Analog Devices Inc. ADSP-21573CBCZ-4

Overview

ADSP-21573CBCZ-4 from Analog Devices is a dual-core SHARC+ DSP with integrated Arm Cortex-A5 processor, delivering 500 MHz per SHARC+ core and 500 MHz Arm Cortex-A5 operation. It features 3 Mb L1 SRAM per SHARC+ core (with parity), 256 kB L2 cache (parity), and supports 32-/40-/64-bit floating-point arithmetic. It targets high-performance automotive audio processing, real-time control, and safety-critical signal processing systems.

For engineers reviewing the ADSP-21573CBCZ-4 datasheet, ADSP-21573CBCZ-4 pinout, ADSP-21573CBCZ-4 application, or ADSP-21573CBCZ-4 equivalent, key selection criteria include dual SHARC+ core frequency, L1 SRAM partitioning, AEC-Q100 qualification, 400-ball CSP_BGA package compatibility, and integrated FIR/IIR offload engines for deterministic audio latency.

Technical Context

The ADSP-21573CBCZ-4 implements a heterogeneous dual-domain architecture: two SHARC+ SIMD cores operate at up to 500 MHz each with independent 384 kB L1 SRAM banks (configurable as SRAM or cache), while the Arm Cortex-A5 core runs at 500 MHz with 32 kB I-cache/32 kB D-cache and 256 kB L2 cache - all with parity protection. The system fabric interconnects these domains via requester/completer ports supporting coherent data transfers.

It integrates a full peripheral set including dual CAN 2.0 controllers, three UARTs, four full SPORTs, S/PDIF Rx/Tx, ASRCs (4 pairs), two precision clock generators, and an 8-channel 12-bit HADC. Memory subsystem includes 1 MB L2 SRAM with ECC, plus L3 interface supporting DDR3L, DDR2, or LPDDR1 SDRAM - optimized for low-power automotive operation across −40°C to +125°C.

Key Specifications

Pinout & Package

ADSP-21573CBCZ-4 uses a 400-ball CSP_BGA package (17 mm × 17 mm, 0.65 mm pitch, RoHS compliant). Ball assignments follow JEDEC MO-220 VGGD-2 standard with defined power, ground, I/O, and differential clock ball groups. Thermal pad under die ensures efficient heat dissipation in automotive environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core DSP + application processor applications.

Compared with ADSP-21573CBCZ-4, ADSP-SC573KBCZ-4 and ADSP-21573KBCZ-4 provide identical real-time performance and peripheral functionality but add automotive-specific qualification evidence, extended temperature validation, and lifecycle assurance - critical for Tier 1 ECU deployments where component pedigree impacts ISO 26262 ASIL-B compliance.

Availability

ADSP-21573CBCZ-4 is available at Aetrix Electronics and suitable for automotive infotainment, professional audio equipment, industrial motor drives, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for ADSP-21573CBCZ-4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and digital signal processing technologies for precision, power, and connectivity applications.

The ADSP-21573CBCZ-4 belongs to the SHARC+ family - designed specifically for deterministic, low-latency audio and industrial signal processing where floating-point accuracy, memory bandwidth, and real-time interrupt response are non-negotiable.

FAQ

What is the maximum operating frequency of each SHARC+ core in the ADSP-21573CBCZ-4?

The ADSP-21573CBCZ-4 operates each SHARC+ core at up to 500 MHz. This frequency is guaranteed across the commercial temperature range (0°C to +70°C) and supported by the 1.05 V VDD_INT supply with proper decoupling. At this speed, the core delivers 500 MMAC/s in 32-bit floating-point mode with full pipeline utilization and no throttling.

Does the ADSP-21573CBCZ-4 support AEC-Q100 qualification?

No - the ADSP-21573CBCZ-4 is the commercial-temperature variant (0°C to +70°C). For AEC-Q100 Grade 1 (−40°C to +125°C), use ADSP-21573KBCZ-4 or ADSP-SC573KBCZ-4. These variants undergo additional automotive stress testing, lot traceability, and failure analysis reporting per AEC-Q100 Rev H requirements.

How much on-chip SRAM does the ADSP-21573CBCZ-4 provide, and how is it allocated?

The ADSP-21573CBCZ-4 provides 3 Mb (384 kB) of L1 SRAM per SHARC+ core - totaling 768 kB across both cores - plus 1 MB of shared L2 SRAM with ECC. Each SHARC+ L1 bank is independently configurable as program memory, data memory, or instruction cache, enabling optimal partitioning for real-time audio buffers and filter coefficients.

Which package type is used for the ADSP-21573CBCZ-4?

The ADSP-21573CBCZ-4 uses a 400-ball CSP_BGA package measuring 17 mm × 17 mm with 0.65 mm ball pitch. This package supports high I/O density and thermal performance required for automotive and professional audio applications, and is compatible with standard SMT reflow profiles per IPC-J-STD-020.

Can the Arm Cortex-A5 and SHARC+ cores run different operating systems simultaneously on the ADSP-21573CBCZ-4?

Yes - the ADSP-21573CBCZ-4 supports asymmetric multiprocessing (AMP). The Arm Cortex-A5 core can run Linux or FreeRTOS for system management, while each SHARC+ core runs bare-metal or DSP/BIOS for time-critical signal processing. Inter-core communication occurs via shared L2 SRAM and mailbox interrupts, with memory protection enforced by SMPU and TrustZone.