self-protecting power gates in portable medical and industrial edge devices.
Availability
ADP1196ACBZ-R7 is available at Aetrix Electronics and suitable for portable medical instrumentation, thermoelectric cooler control, and fine-line core voltage sequencing requiring stable component supply, RoHS-compliant packaging, and long-term lifecycle assurance.
Supply support for ADP1196ACBZ-R7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, industrial automation, and healthcare markets.
The ADP1196ACBZ-R7 belongs to Analog Devices' precision load switch product line, engineered for space-constrained, low-power systems demanding reliable power-path control with minimal external components and autonomous fault protection.
FAQ
What is the maximum continuous current rating of the ADP1196ACBZ-R7 under standard operating conditions?
The ADP1196ACBZ-R7 supports 3 A continuous operating current at ambient temperatures up to 70°C. At 85°C, its derated current drops to ±2.22 A due to thermal limitations. This rating assumes proper PCB thermal relief and operation within the specified 0 V to 5.5 V input voltage range. The ADP1196ACBZ-R7 also includes ±4 A current limiting to protect against short-circuit faults.
Can the ADP1196ACBZ-R7 operate with input voltages below 1.8 V, and how does it maintain functionality?
Yes, the ADP1196ACBZ-R7 operates with VIN as low as 0 V and supports full 3 A switching down to VIN = 0.1 V. It achieves this using an internal charge pump powered by the higher of VIN or VB_EN, ensuring sufficient gate drive for the N-channel MOSFET even at ultra-low input voltages. This architecture maintains constant 10 mΩ RDS(ON) across the entire 0–5.5 V range, unlike conventional load switches that degrade at low VIN.
How does the thermal protection mechanism work in the ADP1196ACBZ-R7, and what happens during sustained overload?
The ADP1196ACBZ-R7 activates thermal shutdown when junction temperature exceeds 125°C, turning off the output until temperature falls below ~110°C (15°C hysteresis). During a persistent short, it enters autonomous thermal cycling: conducting 4 A until shutdown, cooling to 110°C, re-enabling, and repeating. This prevents catastrophic failure while signaling a fault condition. The ADP1196ACBZ-R7 does not latch off permanently, enabling automatic recovery once the fault is removed.
Is the ADP1196ACBZ-R7 compatible with 1.8 V logic systems, and what are the enable threshold specifications?
Yes, the ADP1196ACBZ-R7 is fully compatible with 1.8 V logic. Its VB_EN pin has VIN-referenced thresholds: VIH = 1.2 V and VIL = 0.4 V when VIN ≥ 1.8 V, eliminating the need for level shifters or pull-up resistors. The pin also includes built-in hysteresis to reject noise, and a 4 MΩ internal pull-down resistor ensures defined low-state behavior during power-up or floating conditions.
What package type and dimensions does the ADP1196ACBZ-R7 use, and what are its PCB layout implications?
The ADP1196ACBZ-R7 uses a 1.0 mm × 1.5 mm, 6-ball, 0.5 mm pitch Wafer Level Chip Scale Package (WLCSP, CB-6-2), with total footprint <1.5 mm² and height 0.60 mm. Ball A1 is marked for orientation. Its ultrasmall size demands careful stencil design and reflow profiling; thermal vias under the GND ball (C2) are recommended to manage 3 A power dissipation. No external capacitors are required, but 1 µF ceramic input/output caps improve transient response.
ADP1196ACBZ-R7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Package/Case:
- 6-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side or Low Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 1.83V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 3A
- Rds On (Typ):
- 10mOhm
- Input Type:
- Non-Inverting
- Features:
- Slew Rate Controlled
- Fault Protection:
- Current Limiting (Fixed), Over Temperature
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WLCSP (1.45x0.95)
ADP1196ACBZ-R7 FAQ
1.How can I place an order for ADP1196ACBZ-R7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADP1196ACBZ-R7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADP1196ACBZ-R7 reliable?
The price and inventory of ADP1196ACBZ-R7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADP1196ACBZ-R7 is usually 5 days.
3.What payment methods are accepted for ADP1196ACBZ-R7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADP1196ACBZ-R7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADP1196ACBZ-R7?
ADP1196ACBZ-R7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADP1196ACBZ-R7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADP1196ACBZ-R7?
For technical support, including ADP1196ACBZ-R7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADP1196ACBZ-R7 requirements.
6.How does Aetrix verify that ADP1196ACBZ-R7 is sourced from the original manufacturer or authorized distributors?
All ADP1196ACBZ-R7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADP1196ACBZ-R7 meets industry standards.
7.What is the process for return or replacement of ADP1196ACBZ-R7?
All ADP1196ACBZ-R7 units undergo pre-shipment inspection (PSI). If there is an issue with ADP1196ACBZ-R7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADP1196ACBZ-R7 part is unused and in its original packaging.
Return procedure for ADP1196ACBZ-R7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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