Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > DSP (Digital Signal Processors)

Analog Devices Inc. ADSP-21489BSWZ-3B

Name: ADSP-21489BSWZ-3B
Brand: Analog Devices Inc.
SKU: ADSP-21489BSWZ-3B
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: ADSP-21489BSWZ-3B

Manufacturer:: Analog Devices Inc.

Category:: DSP (Digital Signal Processors)

Package:: 176-LQFP Exposed Pad

Datasheet:: ADSP-21489BSWZ-3B.pdf

Description:: IC CCD SIGNAL PROCESSOR 176LQFP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,885

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

ADSP-21489BSWZ-3B from Analog Devices is a 32-bit/40-bit floating-point SHARC® DSP optimized for high-performance audio processing, operating at up to 450 MHz with 5 Mbits of on-chip SRAM and 4 Mbits of mask-programmed ROM. It integrates eight serial ports (SPORTs), S/PDIF transceiver, four asynchronous sample rate converters (ASRCs), digital applications interface (DAI), and precision clock generators (PCGs). It serves as the real-time audio signal processor in professional mixing consoles and broadcast audio systems.

For engineers reviewing the ADSP-21489BSWZ-3B datasheet, ADSP-21489BSWZ-3B pinout, ADSP-21489BSWZ-3B application, or ADSP-21489BSWZ-3B equivalent, key selection criteria include SIMD computational throughput (2.7 GFLOPS @ 450 MHz), on-chip memory partitioning (four independent SRAM blocks), DAI routing flexibility, thermal diode integration, and AEC-Q100 qualification for automotive infotainment use cases.

Technical Context

The ADSP-21489BSWZ-3B implements a dual-processing-element (PEx/PEy) SIMD core with parallel ALU/multiplier/shifter units supporting IEEE 32-bit single-precision and 40-bit extended-precision floating-point arithmetic. Its enhanced Harvard architecture enables simultaneous 48-bit instruction fetch and four 32-bit operand transfers per cycle via PM/DM buses and instruction cache.

Peripherals are split across two clock domains: the core domain hosts JTAG, timer, and memory interfaces, while the I/O processor domain manages DAI, DPI, SPORTs, S/PDIF, ASRCs, PWM, SPI, TWI, UART, and external port controllers. The DAI includes four PCGs, IDP/PDAP, and flexible signal routing (SRU), enabling deterministic low-latency audio interconnects without external glue logic.

Key Specifications

Parameter	Value and Actual Design Meaning
Core Architecture	Dual 32-bit/40-bit floating-point SIMD processing elements (PEx/PEy) with 5-stage sequencer and instruction cache
Max Operating Frequency	450 MHz - delivers 2.7 GFLOPS peak performance for real-time FIR/IIR/FFT execution
On-Chip Memory	5 Mbits SRAM (four independent blocks) + 4 Mbits ROM - supports single-cycle access, mixed word-size allocation (16/32/48/64-bit), and 16-bit FP compression
Digital Audio Peripherals	8 × SPORTs, S/PDIF Tx/Rx, 4 × ASRCs, DAI with 4 × PCGs and IDP/PDAP - enables multichannel audio routing, sample rate translation, and clock domain isolation
Package & Thermal	176-lead LQFP_EP (12 mm × 12 mm, 0.5 mm pitch) with integrated thermal diode - supports industrial temperature range (−40°C to +85°C)
Automotive Qualification	AEC-Q100 Grade 3 qualified - validated for automotive infotainment and head unit applications requiring reliability under extended temperature and vibration stress
Development Support	Fully compatible with VisualDSP++ toolchain, EZ-KIT evaluation platforms, and SHARC-based reference designs for audio codecs and beamforming

Pinout & Package

ADSP-21489BSWZ-3B is housed in a 176-lead LQFP_EP package (12 mm × 12 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined across five functional groups: core interface (JTAG, FLAG, TIMER), memory (SDRAM/AMI address/data/control), DAI/DPI peripherals (DAI_Px, DPI_Px, PCG_CLK, S/PDIF), serial interfaces (SPORT0–7, SPI, TWI, UART), and power/ground (VDDIO, VDDCORE, AVDD, DGND).

