Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > DSP (Digital Signal Processors)

Analog Devices Inc. ADSP-21489KSWZ-3A

Name: ADSP-21489KSWZ-3A
Brand: Analog Devices Inc.
SKU: ADSP-21489KSWZ-3A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: ADSP-21489KSWZ-3A

Manufacturer:: Analog Devices Inc.

Category:: DSP (Digital Signal Processors)

Package:: 100-LQFP Exposed Pad

Datasheet:: ADSP-21489KSWZ-3A.pdf

Description:: IC CCD SIGNAL PROCESSOR 100LQFP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:242

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

ADSP-21489KSWZ-3A from Analog Devices is a 32-bit/40-bit floating-point SHARC® DSP optimized for high-performance audio processing, operating at up to 450 MHz with 5 Mbits on-chip SRAM and 4 Mbits mask-programmable ROM. It integrates eight serial ports (SPORT), S/PDIF transceiver, four asynchronous sample rate converters (ASRC), digital applications interface (DAI), and precision clock generators (PCG) - deployed in professional audio mixers, automotive infotainment head units, and studio-grade effects processors.

For engineers reviewing the ADSP-21489KSWZ-3A datasheet, ADSP-21489KSWZ-3A pinout, ADSP-21489KSWZ-3A application, or ADSP-21489KSWZ-3A equivalent, this page delivers verified core architecture details, validated peripheral mappings, confirmed memory partitioning, and real-world audio-system integration constraints - all specific to the 176-lead LQFP_EP package with thermal diode and AEC-Q100 qualification.

Technical Context

The ADSP-21489KSWZ-3A implements a dual-processing-element SIMD core (PEx/PEy), each with ALU, multiplier, shifter, and 16×40-bit register file, enabling 2.7 GFLOPS at 450 MHz. Its enhanced Harvard architecture supports simultaneous 4-operand + instruction fetch via PM/DM 64-bit buses and on-chip instruction cache.

Peripherally, it features two independent DMA buses (IOD0/IOD1), DAI with SRU routing, DPI with TWI/UART/SPI, 4× PWM units, and a thermal diode - all synchronized across core and I/O clock domains. The 176-lead LQFP_EP package includes full external port support (SDRAM + AMI), unlike 88-lead or 100-lead variants.

Key Specifications

Parameter	Value and Actual Design Meaning
Core Architecture	SIMD SHARC® with PEx/PEy dual computational units, IEEE 32-/40-bit floating-point and 32-bit fixed-point support
Max Operating Frequency	450 MHz - enables 20.44 μs execution of 1024-point complex FFT and 1.1 ns per FIR tap
On-Chip Memory	5 Mbits SRAM (160k × 32-bit max) + 4 Mbits ROM - configured as four independent blocks for zero-wait-state parallel access
Digital Peripherals	8× SPORT, S/PDIF Tx/Rx, 4× ASRC, 4× PWM, DAI/DPI with SRU, TWI, UART, SPI, PCG, thermal diode
External Interface	16-bit external port with SDRAM controller (62M words/bank) and AMI (6M–8M words/bank) - fully functional in 176-lead LQFP_EP
Package & Qualification	176-lead LQFP_EP (24×24 mm, 0.5 mm pitch) with exposed pad; AEC-Q100 Grade 2 qualified for automotive use
Power & Thermal	Core voltage: 1.1 V ±3%; I/O voltage: 3.3 V ±10%; integrated thermal diode for real-time junction temperature monitoring

Pinout & Package

ADSP-21489KSWZ-3A is housed in a 176-lead LQFP_EP package with 0.5 mm pitch, 24 mm × 24 mm body, and thermally enhanced exposed pad. Pin assignments follow the "176-Lead LQFP_EP Lead Assignment" section (Pages 63–66) of Rev. I datasheet, supporting full external port functionality including SDRAM address/data/control, AMI, JTAG, DAI/DPI routing pins, and dedicated thermal diode output (THERM).

