Texas Instruments ADS8319IBDRCR

Overview

ADS8319IBDRCR from Texas Instruments is a 16-bit, 500-kSPS successive-approximation register (SAR) analog-to-digital converter with unipolar single-ended input (0 V to VREF), SPI-compatible serial interface, and zero-latency operation. It operates from 2.25–5.5-V external reference and delivers 93.6-dB SNR at 10 kHz - used in portable instrumentation and battery-powered data acquisition systems.

For engineers reviewing the ADS8319IBDRCR datasheet, ADS8319IBDRCR pinout, ADS8319IBDRCR application, or ADS8319IBDRCR equivalent, key selection criteria include guaranteed ±1.5-LSB INL, 0.25 µW power-down dissipation, 10-pin VSON package (3.0 mm × 3.0 mm), and daisy-chain-capable SPI interface supporting synchronized multi-device sampling.

Technical Context

The ADS8319IBDRCR implements a capacitor-based SAR architecture with integrated sample-and-hold, enabling true zero-latency conversion at full 500-kSPS throughput. Its internal control logic manages CONVST-triggered acquisition, conversion timing, and SDO data alignment synchronized to SCLK falling edges.

It supports two serial interface modes: 3-wire (CONVST as CS) and 4-wire (dedicated SDI/SDO/SCLK/CONVST), with mode selection determined by SDI level at conversion start. The Busy Indicator output simplifies host synchronization without requiring status polling.

Key Specifications

Pinout & Package

ADS8319IBDRCR is packaged in a 10-pin VSON (DRC) with exposed thermal pad, measuring 3.0 mm × 3.0 mm. This RoHS-compliant, moisture-sensitive package supports reflow per J-STD-020 MSL2 (260°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit SAR ADC applications.

Compared with ADS8320IBDRCR and AD7682BRMZ-RL7, the ADS8319IBDRCR uniquely balances 500-kSPS throughput, daisy-chain capability, and sub-µW power-down - making it optimal for synchronized multi-channel, battery-aware measurement systems.

Availability

ADS8319IBDRCR is available at Aetrix Electronics and suitable for battery-powered equipment, industrial process monitoring, portable medical diagnostics, and optical network test equipment requiring stable component supply and long-term production continuity.

Supply support for ADS8319IBDRCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision data converters and industrial-grade ICs.

The ADS8319IBDRCR belongs to TI's precision SAR ADC product line, designed specifically for high-resolution, low-power, and space-constrained applications in portable instrumentation, medical devices, and industrial automation.

FAQ

What is the maximum sampling rate supported by the ADS8319IBDRCR?

The ADS8319IBDRCR supports a maximum sampling rate of 500 kSPS. This is achieved with a minimum conversion cycle time of 2000 ns and requires +VBD ≥4.5 V for full-speed SCLK operation (20 ns period). At lower +VBD (2.375–4.5 V), the maximum SCLK period increases to 30 ns, maintaining the same 500-kSPS throughput due to fixed internal timing architecture. The ADS8319IBDRCR guarantees zero latency at this rate.

Does the ADS8319IBDRCR require an external reference voltage?

Yes, the ADS8319IBDRCR requires an external reference voltage applied to the REFIN pin. It accepts 2.25 V to +VA + 0.1 V (up to 5.6 V), supporting common references like 2.5 V, 4.096 V, or 5 V. The device does not include an internal reference; reference stability directly impacts gain error and overall measurement accuracy. A 0.1-µF ceramic bypass capacitor and 10-µF storage capacitor are mandatory at REFIN for optimal performance.

What package type is used for the ADS8319IBDRCR?

The ADS8319IBDRCR uses a 10-pin VSON package (DRC variant), measuring 3.0 mm × 3.0 mm with an exposed thermal pad. This package is distinct from the VSSOP (DGS) variant and is optimized for compact PCB layouts and improved thermal performance (RθJA = 87.2°C/W). The DRC package is RoHS-compliant and rated MSL2 per J-STD-020 for surface-mount reflow assembly.

How does the daisy-chain SPI interface work on the ADS8319IBDRCR?

The ADS8319IBDRCR supports daisy-chain configuration via its SPI interface: SDO of one device connects to SDI of the next, with shared SCLK and CONVST lines. A single CONVST pulse initiates simultaneous sampling across all chained devices, and results shift out sequentially on SDO. Mode selection is set by SDI logic level at conversion start. This eliminates need for individual CS lines and enables deterministic multi-channel synchronization without FPGA or complex timing control.

What is the power consumption of the ADS8319IBDRCR in power-down mode?

The ADS8319IBDRCR consumes 0.25 µW typical power in power-down mode, corresponding to 50 nA device current at +VA = 5 V. This state is automatically entered after each conversion completes and persists during acquisition phase unless disabled. The ultra-low power-down current significantly extends battery life in intermittent-sampling applications such as wireless sensor nodes and portable data loggers where the ADC spends >99% of time idle.