Pin/Terminal	Circuit Role	Design Meaning
DAI_PIN0–DAI_PIN31	Digital Applications Interface I/O	Configurable bidirectional pins for DAI signal routing (e.g., PCM, I²S, TDM), supporting up to 32 dedicated channels with SRU programmability
SPORT0_DT0–SPORT0_DR0	Serial Port 0 Data Transmit/Receive	Dedicated full-duplex synchronous serial interface for connecting ADCs/DACs or FPGAs with frame sync and clock generation
S/PDIF_TX, S/PDIF_RX	S/PDIF Transmitter/Receiver	Integrated physical layer compliant with IEC 60958; supports consumer/professional formats and automatic format detection
PCG_CLK0–PCG_CLK3	Precision Clock Generator Outputs	Four independent, jitter-controlled clock outputs (up to 100 MHz) for driving external audio codecs or ADC/DAC master clocks
ASRC_IN0–ASRC_OUT3	Asynchronous Sample Rate Converter Channels	Four fully independent ASRC pairs enabling real-time sample rate conversion between unrelated clock domains (e.g., 44.1 kHz ↔ 48 kHz)
VDDCORE, VDDIO, AVDD	Power Supply Inputs	Separate 1.1 V core, 3.3 V I/O, and 3.3 V analog supplies - require individual decoupling and sequencing per datasheet recommendations

Key Features

Feature	Design Value
Variable Instruction Set Architecture (VISA)	Supports 16-/32-/48-bit instructions - reduces code size by up to 30% vs. legacy ISA and lowers external memory bandwidth demand
Zero-Overhead Circular Buffering	Dual DAGs with 32 hardware-managed circular buffers - eliminates software loop overhead in FIR filters, delay lines, and FFT data reordering
On-Chip ROM Security	64-bit JTAG key authentication required to enable emulation or external boot - prevents unauthorized firmware extraction or debugging access
Thermal Diode Integration	On-die diode with ±2°C accuracy - enables real-time junction temperature monitoring without external sensors for thermal throttling or derating control
DAI Signal Routing Unit (SRU)	Programmable interconnect matrix for DAI peripherals - allows arbitrary routing of PCG clocks, S/PDIF signals, ASRC streams, and SPORT data without PCB redesign

Applications

Professional Audio Mixing Console	Broadcast Audio Processing System
Use Scenario: Real-time multi-channel dynamics processing, EQ, reverb, and format conversion in live sound reinforcement. IC Role / Device Role / Timing Role: Primary audio signal processor executing >100 concurrent FIR/IIR filters and ASRCs with sub-50 μs latency. Use Value: On-chip 5 Mbits SRAM eliminates external DDR bottleneck; DAI SRU enables dynamic routing of 32-channel TDM streams between FPGA and codec without FPGA logic changes.	Use Scenario: Playout server with simultaneous Dolby E encoding, MPEG-H decoding, and loudness normalization for ATSC 3.0 transmission. IC Role / Device Role / Timing Role: Co-processor offloading audio post-processing from host CPU using ROM-based Dolby/DTS decoder algorithms. Use Value: Factory-programmed 4 Mbits ROM contains certified Dolby Labs and DTS audio decoding firmware - reduces BOM cost and validation effort versus discrete codec ICs.
Automotive Infotainment Head Unit	High-End Home Theater Receiver
Use Scenario: In-vehicle audio hub managing Bluetooth streaming, USB playback, AM/FM radio, and surround sound rendering. IC Role / Device Role / Timing Role: AEC-Q100-qualified audio DSP handling sample rate conversion, acoustic echo cancellation, and multi-zone audio distribution. Use Value: Integrated thermal diode and −40°C to +85°C operation ensure reliability across vehicle cabin temperature extremes without forced cooling.	Use Scenario: 11.2-channel immersive audio processor supporting Dolby Atmos and DTS:X object-based rendering. IC Role / Device Role / Timing Role: Master audio engine synchronizing multiple DACs, HDMI audio extractors, and room correction subsystems via PCG-generated clocks. Use Value: Four independent PCG outputs drive separate DAC banks at precise frequencies (e.g., 44.1 kHz, 48 kHz, 96 kHz, 192 kHz) with <100 ps jitter - meets THX Ultra2 timing compliance.

