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Analog Devices Inc. ADSP-BF561SKBCZ-5V
- Part No.:
- ADSP-BF561SKBCZ-5V
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 256-LFBGA, CSPBGA
- Datasheet:
-
ADSP-BF561SKBCZ-5V.pdf
- Description:
- IC DSP 32BIT 500MHZ 256CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,229
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Product details
Overview
ADSP-BF561SKBCZ-5V from Analog Devices is a dual-core Blackfin symmetric multiprocessor IC designed for real-time multimedia and industrial signal processing. It integrates two 600 MHz Blackfin cores, 328 KB on-chip memory (including 128 KB L2 SRAM), and supports glueless SDRAM/flash interfacing. Used in video analytics edge nodes requiring deterministic low-latency dual-core DSP execution.
For engineers reviewing the ADSP-BF561SKBCZ-5V datasheet, ADSP-BF561SKBCZ-5V pinout, ADSP-BF561SKBCZ-5V application, or ADSP-BF561SKBCZ-5V equivalent, key selection criteria include dual-core clock frequency, L1/L2 memory partitioning, PPI/SPORT interface count, voltage regulator integration, and 256-ball CSP_BGA (17 mm) package compatibility with high-density PCB layouts.
Technical Context
The ADSP-BF561SKBCZ-5V implements a modified Harvard architecture with hierarchical L1 instruction/data SRAM/cache (32 KB each per core), 4 KB scratchpad SRAM per core, and shared 128 KB unified L2 SRAM operating at half-core frequency. Each core features dual 16-bit MACs, dual 40-bit ALUs, four 8-bit video ALUs, and a 40-bit shifter - enabling simultaneous 16-bit × 16-bit multiply-accumulate operations per cycle with 40-bit accumulation.
It includes dual independent DMA controllers supporting 24 peripheral DMAs, memory-to-memory transfers, and 2-D DMA with arbitrary row/column dimensions up to 64K × 64K. The on-chip PLL supports 0.5× to 64× frequency multiplication, and the EBIU provides glueless interface to PC133-compliant SDRAM, mobile SDRAM, SRAM, and flash across four banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count | Dual symmetric Blackfin cores - enables true parallel real-time signal processing without OS scheduling overhead. |
| Max Core Frequency | 600 MHz - determines maximum sustained MAC throughput of 1.2 billion MACs/sec (2 × 600 MHz). |
| On-Chip Memory | 328 KB total: 64 KB L1 instruction (32 KB cache + 32 KB SRAM), 128 KB L1 data (64 KB cache + 64 KB SRAM), 8 KB scratchpad/core, 128 KB shared L2 SRAM - supports zero-wait-state code/data execution and low-latency inter-core data sharing. |
| External Memory Interface | Glueless EBIU supporting 4 banks SDRAM (up to 512 MB), 4 banks asynchronous memory (flash/SRAM) - eliminates external logic, reduces BOM cost and board area. |
| DMA Channels | 24 peripheral DMAs + 2 memory-to-memory DMAs - enables concurrent high-bandwidth data movement between PPI, SPORT, SPI, UART, and memory without CPU intervention. |
| Peripherals | Dual PPI (ITU-R 656 video), dual SPORT (8 stereo I²S channels), SPI, UART with IrDA, 12 timers with PWM, 48 GPIO - supports full-stack embedded vision/audio system integration. |
| Package | 256-ball CSP_BGA (17 mm × 17 mm, 0.8 mm pitch) - optimized for thermal performance and high I/O density in space-constrained industrial modules. |
Pinout & Package
ADSP-BF561SKBCZ-5V uses a 256-ball CSP_BGA package (17 mm × 17 mm, 0.8 mm ball pitch) with exposed thermal pad. Pin assignments are defined in Analog Devices' Rev. F datasheet, Pages 46–50 (256-ball CSP_BGA 17 mm ball assignment).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDINT | Core voltage supply | 1.2 V ±3% input for processor logic - requires low-noise regulation and local decoupling to maintain timing integrity at 600 MHz. |
| VDDIO | I/O voltage supply | 3.3 V ±5% input for all digital I/Os including PPI, SPORT, SPI, UART - enables direct interfacing with 3.3 V peripherals without level shifters. |
| CLKIN | External reference clock input | Accepts 1–50 MHz crystal or oscillator - feeds on-chip PLL for generating internal 600 MHz core clock and derived peripheral clocks. |
| PPI0_D0–PPI0_D15 | Parallel Peripheral Interface 0 data bus | 16-bit bidirectional video/data bus supporting ITU-R BT.656 - connects directly to CMOS image sensors or video ADCs without glue logic. |
| SPORT0_DT0–SPORT0_DR0 | Synchronous serial port 0 transmit/receive | Dual-channel full-duplex I²S/TDM interface - supports 8 stereo audio channels via time-division multiplexing for multi-mic/multi-speaker systems. |
| BOOT_CFG0–BOOT_CFG2 | Boot configuration pins | 3-pin strapping inputs determining boot source (SPI flash, parallel flash, or external host) - defines initial memory map and firmware load path at power-up. |
Key Features
| Feature | Design Value |
|---|---|
| Dual 600 MHz Blackfin cores | Enables lock-step or independent task partitioning for real-time video analytics pipelines with guaranteed latency bounds. |
| 128 KB shared L2 SRAM | Provides low-latency (≤2-cycle access) inter-core communication buffer and shared coefficient storage for FFT/filter banks. |
