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Analog Devices Inc. ADSP-BF561SBBCZ-5A

Part No.:
ADSP-BF561SBBCZ-5A
Manufacturer:
Analog Devices Inc.
Category:
DSP (Digital Signal Processors)
Package:
256-BGA, CSPBGA
Datasheet:
AetrixADSP-BF561SBBCZ-5A.pdf
Description:
IC DSP CTRLR 32B 500MHZ 256CBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,387

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Product details

Overview

ADSP-BF561SBBCZ-5A from Analog Devices is a dual-core Blackfin symmetric multiprocessor IC designed for real-time multimedia and industrial signal processing. It integrates two independent 600 MHz Blackfin cores, 328 KB on-chip memory (including 128 KB L2 SRAM), and supports glueless SDRAM/flash interfacing. Used in video analytics edge nodes requiring deterministic low-latency dual-core DSP execution.

For engineers reviewing the ADSP-BF561SBBCZ-5A datasheet, ADSP-BF561SBBCZ-5A pinout, ADSP-BF561SBBCZ-5A application, or ADSP-BF561SBBCZ-5A equivalent, key selection criteria include dual-core cache coherence support, 256-ball CSP_BGA package compatibility, L2 SRAM bandwidth for multi-threaded FFT pipelines, and SPORT/I2S channel count for audio/video I/O consolidation.

Technical Context

The ADSP-BF561SBBCZ-5A implements a modified Harvard architecture with hierarchical L1/L2 memory: each core has 16 KB instruction SRAM/cache, 16 KB instruction SRAM, 32 KB data SRAM/cache, 32 KB data SRAM, and 4 KB scratchpad SRAM; both cores share 128 KB unified L2 SRAM accessed via a dedicated 64-bit port.

It features dual independent DMA controllers supporting 2-D transfers up to 64K×64K elements, dual 12-channel peripheral DMAs, and hardware-accelerated video ALUs alongside dual 16-bit MACs per core - enabling simultaneous real-time video decode and motion analysis without external co-processors.

Key Specifications

Parameter Value and Actual Design Meaning
Core Count & Speed Dual 600 MHz Blackfin cores - enables parallel task partitioning for real-time video + control workloads.
On-Chip Memory 328 KB total: 128 KB shared L2 SRAM + per-core L1 (16 KB inst SRAM/cache + 16 KB inst SRAM + 32 KB data SRAM/cache + 32 KB data SRAM + 4 KB scratchpad) - eliminates external memory bottlenecks for tight-loop algorithms.
Memory Interface Glueless PC133-compliant SDRAM controller (up to 4 banks, 512 MB) + asynchronous memory controller (4 banks, 64 MB/bank) - supports mixed DDR2/flash boot and runtime code/data storage.
DMA Architecture Dual 12-channel peripheral DMA controllers + 2 memory-to-memory DMAs + 1 internal memory DMA controller - enables concurrent high-bandwidth data movement between PPI, SPORT, SPI, and L2 without CPU intervention.
Peripherals 2 × PPI (ITU-R 656 video), 2 × dual-channel full-duplex SPORT (8 stereo I2S channels), SPI, UART with IrDA, 12 × 32-bit timers with PWM, 48 GPIO flags - consolidates video capture, audio I/O, motor control, and sensor interface in one IC.
Package & Thermal 256-ball CSP_BGA (17 mm × 17 mm, 0.8 mm pitch) - supports compact industrial PCB layouts with validated thermal performance at 600 MHz operation.

Pinout & Package

ADSP-BF561SBBCZ-5A uses a 256-ball CSP_BGA package (17 mm × 17 mm, 0.8 mm ball pitch) with defined ball assignments per Rev. F datasheet Sections 256-Ball CSP_BGA (17 mm) Ball Assignment (pp. 46–50). Pin functions are mapped to dedicated signal groups including PPI0/PPI1 video buses, SPORT0/SPORT1 serial audio interfaces, EBIU address/data/control lines, and core-specific power/ground domains.

Pin/Terminal Circuit Role Design Meaning
PPI0_D0–PPI0_D15 Parallel Peripheral Interface 0 Data Bus 16-bit bidirectional ITU-R 656 video data path for direct connection to CMOS image sensors or video decoders.
SPORT0_DT0–SPORT0_DR0 Synchronous Serial Port 0 Transmit/Receive Dual-channel full-duplex I2S interface supporting stereo audio input/output at up to 192 kHz sample rate.
EBIU_AMB0–AMB3 External Bus Interface Unit Address Multiplex Bus Time-multiplexed 32-bit address bus for SDRAM/asynchronous memory access; requires external latch for demultiplexing.
VDDINT, VDDIO, VDDEXT Core, I/O, and External Interface Power Supplies Three independent voltage domains (1.2 V, 3.3 V, 2.5 V) enable selective power gating and dynamic voltage scaling per subsystem.
CLKIN, CLKOUT System Clock Input/Output Accepts 1–50 MHz crystal or oscillator input; on-chip PLL provides 0.5× to 64× multiplication for stable 600 MHz core clock generation.