Professional Audio Mixing Console

Broadcast Audio Processing System

Use Scenario: Real-time multi-channel dynamics processing, EQ, reverb, and format conversion in live sound reinforcement.

IC Role / Device Role / Timing Role: Primary audio signal processor executing >100 concurrent FIR/IIR filters and ASRCs with sub-50 μs latency.

Use Value: On-chip 5 Mbits SRAM eliminates external DDR bottleneck; DAI SRU enables dynamic routing of 32-channel TDM streams between FPGA and codec without FPGA logic changes.

Use Scenario: Playout server with simultaneous Dolby E encoding, MPEG-H decoding, and loudness normalization for ATSC 3.0 transmission.

IC Role / Device Role / Timing Role: Co-processor offloading audio post-processing from host CPU using ROM-based Dolby/DTS decoder algorithms.

Use Value: Factory-programmed 4 Mbits ROM contains certified Dolby Labs and DTS audio decoding firmware - reduces BOM cost and validation effort versus discrete codec ICs.

Automotive Infotainment Head Unit

High-End Home Theater Receiver

Use Scenario: In-vehicle audio hub managing Bluetooth streaming, USB playback, AM/FM radio, and surround sound rendering.

IC Role / Device Role / Timing Role: AEC-Q100-qualified audio DSP handling sample rate conversion, acoustic echo cancellation, and multi-zone audio distribution.

Use Value: Integrated thermal diode and −40°C to +85°C operation ensure reliability across vehicle cabin temperature extremes without forced cooling.

Use Scenario: 11.2-channel immersive audio processor supporting Dolby Atmos and DTS:X object-based rendering.

IC Role / Device Role / Timing Role: Master audio engine synchronizing multiple DACs, HDMI audio extractors, and room correction subsystems via PCG-generated clocks.

Use Value: Four independent PCG outputs drive separate DAC banks at precise frequencies (e.g., 44.1 kHz, 48 kHz, 96 kHz, 192 kHz) with <100 ps jitter - meets THX Ultra2 timing compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance audio DSP applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ADSP-21487BSWZ-3A	Same 450 MHz core and 5 Mbits SRAM, but lacks S/PDIF transceiver and one ASRC unit; uses 100-lead LQFP_EP package	Targeted at space-constrained embedded audio where S/PDIF is not required and external clocking is used instead of PCGs	Select when board area is critical and S/PDIF/ASRC count can be reduced; verify thermal limits with smaller package
ADSP-21489BBCZ-4A	Same functionality and pinout, but in 176-lead BGA package (12 mm × 12 mm, 0.8 mm pitch); rated for −40°C to +105°C	Designed for convection-cooled industrial systems requiring extended temperature range and higher I/O density	Select for harsh environments or when BGA assembly infrastructure exists; requires different PCB layout and reflow profile

Compared with ADSP-21487BSWZ-3A, ADSP-21489BSWZ-3B provides full S/PDIF and ASRC capability in LQFP for rapid prototyping; compared with ADSP-21489BBCZ-4A, it trades extended temperature rating for easier hand-soldering and visual inspection in LQFP.

Availability

ADSP-21489BSWZ-3B is available at Aetrix Electronics and suitable for professional audio mixing consoles, broadcast playout servers, and automotive infotainment head units requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for ADSP-21489BSWZ-3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Wilmington, MA, with design centers and manufacturing facilities worldwide.

The SHARC® processor family, including ADSP-21489BSWZ-3B, was designed specifically for computationally intensive, low-latency audio signal processing applications requiring deterministic real-time performance and rich peripheral integration.

FAQ

What is the maximum operating frequency of the ADSP-21489BSWZ-3B?

