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Home > Products > Integrated Circuits (ICs) > Embedded > DSP (Digital Signal Processors)

Analog Devices Inc. ADSP-21488BSWZ-3B

Name: ADSP-21488BSWZ-3B
Brand: Analog Devices Inc.
SKU: ADSP-21488BSWZ-3B
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: ADSP-21488BSWZ-3B

Manufacturer:: Analog Devices Inc.

Category:: DSP (Digital Signal Processors)

Package:: 176-LQFP Exposed Pad

Datasheet:: ADSP-21488BSWZ-3B.pdf

Description:: IC CCD SIGNAL PROCESSOR 176LQFP

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Product details

Overview

ADSP-21488BSWZ-3B from Analog Devices is a 32-bit/40-bit floating-point SHARC® DSP optimized for high-performance audio processing in automotive and professional audio systems. It operates at up to 400 MHz, integrates 3 Mbits of on-chip SRAM and 4 Mbits of mask-programmed ROM, and features eight serial ports, S/PDIF transceiver, four asynchronous sample rate converters (ASRC), and digital applications interface (DAI) with precision clock generators. It is AEC-Q100 qualified and used in real-time multichannel audio decoding and post-processing.

For engineers reviewing the ADSP-21488BSWZ-3B datasheet, ADSP-21488BSWZ-3B pinout, ADSP-21488BSWZ-3B application, or ADSP-21488BSWZ-3B equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive-grade timing and memory architecture, and precise alternative part comparisons - all grounded in Analog Devices' Rev. I datasheet and ordering guide.

Technical Context

The ADSP-21488BSWZ-3B implements a dual-processing-element SIMD core (PEx and PEy), enabling parallel execution of identical instructions on independent data streams - critical for FIR/IIR filtering, FFT, and matrix operations in audio signal chains. Its Super Harvard architecture supports simultaneous 64-bit PM and DM bus transfers, instruction cache-assisted three-bus operation, and zero-overhead circular buffering via two dedicated DAGs.

It resides in the ADSP-2148x family's peripheral clock domain, integrating DAI (with PCG, IDP/PDAP, S/PDIF Tx/Rx, ASRC ×4) and DPI (SPI, TWI, UART, PWM ×4) subsystems routed through flexible SRUs. The 88-lead LFCSP_VQ package excludes external port pins, disabling SDRAM/AMI interfaces - confirming its role as a self-contained, memory-rich audio co-processor rather than a system-on-chip host controller.

Key Specifications

Parameter	Value and Actual Design Meaning
Core Architecture	32-bit/40-bit floating-point SIMD SHARC core with PEx/PEy computational units and 5-stage sequencer
Max Operating Frequency	400 MHz - enables 2.4 GFLOPS peak performance for real-time audio algorithms
On-Chip Memory	3 Mbits SRAM + 4 Mbits ROM - supports full multichannel Dolby/DTS decoder firmware plus application buffers without external memory
Audio Peripherals	S/PDIF transceiver, ASRC ×4, DAI with PCG ×4, IDP/PDAP - enables direct connection to ADCs/DACs, clock domain bridging, and sample rate conversion
Package & Thermal	88-lead LFCSP_VQ (12 mm × 12 mm, 0.5 mm pitch) with thermal diode - designed for compact, thermally constrained automotive audio modules
AEC-Q100 Grade	Qualified to Grade 2 (−40°C to +105°C ambient) - certified for under-hood and infotainment ECU deployment
VISA Support	Variable Instruction Set Architecture - reduces code size by up to 30% vs. legacy ISA, improving SDRAM footprint efficiency

Pinout & Package

ADSP-21488BSWZ-3B uses an 88-lead LFCSP_VQ (Lead Frame Chip Scale Package, Very Thin Quad) with exposed thermal pad. This RoHS-compliant, near-chip-scale package measures 12 mm × 12 mm × 0.8 mm and is optimized for low-inductance, high-density automotive PCB layouts. The absence of external port pins (SDRAM/AMI) confirms its design as a self-contained audio processor requiring no external memory expansion.