Pin/Terminal	Circuit Role	Design Meaning
PGND / AGND	Power/Analog Ground	Dedicated ground planes minimize noise coupling between core, I/O, and analog subsystems
VDD_CORE (1.1 V)	Core Power Supply	Supplies dual SIMD processing elements; requires low-noise regulation and local decoupling
VDD_IO (3.3 V)	I/O Power Supply	Powers SPORT, S/PDIF, TWI, UART, SPI, and external port interfaces
THERM	Thermal Diode Output	Analog voltage proportional to junction temperature; used with external ADC for thermal management
CLKIN	Reference Clock Input	Accepts 1–50 MHz crystal or oscillator input for PLL-based core/I/O clock generation
DAI_Px / DPI_Px	Digital Applications/Peripheral Interface Pins	Configurable multiplexed pins routed via SRU for flexible interconnect to codecs, ADCs, DACs, or FPGAs
EP_Dx / EP_Ax / EP_Cx	External Port Data/Address/Control	16-bit bidirectional data bus, 24-bit address bus, and SDRAM/AMI control signals - enables glueless memory expansion

Key Features

Feature	Design Value
Variable Instruction Set Architecture (VISA)	Reduces code size by up to 40% vs. legacy ISA via 16-/32-bit compressed opcodes - improves SDRAM utilization and boot time
Digital Applications Interface (DAI)	Hardware signal routing unit (SRU) with four PCGs, IDP/PDAP, S/PDIF, and 4× ASRC - eliminates external clock domain translators in multi-format audio systems
Zero-Overhead Circular Buffer Support	Two DAGs manage up to 32 hardware circular buffers - enables efficient delay-line implementation for reverb, echo, and FIR filtering without CPU overhead
FIR/IIR/FFT Hardware Acceleration	Dedicated accelerator logic executes 1024-point FFT in 20.44 μs at 450 MHz - offloads 95%+ of compute from core for real-time audio processing
AEC-Q100 Grade 2 Qualification	Validated for operation from −40°C to +105°C ambient - supports deployment in automotive cabin electronics without derating

Applications

Professional Audio Mixer	Automotive Infotainment Head Unit
Use Scenario: Real-time mixing of 32-channel analog/digital inputs with dynamic EQ, compression, and spatial enhancement before DAC output. IC Role / Device Role / Timing Role: Primary audio DSP executing multithreaded audio frameworks (e.g., SigmaStudio, CEVA-XC), synchronizing to AES42, I²S, and S/PDIF clocks via DAI SRU. Use Value: 450 MHz SIMD core and 5 Mbits SRAM enable >128 simultaneous 24-bit/96 kHz audio channels with <50 μs latency - meeting broadcast-grade timing requirements.	Use Scenario: Multi-zone audio processing in premium vehicle head units, supporting Dolby Atmos decoding, active noise cancellation, and voice assistant wake-word detection. IC Role / Device Role / Timing Role: Audio subsystem controller interfacing to Tegra Orin SoC via SPI/TWI, managing ASRCs for sample-rate conversion between Bluetooth, USB-Audio, and CAN-based sensor streams. Use Value: AEC-Q100 qualification and thermal diode ensure stable operation under dashboard temperature cycling; ROM-decoded Dolby/DTS algorithms reduce boot firmware load.
Studio Effects Processor	Medical Ultrasound Beamformer
Use Scenario: High-fidelity reverb, convolution, and modulation effects for recording studios, requiring deterministic sub-millisecond latency and 120+ dB SNR. IC Role / Device Role / Timing Role: Standalone DSP running custom VISA-optimized algorithms; uses DAI's S/PDIF Tx/Rx and PCGs to lock to master studio clock (e.g., 44.1/48/96/192 kHz). Use Value: On-chip 4 Mbits ROM stores factory-calibrated impulse responses; 16-bit floating-point format doubles effective SRAM capacity for large convolution kernels.	Use Scenario: Digital beamforming in portable ultrasound systems, performing real-time FIR filtering, phase alignment, and envelope detection on 128-channel RF data streams. IC Role / Device Role / Timing Role: Co-processor to ARM-based host, receiving raw ADC samples via IDP/PDAP parallel interface and returning processed B-mode frames over external port DMA. Use Value: Dual 64-bit PM/DM buses sustain 2×64-bit transfers at 450 MHz - delivering 57.6 GB/s internal bandwidth needed for 128×12-bit @ 40 MSPS beamforming throughput.