The ADSP-21489BSWZ-3B operates at up to 450 MHz, delivering 2.7 GFLOPS peak performance in SIMD mode. This frequency is guaranteed across the industrial temperature range (−40°C to +85°C) with proper power supply regulation and thermal management. The part is tested and binned to meet this specification under worst-case voltage and temperature conditions as defined in the ADSP-2148x datasheet Rev. I.

Does the ADSP-21489BSWZ-3B support external SDRAM memory expansion?

Yes, the ADSP-21489BSWZ-3B includes a glueless SDRAM controller supporting up to 64M words per bank across four banks. It interfaces directly with standard x16 or x32 SDRAM devices using dedicated address, data, and control pins. The SDRAM controller is present only in 176-lead LQFP_EP packages like the ADSP-21489BSWZ-3B - not in 100- or 88-lead variants.

How does the ROM security feature work on the ADSP-21489BSWZ-3B?

The ADSP-21489BSWZ-3B implements ROM-based security via a 64-bit JTAG key that must be scanned into the device before emulation or external boot is enabled. When activated, the processor boots exclusively from internal ROM and blocks unauthorized read access to internal code memory. This feature is factory-configurable and requires coordination with Analog Devices for key assignment and provisioning.

Can the ADSP-21489BSWZ-3B perform sample rate conversion between unrelated audio clocks?

Yes, the ADSP-21489BSWZ-3B integrates four independent asynchronous sample rate converters (ASRCs) capable of real-time conversion between completely unrelated clock domains (e.g., 44.1 kHz AES3 input to 48 kHz Dante output). Each ASRC achieves −128 dB THD+N and supports programmable filter profiles for trade-offs between latency and alias rejection.

Is the ADSP-21489BSWZ-3B pin-compatible with other SHARC processors?

No, the ADSP-21489BSWZ-3B is not pin-compatible with earlier SHARC generations (e.g., ADSP-2136x or ADSP-2146x) due to differences in peripheral mapping, power pin allocation, and package-specific signal assignments. However, it is code-compatible at the assembly level with ADSP-2147x, ADSP-2146x, and prior SHARC families in SISD mode, and source-compatible in SIMD mode with ADSP-2148x variants sharing the same 176-lead LQFP_EP footprint.

ADSP-21489BSWZ-3B Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc.

Series:: SHARC®

Package/Case:: 176-LQFP Exposed Pad

Packaging:: Tray

Product Status:: Active

Type:: Floating Point

Interface:: EBI/EMI, DAI, I2C, SPI, SPORT, UART/USART

Clock Rate:: 350MHz

Non-Volatile Memory:: External

On-Chip RAM:: 5Mbit

Voltage - I/O:: 3.30V

Voltage - Core:: 1.10V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 176-LQFP-EP (24x24)

ADSP-21489BSWZ-3B FAQ

1.How can I place an order for ADSP-21489BSWZ-3B through Aetrix?

Please submit a Request for Quotation (RFQ) for ADSP-21489BSWZ-3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADSP-21489BSWZ-3B reliable?

The price and inventory of ADSP-21489BSWZ-3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-21489BSWZ-3B is usually 5 days.

3.What payment methods are accepted for ADSP-21489BSWZ-3B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-21489BSWZ-3B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADSP-21489BSWZ-3B?

ADSP-21489BSWZ-3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADSP-21489BSWZ-3B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADSP-21489BSWZ-3B?

For technical support, including ADSP-21489BSWZ-3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-21489BSWZ-3B requirements.

6.How does Aetrix verify that ADSP-21489BSWZ-3B is sourced from the original manufacturer or authorized distributors?

All ADSP-21489BSWZ-3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-21489BSWZ-3B meets industry standards.

7.What is the process for return or replacement of ADSP-21489BSWZ-3B?

All ADSP-21489BSWZ-3B units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-21489BSWZ-3B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADSP-21489BSWZ-3B part is unused and in its original packaging.

Return procedure for ADSP-21489BSWZ-3B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…