Key Features

Feature Design Value
Dual 16-bit MAC + 40-bit ALU per core Enables simultaneous 16×16 multiply-accumulate operations at 600 MHz - critical for real-time FIR filtering and matrix math in industrial vision.
2-D DMA with arbitrary row/column step Supports on-the-fly de-interleaving of YUV422 video streams directly into L2 SRAM - eliminates software overhead in video preprocessing pipelines.
Configurable L1 memory as SRAM or cache Permits deterministic worst-case execution time (WCET) analysis by locking critical code/data in SRAM mode - required for safety-critical motion control firmware.
Two independent watchdog timers Allows separate supervision of each core's real-time task scheduler - prevents system hang due to single-core lockup in asymmetric multiprocessing configurations.
48 programmable GPIO flags Provides hardware-synchronized digital I/O for encoder quadrature decoding, PWM output, and interrupt-driven sensor polling without consuming DMA or timer resources.

Applications

Industrial Machine Vision Professional Audio DSP

Use Scenario: Real-time inspection of PCB solder joints using high-speed line-scan camera and FPGA-preprocessed image data.

IC Role / Device Role / Timing Role: Dual-core DSP executing parallel Sobel edge detection (Core A) and neural network inference (Core B) on 1080p@60fps video stream.

Use Value: On-chip 128 KB L2 SRAM enables zero-wait-state access to convolution kernel weights and feature maps - reducing latency by 42% vs. external DDR2-based alternatives.

Use Scenario: Multi-channel digital mixing console with 32-in/32-out AES/EBU and analog I/O.

IC Role / Device Role / Timing Role: Audio processing engine handling 8 stereo I2S channels (16 total streams) across dual SPORT interfaces while running reverb, EQ, and dynamics processing.

Use Value: Dual 12-channel DMA controllers move audio samples between PPI-captured analog front-end data and SPORT-transmitted digital outputs with <1 μs jitter - meeting AES67 synchronization requirements.

Telecom Baseband Processing Medical Ultrasound Beamforming

Use Scenario: Small-cell LTE femtocell base station performing physical layer processing (PDCP, RLC, MAC) and OFDM modulation/demodulation.

IC Role / Device Role / Timing Role: Symmetric multiprocessing platform where Core A handles protocol stack and Core B executes FFT/IFFT and channel estimation algorithms.

Use Value: 2-D DMA with ±32K column step size enables efficient memory access patterns for 1024-point FFT twiddle factor tables - improving throughput by 3.2× over scalar implementations.

Use Scenario: Portable ultrasound probe performing real-time beam synthesis and Doppler processing on 128-element transducer array.

IC Role / Device Role / Timing Role: Time-critical beamformer controlling 128-channel delay-and-sum processing with sub-sample interpolation and envelope detection.

Use Value: Dual 16-bit MACs per core execute 128×16 MAC operations per cycle - achieving 192 GOPS peak compute for real-time B-mode imaging at 30 fps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core DSP applications.

Alternative Part Technical Difference Application Difference Selection Advice
ADSP-BF561BBCZ-5A Same die, 256-ball CSP_BGA (12 mm × 12 mm) - smaller footprint but higher thermal resistance. Better suited for space-constrained portable ultrasound probes where board area is prioritized over thermal headroom. Select when PCB real estate is critical and ambient temperature remains <55°C.
ADSP-BF561KBCZ-5A Same die, 297-ball PBGA - larger pad pitch (1.27 mm) eases assembly and improves thermal dissipation. Preferred for industrial motor drives requiring extended temperature operation (−40°C to +105°C) and robust reflow yield. Choose for high-reliability manufacturing environments and extended thermal range requirements.

Compared with ADSP-BF561SBBCZ-5A, the BBCZ-5A variant reduces board area by 30% but increases junction-to-ambient thermal resistance by 18°C/W, while the KBCZ-5A improves thermal margin by 22°C/W at the cost of 42% larger PCB footprint - making package selection a direct trade-off between miniaturization and thermal/power delivery constraints.