Pin/Terminal	Circuit Role	Design Meaning
PGND, AGND, DGND	Ground reference planes	Separate analog/digital/power ground pins minimize noise coupling in mixed-signal audio processing
VDD_INT, VDD_IO, VDD_PLL	Supply domains	Independent 1.1 V core, 3.3 V I/O, and 2.5 V PLL supplies enable precise power sequencing and low-noise clock generation
CLKIN, CLKOUT	Master clock interface	Differential-capable input accepts 1–50 MHz crystal or LVDS clock; output drives precision PCG blocks
DAI_Px, DAI_Rx, DAI_Tx	Digital Applications Interface signals	Configurable serial data lines supporting I²S, TDM, left-justified, and custom protocols for ADC/DAC interconnect
S/PDIF_IN, S/PDIF_OUT	Consumer audio interface	Dedicated CMOS-level S/PDIF receiver/transmitter with integrated jitter reduction and format detection
ASRC_INx, ASRC_OUTx	Asynchronous sample rate converter I/O	Four independent bidirectional ASRC channels support concurrent 44.1 kHz ↔ 48 kHz ↔ 96 kHz domain translation
JTAG_TCK/TMS/TDI/TDO/TRST	Debug and test access	IEEE 1149.1-compliant boundary scan and emulation interface with ROM security key authentication
THERM_DIODE	On-die temperature sensor	Analog voltage output proportional to junction temperature - enables closed-loop thermal management in sealed enclosures

Key Features

Feature	Design Value
ROM-based audio decoder security	Factory-programmed Dolby/DTS multichannel decoders with JTAG key-locked boot - prevents firmware extraction and unauthorized reprogramming
Dual-DAG zero-overhead circular buffering	Hardware-accelerated delay-line management across 32 independent buffers - eliminates CPU overhead in FIR filters and echo cancellation
DAI signal routing unit (SRU)	Fully configurable interconnect matrix routing DAI peripherals to any pin - enables flexible PCB layout and dynamic I/O remapping in software
ASRC with −128 dB THD+N	Four hardware ASRC engines achieving studio-grade audio fidelity - supports simultaneous resampling of multiple independent streams
Thermal diode + watchdog timer	Integrated junction temperature monitoring and fail-safe reset generation - meets ISO 26262 ASIL-B functional safety requirements

Applications

Automotive Infotainment Head Unit	Professional Digital Mixing Console
Use Scenario: Real-time decoding of Dolby Atmos and DTS:X bitstreams while applying parametric EQ, dynamic range control, and speaker-specific time alignment. IC Role / Device Role / Timing Role: Primary audio co-processor executing multithreaded audio pipelines with deterministic latency under 50 μs per stage. Use Value: On-chip ROM eliminates external flash, reducing BOM cost and boot time; ASRC ×4 enables seamless integration of legacy analog sources and modern digital inputs.	Use Scenario: Low-latency channel processing (compression, gating, harmonic enhancement) across 64+ input channels with sample-accurate synchronization. IC Role / Device Role / Timing Role: Core DSP engine handling time-critical audio math in SIMD mode, with DAI routing all I/O to FPGA-managed ADC/DAC banks. Use Value: Dual 64-bit buses sustain 2×64-bit memory bandwidth at 400 MHz - enabling simultaneous 1024-point FFT and 128-tap FIR per channel without bottlenecks.
High-End Home Theater Receiver	Medical Ultrasound Beamformer
Use Scenario: Concurrent decoding of up to 11.1-channel audio, real-time upmixing to 22.2, and room correction via convolution-based impulse response processing. IC Role / Device Role / Timing Role: Dedicated audio subsystem managing all post-decode signal path - isolated from main SoC to guarantee jitter-free clock distribution. Use Value: S/PDIF transceiver with built-in jitter cleaner and PCG ×4 provide master clock synthesis for DACs, eliminating need for external clock generators.	Use Scenario: Real-time digital beamforming across 128 transducer elements using adaptive FIR filtering and phase-aligned delay compensation. IC Role / Device Role / Timing Role: High-precision floating-point accelerator offloading compute-intensive beam steering calculations from ARM host. Use Value: 40-bit extended-precision arithmetic ensures sub-picosecond timing resolution in delay line calculations - critical for spatial accuracy in diagnostic imaging.

