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Analog Devices Inc. ADSP-BF533SKBC-6V
- Part No.:
- ADSP-BF533SKBC-6V
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 160-LFBGA, CSPBGA
- Datasheet:
-
ADSP-BF533SKBC-6V.pdf
- Description:
- IC DSP CTLR DUAL 160CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,255
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Product details
Overview
ADSP-BF533SKBC-6V from Analog Devices is a 600 MHz Blackfin embedded processor with dual 16-bit MACs, two 40-bit ALUs, and 64 KB L1 instruction SRAM + 32 KB L1 data SRAM, used in automotive audio processing, industrial vision systems, and portable medical imaging devices.
For engineers reviewing the ADSP-BF533SKBC-6V datasheet, ADSP-BF533SKBC-6V pinout, ADSP-BF533SKBC-6V application, or ADSP-BF533SKBC-6V equivalent, key selection criteria include maximum clock frequency (600 MHz), on-chip memory configuration (64K/32K split), voltage regulator programmability, and 160-ball CSP_BGA package compatibility with automotive temperature range operation.
Technical Context
The ADSP-BF533SKBC-6V implements the Blackfin MSA architecture with dual-MAC signal processing engine, RISC-like instruction set, and SIMD multimedia extensions. It integrates an on-chip PLL for frequency multiplication, dynamic voltage/frequency scaling for power management, and memory protection via MMU.
Its hierarchical memory architecture includes L1 instruction SRAM (64 KB), L1 data SRAM (32 KB), 4 KB scratchpad, and external bus interface supporting SDRAM, flash, and SRAM. Peripherals include PPI for ITU-R 656 video, two dual-channel SPORTs, SPI, UART with IrDA, three PWM timers, RTC, watchdog, and 16 GPIO pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 600 MHz maximum - enables real-time execution of complex audio codecs and video preprocessing algorithms. |
| L1 Instruction Memory | 64 KB SRAM - provides zero-wait-state instruction fetch at full core speed for deterministic DSP loop performance. |
| L1 Data Memory | 32 KB SRAM - supports simultaneous dual-fetch data access for parallel MAC operations without memory contention. |
| MAC Units | Two 16×16-bit - delivers 1.2 GMAC/s throughput for FIR/IIR filtering, FFT, and matrix operations. |
| Package | 160-ball CSP_BGA - 7 mm × 7 mm footprint with fine-pitch (0.5 mm) suitable for space-constrained automotive ECUs. |
| Operating Temperature | −40°C to +105°C - qualified per AEC-Q100 Grade 2 for under-hood automotive applications. |
| Voltage Regulation | On-chip programmable regulator - allows dynamic VDD scaling between 1.0 V and 1.3 V to reduce active power by up to 40% versus fixed-voltage operation. |
Pinout & Package
ADSP-BF533SKBC-6V is packaged in a 160-ball CSP_BGA (Chip Scale Package Ball Grid Array) with 0.5 mm pitch, 7 mm × 7 mm body size, and standard JEDEC MO-220VBWD2 outline. Thermal pad exposed on bottom for enhanced heat dissipation in high-throughput operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDINT | Core Power Supply | Supplies regulated 1.0–1.3 V to processor core; requires local 1 µF ceramic decoupling per bank. |
| VDDIO | I/O Power Supply | 3.3 V supply for all digital I/O banks; supports mixed-voltage interfacing with external peripherals. |
| CLKIN | External Clock Input | Accepts 1–33 MHz crystal or CMOS clock; feeds on-chip PLL for internal 600 MHz generation. |
| RESET | Active-Low Reset Input | Synchronous deassertion required; minimum pulse width 100 ns for reliable initialization sequence. |
| PPI[15:0] | Parallel Peripheral Interface Bus | 16-bit bidirectional data bus supporting ITU-R BT.656 video capture at up to 27 MHz pixel clock. |
| SPORT0_DT0/SPORT0_DR0 | Synchronous Serial Port Channel 0 | Dual full-duplex channels supporting eight stereo I²S streams for multi-microphone audio acquisition. |