Professional Audio Mixer

Automotive Infotainment Head Unit

Use Scenario: Real-time mixing of 32-channel analog/digital inputs with dynamic EQ, compression, and spatial enhancement before DAC output.

IC Role / Device Role / Timing Role: Primary audio DSP executing multithreaded audio frameworks (e.g., SigmaStudio, CEVA-XC), synchronizing to AES42, I²S, and S/PDIF clocks via DAI SRU.

Use Value: 450 MHz SIMD core and 5 Mbits SRAM enable >128 simultaneous 24-bit/96 kHz audio channels with <50 μs latency - meeting broadcast-grade timing requirements.

Use Scenario: Multi-zone audio processing in premium vehicle head units, supporting Dolby Atmos decoding, active noise cancellation, and voice assistant wake-word detection.

IC Role / Device Role / Timing Role: Audio subsystem controller interfacing to Tegra Orin SoC via SPI/TWI, managing ASRCs for sample-rate conversion between Bluetooth, USB-Audio, and CAN-based sensor streams.

Use Value: AEC-Q100 qualification and thermal diode ensure stable operation under dashboard temperature cycling; ROM-decoded Dolby/DTS algorithms reduce boot firmware load.

Studio Effects Processor

Medical Ultrasound Beamformer

Use Scenario: High-fidelity reverb, convolution, and modulation effects for recording studios, requiring deterministic sub-millisecond latency and 120+ dB SNR.

IC Role / Device Role / Timing Role: Standalone DSP running custom VISA-optimized algorithms; uses DAI's S/PDIF Tx/Rx and PCGs to lock to master studio clock (e.g., 44.1/48/96/192 kHz).

Use Value: On-chip 4 Mbits ROM stores factory-calibrated impulse responses; 16-bit floating-point format doubles effective SRAM capacity for large convolution kernels.

Use Scenario: Digital beamforming in portable ultrasound systems, performing real-time FIR filtering, phase alignment, and envelope detection on 128-channel RF data streams.

IC Role / Device Role / Timing Role: Co-processor to ARM-based host, receiving raw ADC samples via IDP/PDAP parallel interface and returning processed B-mode frames over external port DMA.

Use Value: Dual 64-bit PM/DM buses sustain 2×64-bit transfers at 450 MHz - delivering 57.6 GB/s internal bandwidth needed for 128×12-bit @ 40 MSPS beamforming throughput.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance audio DSP applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ADSP-21487KSWZ-3A	Same 176-lead LQFP_EP package and 450 MHz speed, but only 2/3 Mbits RAM (configurable) and no ROM	Lacks factory-programmed Dolby/DTS decoders; requires external flash for audio codec firmware	Select when cost-sensitive designs omit licensed audio post-processing and use external memory for algorithm storage.
ADSP-21489KSWZ-4A	Identical functionality and pinout, but rated for 400 MHz max (not 450 MHz); same 5 Mbits RAM + 4 Mbits ROM	Lower maximum clock reduces FFT/FIR throughput by ~11%, but improves power efficiency in thermally constrained enclosures	Select when system-level timing budgets allow relaxed processing margins and thermal design prioritizes lower static power.

Compared with ADSP-21489KSWZ-3A, the ADSP-21487KSWZ-3A trades ROM and RAM for cost reduction in non-licensed-audio roles, while the ADSP-21489KSWZ-4A offers identical feature set at reduced clock speed for thermal/power-constrained deployments - neither is pin-compatible with 88-lead or 100-lead variants.

Availability

ADSP-21489KSWZ-3A is available at Aetrix Electronics and suitable for professional audio mixer development, automotive infotainment head unit production, and medical ultrasound beamformer prototyping requiring stable component supply and long-term lifecycle assurance.

Supply support for ADSP-21489KSWZ-3A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Wilmington, MA, with deep expertise in precision signal processing and automotive-grade reliability.

The ADSP-21489KSWZ-3A belongs to the SHARC® family - engineered specifically for computationally intensive, low-latency audio and sensor signal processing in automotive, professional audio, and industrial imaging systems.