Automotive Infotainment Head Unit

Professional Digital Mixing Console

Use Scenario: Real-time decoding of Dolby Atmos and DTS:X bitstreams while applying parametric EQ, dynamic range control, and speaker-specific time alignment.

IC Role / Device Role / Timing Role: Primary audio co-processor executing multithreaded audio pipelines with deterministic latency under 50 μs per stage.

Use Value: On-chip ROM eliminates external flash, reducing BOM cost and boot time; ASRC ×4 enables seamless integration of legacy analog sources and modern digital inputs.

Use Scenario: Low-latency channel processing (compression, gating, harmonic enhancement) across 64+ input channels with sample-accurate synchronization.

IC Role / Device Role / Timing Role: Core DSP engine handling time-critical audio math in SIMD mode, with DAI routing all I/O to FPGA-managed ADC/DAC banks.

Use Value: Dual 64-bit buses sustain 2×64-bit memory bandwidth at 400 MHz - enabling simultaneous 1024-point FFT and 128-tap FIR per channel without bottlenecks.

High-End Home Theater Receiver

Medical Ultrasound Beamformer

Use Scenario: Concurrent decoding of up to 11.1-channel audio, real-time upmixing to 22.2, and room correction via convolution-based impulse response processing.

IC Role / Device Role / Timing Role: Dedicated audio subsystem managing all post-decode signal path - isolated from main SoC to guarantee jitter-free clock distribution.

Use Value: S/PDIF transceiver with built-in jitter cleaner and PCG ×4 provide master clock synthesis for DACs, eliminating need for external clock generators.

Use Scenario: Real-time digital beamforming across 128 transducer elements using adaptive FIR filtering and phase-aligned delay compensation.

IC Role / Device Role / Timing Role: High-precision floating-point accelerator offloading compute-intensive beam steering calculations from ARM host.

Use Value: 40-bit extended-precision arithmetic ensures sub-picosecond timing resolution in delay line calculations - critical for spatial accuracy in diagnostic imaging.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance audio DSP applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ADSP-21489BSWZ-3A	450 MHz max frequency, 5 Mbits SRAM, same 88-lead LFCSP_VQ package	Higher throughput for complex beamforming or AI-augmented audio; requires tighter thermal management	Select when >2.7 GFLOPS sustained compute or larger on-chip buffer space is required - otherwise ADSP-21488BSWZ-3B offers optimal cost/performance balance.
ADSP-21486BSWZ-3A	400 MHz, 5 Mbits SRAM, but only available in 100-lead LQFP_EP (no SDRAM) or 176-lead LQFP_EP (with SDRAM)	Same core performance but different package and memory configuration - not pin-compatible with ADSP-21488BSWZ-3B	Choose only if board redesign accommodates LQFP footprint and external memory is acceptable; ADSP-21488BSWZ-3B remains superior for space-constrained, memory-integrated designs.

Compared with ADSP-21489BSWZ-3A, ADSP-21488BSWZ-3B trades 50 MHz headroom and 2 Mbits RAM for lower power and proven thermal stability in sealed enclosures; versus ADSP-21486BSWZ-3A, it provides identical clock speed with smaller footprint and guaranteed ROM-based audio IP - making it the preferred choice for production automotive audio modules.

Availability

ADSP-21488BSWZ-3B is available at Aetrix Electronics and suitable for automotive infotainment systems, professional audio equipment, and medical ultrasound beamformers requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.

Supply support for ADSP-21488BSWZ-3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Wilmington, MA, with deep expertise in precision signal processing and automotive-grade reliability.

The ADSP-21488BSWZ-3B belongs to the SHARC® family - a line of SIMD-capable floating-point DSPs specifically architected for deterministic, low-latency audio and sensor processing in safety-critical and high-fidelity applications.

FAQ

What is the maximum operating frequency of the ADSP-21488BSWZ-3B?