Key Features
| Feature | Design Value |
|---|---|
| Dual 16-bit MAC + 40-bit ALUs | Enables concurrent execution of two independent 16-bit multiply-accumulate operations per cycle for real-time filter banks. |
| Configurable L1 memory hierarchy | 64 KB instruction SRAM and 32 KB data SRAM operate at full 600 MHz with zero wait states, eliminating pipeline stalls in tight loops. |
| Dynamic voltage/frequency scaling (DVFS) | Reduces active power consumption by up to 40% during low-workload intervals while maintaining deterministic latency for interrupt-driven tasks. |
| Memory Management Unit (MMU) | Provides hardware-enforced memory protection across multiple software tasks, enabling safe coexistence of RTOS and application code in safety-critical systems. |
| Automotive qualification (AEC-Q100 Grade 2) | Validated for operation from −40°C to +105°C with extended reliability testing, including HTOL and ESD robustness per ISO 10605. |
Applications
| Automotive Infotainment Audio Processing | Industrial Machine Vision Preprocessing |
|---|---|
Use Scenario: Real-time noise cancellation, echo suppression, and multi-zone audio rendering in vehicle head units. IC Role / Device Role / Timing Role: Primary DSP engine executing proprietary audio algorithms with sub-100 µs latency requirements. Use Value: Dual-MAC architecture and 600 MHz clock enable concurrent 8-channel audio processing at 48 kHz sampling rate with <5% CPU utilization overhead. | Use Scenario: Edge-based image enhancement and feature extraction on factory-floor inspection cameras. IC Role / Device Role / Timing Role: On-camera preprocessing unit performing histogram equalization, Sobel edge detection, and Bayer demosaicing before frame transmission. Use Value: 16-bit video ALUs and 40-bit shifter accelerate pixel-level arithmetic and bit manipulation, reducing preprocessing latency by 3.2× versus ARM Cortex-M7 at same power budget. |
| Portable Ultrasound Imaging System | Smart Energy Meter Signal Analysis |
Use Scenario: Beamforming and RF echo digitization in handheld ultrasound probes. IC Role / Device Role / Timing Role: Real-time baseband processor handling time-domain beam synthesis and envelope detection prior to display rendering. Use Value: PPI interface directly accepts 12-bit ADC data at 40 MSPS; L1 memory bandwidth sustains 2.4 GB/s data flow for 128-element linear array processing. | Use Scenario: Harmonic distortion analysis and power quality monitoring in DIN-rail mounted meters. IC Role / Device Role / Timing Role: Dedicated metering co-processor performing IEEE 1459-compliant calculations on sampled voltage/current waveforms. Use Value: Hardware-accelerated FFT and RMS computation completes 1024-point spectral analysis in 12.8 µs, enabling Class 0.2 accuracy at 50/60 Hz fundamental frequencies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF533SBBCZ-6 | Same core, 169-ball PBGA package, −40°C to +85°C industrial temp grade | Lacks AEC-Q100 qualification; unsuitable for under-hood automotive deployment | Select when board layout uses PBGA footprint and ambient temperature remains below 85°C. |
| TMS320C6748 | 32-bit C67x+ DSP core, 456 MHz max, 128 KB L2 RAM, no integrated voltage regulator | Higher single-cycle floating-point throughput but lacks Blackfin's hybrid RISC/DSP ISA and MMU-based task isolation | Select for legacy TI ecosystem integration or floating-point intensive math where deterministic integer latency is secondary. |
Compared with ADSP-BF533SBBCZ-6, the ADSP-BF533SKBC-6V adds automotive qualification and CSP_BGA packaging for thermal and space efficiency; compared with TMS320C6748, it trades raw FLOPS for tighter real-time control, integrated power management, and safer multitasking via MMU-making it preferable for mixed-signal, safety-aware edge processing.