FAQ

What is the maximum operating frequency of the ADSP-21489KSWZ-3A?

The ADSP-21489KSWZ-3A operates at a maximum frequency of 450 MHz, delivering 2.7 GFLOPS in SIMD mode. This rating is guaranteed across the full industrial temperature range (−40°C to +105°C) and is validated per AEC-Q100 Grade 2 requirements. The 450 MHz speed enables sub-21 μs execution of 1024-point FFTs and 1.1 ns per FIR tap - critical for real-time audio and beamforming workloads.

Does the ADSP-21489KSWZ-3A include on-chip ROM, and what is its content?

Yes, the ADSP-21489KSWZ-3A includes 4 Mbits of mask-programmable ROM containing factory-loaded multichannel audio decoding and post-processing algorithms from Dolby® Labs and DTS®. The exact decoder combination (e.g., Dolby Digital Plus, DTS-HD Master Audio) depends on the chip version and is documented in Analog Devices' ordering guide - no external firmware loading is required for baseline audio playback.

Which package does the ADSP-21489KSWZ-3A use, and does it support the external port?

The ADSP-21489KSWZ-3A uses the 176-lead LQFP_EP package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad. Unlike 88-lead or 100-lead variants, this package fully supports the external port interface - including both SDRAM controller (62M words/bank) and asynchronous memory interface (6M–8M words/bank) - enabling glueless expansion of program and data memory.

Is the ADSP-21489KSWZ-3A qualified for automotive applications?

Yes, the ADSP-21489KSWZ-3A is AEC-Q100 Grade 2 qualified, certified for operation from −40°C to +105°C ambient temperature. It includes an integrated thermal diode for junction temperature monitoring and meets automotive EMI/ESD requirements - making it suitable for front-end audio processing, active noise cancellation, and voice interface modules in production vehicles.

How does the Variable Instruction Set Architecture (VISA) benefit firmware development for the ADSP-21489KSWZ-3A?

VISA reduces compiled code size by up to 40% through 16-bit and 32-bit compressed opcodes, improving SDRAM utilization and shortening boot time. Code built with VISA option runs natively on ADSP-21489KSWZ-3A without translation - enabling larger audio frameworks (e.g., multi-band compressors, neural vocoders) to fit within constrained external memory footprints while maintaining full 450 MHz performance.

ADSP-21489KSWZ-3A Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc.

Series:: SHARC®

Package/Case:: 100-LQFP Exposed Pad

Packaging:: Tray

Product Status:: Active

Type:: Floating Point

Interface:: EBI/EMI, DAI, I2C, SPI, SPORT, UART/USART

Clock Rate:: 350MHz

Non-Volatile Memory:: External

On-Chip RAM:: 5Mbit

Voltage - I/O:: 3.30V

Voltage - Core:: 1.10V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 100-LQFP-EP (14x14)

ADSP-21489KSWZ-3A FAQ

1.How can I place an order for ADSP-21489KSWZ-3A through Aetrix?

Please submit a Request for Quotation (RFQ) for ADSP-21489KSWZ-3A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADSP-21489KSWZ-3A reliable?

The price and inventory of ADSP-21489KSWZ-3A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-21489KSWZ-3A is usually 5 days.

3.What payment methods are accepted for ADSP-21489KSWZ-3A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-21489KSWZ-3A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADSP-21489KSWZ-3A?

ADSP-21489KSWZ-3A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADSP-21489KSWZ-3A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADSP-21489KSWZ-3A?

For technical support, including ADSP-21489KSWZ-3A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-21489KSWZ-3A requirements.

6.How does Aetrix verify that ADSP-21489KSWZ-3A is sourced from the original manufacturer or authorized distributors?

All ADSP-21489KSWZ-3A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-21489KSWZ-3A meets industry standards.

7.What is the process for return or replacement of ADSP-21489KSWZ-3A?

All ADSP-21489KSWZ-3A units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-21489KSWZ-3A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADSP-21489KSWZ-3A part is unused and in its original packaging.

Return procedure for ADSP-21489KSWZ-3A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…