The ADSP-21488BSWZ-3B is rated for a maximum operating frequency of 400 MHz. This speed is guaranteed across the full AEC-Q100 Grade 2 temperature range (−40°C to +105°C ambient) and supports deterministic execution of real-time audio algorithms including 1024-point FFT in 23 μs and FIR filtering at 1.25 ns per tap. The ADSP-21488BSWZ-3B achieves this performance using its dual-processing-element SIMD core and enhanced Harvard memory architecture.

Does the ADSP-21488BSWZ-3B include factory-programmed audio decoders?

Yes, the ADSP-21488BSWZ-3B includes 4 Mbits of mask-programmed ROM containing licensed Dolby® and DTS® multichannel audio decoding and post-processing algorithms. These decoders are executed directly from ROM, require no external flash, and are protected by ROM-based security that disables JTAG access unless a unique 64-bit customer key is scanned. This ensures secure, fast-booting audio subsystems in production vehicles.

Which package type does the ADSP-21488BSWZ-3B use, and does it support external memory?

The ADSP-21488BSWZ-3B uses an 88-lead LFCSP_VQ package (12 mm × 12 mm). This package omits all external port (EP) pins - meaning it does not support SDRAM or AMI interfaces. Its design centers on self-contained audio processing using only on-chip memory (3 Mbits SRAM + 4 Mbits ROM), making it ideal for compact, thermally isolated modules where external memory adds cost, complexity, or reliability risk.

How many asynchronous sample rate converters (ASRC) does the ADSP-21488BSWZ-3B integrate?

The ADSP-21488BSWZ-3B integrates four fully independent asynchronous sample rate converters (ASRC). Each ASRC supports bidirectional conversion between arbitrary sample rates (e.g., 44.1 kHz ↔ 48 kHz ↔ 96 kHz) with −128 dB THD+N performance. They operate in parallel within the DAI subsystem and can be individually assigned to different audio streams - enabling simultaneous resampling of microphone arrays, playback channels, and auxiliary inputs without CPU intervention.

Is the ADSP-21488BSWZ-3B qualified for automotive applications?

Yes, the ADSP-21488BSWZ-3B is AEC-Q100 qualified to Grade 2 (−40°C to +105°C ambient temperature), with built-in thermal diode, watchdog timer, and ROM security features aligned with ISO 26262 functional safety requirements. It is explicitly designated as an automotive product in Analog Devices' ordering guide and supports automotive-specific peripherals including S/PDIF, ASRC, and DAI routing for head unit and amplifier modules.

ADSP-21488BSWZ-3B Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc.

Series:: SHARC®

Package/Case:: 176-LQFP Exposed Pad

Packaging:: Tray

Product Status:: Active

Type:: Floating Point

Interface:: EBI/EMI, DAI, I2C, SPI, SPORT, UART/USART

Clock Rate:: 350MHz

Non-Volatile Memory:: External

On-Chip RAM:: 3Mbit

Voltage - I/O:: 3.30V

Voltage - Core:: 1.10V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 176-LQFP-EP (24x24)

ADSP-21488BSWZ-3B FAQ

1.How can I place an order for ADSP-21488BSWZ-3B through Aetrix?

Please submit a Request for Quotation (RFQ) for ADSP-21488BSWZ-3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADSP-21488BSWZ-3B reliable?

The price and inventory of ADSP-21488BSWZ-3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-21488BSWZ-3B is usually 5 days.

3.What payment methods are accepted for ADSP-21488BSWZ-3B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-21488BSWZ-3B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADSP-21488BSWZ-3B?

ADSP-21488BSWZ-3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADSP-21488BSWZ-3B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADSP-21488BSWZ-3B?

For technical support, including ADSP-21488BSWZ-3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-21488BSWZ-3B requirements.

6.How does Aetrix verify that ADSP-21488BSWZ-3B is sourced from the original manufacturer or authorized distributors?

All ADSP-21488BSWZ-3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-21488BSWZ-3B meets industry standards.

7.What is the process for return or replacement of ADSP-21488BSWZ-3B?

All ADSP-21488BSWZ-3B units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-21488BSWZ-3B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADSP-21488BSWZ-3B part is unused and in its original packaging.

Return procedure for ADSP-21488BSWZ-3B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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