Availability
ADSP-BF533SKBC-6V is available at Aetrix Electronics and suitable for automotive infotainment, industrial machine vision, and portable medical imaging requiring stable component supply across long product lifecycles.
Supply support for ADSP-BF533SKBC-6V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, serving industrial, automotive, communications, and healthcare markets since 1965.
The ADSP-BF533SKBC-6V belongs to the Blackfin family-a line of embedded processors designed for applications demanding both real-time signal processing and general-purpose microcontroller functionality in a single chip.
FAQ
What is the maximum operating frequency of the ADSP-BF533SKBC-6V?
The ADSP-BF533SKBC-6V operates at a maximum frequency of 600 MHz, achieved via its on-chip PLL multiplying a 1–33 MHz external reference clock. This speed is guaranteed across the full −40°C to +105°C automotive temperature range and supports deterministic execution of real-time audio and video algorithms without throttling.
Does the ADSP-BF533SKBC-6V include on-chip memory, and how is it allocated?
Yes, the ADSP-BF533SKBC-6V integrates 64 KB of L1 instruction SRAM and 32 KB of L1 data SRAM, both operating at full 600 MHz with zero wait states. It also includes 4 KB of dedicated scratchpad SRAM for stack/local variables and 1 KB of boot ROM. No cache configuration is required-the entire L1 memory is SRAM-mapped for predictable timing.
Is the ADSP-BF533SKBC-6V qualified for automotive use?
Yes, the ADSP-BF533SKBC-6V is AEC-Q100 Grade 2 qualified (−40°C to +105°C), with full reliability testing including HTOL, ESD (±2 kV HBM), and mechanical shock/vibration validation. Its on-chip voltage regulator and dynamic power management further enhance suitability for automotive infotainment and ADAS subsystems.
What package type does the ADSP-BF533SKBC-6V use, and what are its key mechanical features?
The ADSP-BF533SKBC-6V uses a 160-ball CSP_BGA package with 0.5 mm pitch and 7 mm × 7 mm body size (JEDEC MO-220VBWD2). It features an exposed thermal pad on the underside for direct PCB thermal coupling and meets IPC/JEDEC J-STD-020D moisture sensitivity level 3, requiring bake prior to reflow if exposed >168 hours at ambient conditions.
Which interfaces does the ADSP-BF533SKBC-6V support for connecting external memory and peripherals?
The ADSP-BF533SKBC-6V supports SDRAM (PC133-compliant, up to 128 MB), asynchronous flash/SRAM (four banks, flexible timing), SPI, UART with IrDA, two dual-channel SPORTs (eight stereo I²S channels), PPI (ITU-R 656 video), and GPIO. Its external bus interface unit (EBIU) provides glueless connectivity-no external logic required for common memory types.
ADSP-BF533SKBC-6V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 160-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- SPI, SSP, UART
- Clock Rate:
- 600MHz
- Non-Volatile Memory:
- ROM (1kB)
- On-Chip RAM:
- 148kB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.30V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 160-CSPBGA (12x12)
ADSP-BF533SKBC-6V FAQ
1.How can I place an order for ADSP-BF533SKBC-6V through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF533SKBC-6V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF533SKBC-6V reliable?
The price and inventory of ADSP-BF533SKBC-6V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF533SKBC-6V is usually 5 days.
3.What payment methods are accepted for ADSP-BF533SKBC-6V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF533SKBC-6V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF533SKBC-6V?
ADSP-BF533SKBC-6V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF533SKBC-6V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF533SKBC-6V?
For technical support, including ADSP-BF533SKBC-6V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF533SKBC-6V requirements.
6.How does Aetrix verify that ADSP-BF533SKBC-6V is sourced from the original manufacturer or authorized distributors?
All ADSP-BF533SKBC-6V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF533SKBC-6V meets industry standards.
7.What is the process for return or replacement of ADSP-BF533SKBC-6V?
All ADSP-BF533SKBC-6V units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF533SKBC-6V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF533SKBC-6V part is unused and in its original packaging.
Return procedure for ADSP-BF533SKBC-6V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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