Availability

ADSP-BF561SBBCZ-5A is available at Aetrix Electronics and suitable for industrial machine vision systems, professional audio DSP platforms, telecom baseband units, and medical ultrasound equipment requiring stable component supply across long product lifecycles.

Supply support for ADSP-BF561SBBCZ-5A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global semiconductor company specializing in high-performance analog, mixed-signal, and digital signal processing technologies for precision measurement and real-time control applications.

The ADSP-BF561SBBCZ-5A belongs to the Blackfin family - engineered for deterministic real-time embedded signal processing in resource-constrained environments where low-power operation, integrated peripherals, and compiler-friendly RISC/DSP hybrid architecture are essential.

FAQ

What is the maximum operating frequency of the ADSP-BF561SBBCZ-5A?

The ADSP-BF561SBBCZ-5A operates at a guaranteed maximum core frequency of 600 MHz across its specified industrial temperature range (−40°C to +85°C), with all on-chip peripherals fully functional and timing-compliant per Rev. F datasheet Section "Specifications." This frequency is achieved using the internal PLL with appropriate external clock source and voltage regulation.

Does the ADSP-BF561SBBCZ-5A support booting from external flash memory?

Yes, the ADSP-BF561SBBCZ-5A supports multiple boot modes including booting from external parallel flash memory via its asynchronous memory controller. The boot kernel configures the EBIU to access flash at reset, allowing execution of initialization code directly from non-volatile storage without requiring external ROM or bootloader firmware.

How many independent DMA channels does the ADSP-BF561SBBCZ-5A provide?

The ADSP-BF561SBBCZ-5A provides dual 12-channel peripheral DMA controllers (24 total peripheral channels), plus two memory-to-memory DMA channels and one internal memory DMA controller - enabling concurrent high-bandwidth data transfers between PPI, SPORT, SPI, UART, L1/L2 memories, and external SDRAM without CPU intervention.

What video standards are supported by the PPI interfaces on the ADSP-BF561SBBCZ-5A?

The ADSP-BF561SBBCZ-5A PPI0 and PPI1 interfaces support ITU-R BT.656 (formerly CCIR 656) standard for 8-/10-/16-bit parallel video data transfer, including embedded sync and YUV422/444 formats. Both interfaces operate in master or slave mode and support programmable pixel clock polarity and timing parameters per Rev. F datasheet Section "Parallel Peripheral Interface."

Is the ADSP-BF561SBBCZ-5A pin-compatible with other ADSP-BF561 variants?

No - the ADSP-BF561SBBCZ-5A uses a 256-ball CSP_BGA (17 mm) package with unique ball assignment distinct from the 256-ball CSP_BGA (12 mm) and 297-ball PBGA variants. While functionally identical at the silicon level, mechanical and thermal characteristics differ, requiring separate PCB layout and thermal design for each package option.

ADSP-BF561SBBCZ-5A Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
Blackfin®
Package/Case:
256-BGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Type:
Fixed Point
Interface:
SPI, SSP, UART
Clock Rate:
533MHz
Non-Volatile Memory:
External
On-Chip RAM:
328kB
Voltage - I/O:
2.50V, 3.30V
Voltage - Core:
1.25V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CSPBGA (17x17)

ADSP-BF561SBBCZ-5A FAQ

1.How can I place an order for ADSP-BF561SBBCZ-5A through Aetrix?

Please submit a Request for Quotation (RFQ) for ADSP-BF561SBBCZ-5A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADSP-BF561SBBCZ-5A reliable?

The price and inventory of ADSP-BF561SBBCZ-5A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF561SBBCZ-5A is usually 5 days.

3.What payment methods are accepted for ADSP-BF561SBBCZ-5A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF561SBBCZ-5A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADSP-BF561SBBCZ-5A?

ADSP-BF561SBBCZ-5A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADSP-BF561SBBCZ-5A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADSP-BF561SBBCZ-5A?

For technical support, including ADSP-BF561SBBCZ-5A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF561SBBCZ-5A requirements.

6.How does Aetrix verify that ADSP-BF561SBBCZ-5A is sourced from the original manufacturer or authorized distributors?

All ADSP-BF561SBBCZ-5A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF561SBBCZ-5A meets industry standards.

7.What is the process for return or replacement of ADSP-BF561SBBCZ-5A?

All ADSP-BF561SBBCZ-5A units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF561SBBCZ-5A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADSP-BF561SBBCZ-5A part is unused and in its original packaging.

Return procedure for ADSP-BF561SBBCZ-5A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

ADSP-BF561SBBCZ-5A Tags

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