| 2-D DMA with 64K × 64K support | Allows deinterleaving of YUV422 video frames directly into planar buffers during capture - eliminates CPU cycles and memory bandwidth bottlenecks. |
| Glueless SDRAM controller (PC133) | Supports up to 512 MB external memory with programmable timing - enables large frame buffers and deep neural network inference models without FPGA co-processor. |
| Two PPI interfaces (ITU-R 656) | Permits simultaneous connection to dual camera sensors or analog front-end ADCs - critical for stereo vision and multi-spectral imaging systems. |
Applications
| Video Surveillance Analytics | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time motion detection, object classification, and metadata tagging on 1080p@30fps video streams from dual cameras. IC Role / Device Role / Timing Role: Dual-core DSP executing parallel Sobel edge detection (Core A) and CNN-based inference (Core B) with synchronized frame buffering via L2 SRAM. Use Value: 600 MHz clock and 2-D DMA enable sub-30ms end-to-end pipeline latency while sustaining 2.4 GOPS computational throughput. | Use Scenario: High-precision defect inspection on PCB assembly lines using line-scan cameras and structured light projection. IC Role / Device Role / Timing Role: PPI0 captures 12-bit monochrome line data; PPI1 receives synchronized trigger signals; dual SPORTs stream processed results to PLC over I²S. Use Value: Glueless SDRAM interface stores multi-gigabyte calibration lookup tables; 48 GPIO control stepper motors and strobe lighting with microsecond timing precision. |
| Medical Ultrasound Beamforming | Telecom Baseband Processing |
Use Scenario: Digital beam synthesis and Doppler processing for portable ultrasound probes with 128-channel transducer arrays. IC Role / Device Role / Timing Role: Core A performs FIR filtering on 128-channel RF data; Core B executes FFT-based spectral analysis and color flow mapping. Use Value: Dual 16-bit MACs deliver 1.2 billion MACs/sec required for real-time 128-tap delay-and-sum beamforming at 40 MHz sampling rate. | Use Scenario: Multi-carrier modulation/demodulation for point-to-point wireless backhaul operating in licensed 5.8 GHz band. IC Role / Device Role / Timing Role: SPORTs interface with dual RF transceivers; SPI configures external DAC/ADC; L2 SRAM holds OFDM symbol buffers and channel estimation coefficients. Use Value: 24 peripheral DMAs sustain full-duplex 100 Mbps PHY layer processing with <5 μs interrupt latency for adaptive modulation switching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF561BBCZ-5V | Same dual-core architecture and memory map, but packaged in 297-ball PBGA (27 mm × 27 mm) with different thermal and routing characteristics. | Better thermal dissipation for sustained 600 MHz operation in convection-cooled enclosures; larger footprint limits use in ultra-compact modules. | Select when board layout allows larger package and thermal management prioritizes long-term reliability over miniaturization. |
| TMS320C6474GZL | TI C64x+ triple-core DSP (1 GHz/core), 2 MB L2 RAM, no integrated SDRAM controller, requires external memory interface logic. | Higher raw MIPS but lacks glueless SDRAM and dual PPI - demands additional FPGA or ASIC for video interface and memory expansion. | Select only when application requires >2× single-threaded throughput and design team has resources to implement external memory controller and video interface logic. |
Compared with ADSP-BF561SKBCZ-5V, the ADSP-BF561BBCZ-5V offers identical functionality in a thermally robust PBGA package ideal for industrial environments, while the TMS320C6474GZL delivers higher peak compute but increases system complexity, BOM cost, and PCB layer count due to missing integrated peripherals and memory controllers.
Availability
ADSP-BF561SKBCZ-5V is available at Aetrix Electronics and suitable for video surveillance analytics, industrial machine vision, medical ultrasound beamforming, and telecom baseband processing requiring stable component supply across extended product lifecycles.
Supply support for ADSP-BF561SKBCZ-5V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and DSP technologies for precision signal processing applications.
The Blackfin family, including ADSP-BF561SKBCZ-5V, was engineered for embedded real-time multimedia processing where deterministic low-latency execution, power efficiency, and peripheral integration are critical - targeting industrial automation, medical imaging, and communications infrastructure.
FAQ
What is the maximum operating frequency of the ADSP-BF561SKBCZ-5V?
The ADSP-BF561SKBCZ-5V operates at a maximum core frequency of 600 MHz, as specified in the Analog Devices Rev. F datasheet under Electrical Characteristics. This frequency applies to both Blackfin cores simultaneously and is sustained under recommended VDDINT = 1.2 V ±3% and ambient temperature ≤85°C conditions. The on-chip PLL generates this clock from an external CLKIN source ranging from 1 MHz to 50 MHz.
Does the ADSP-BF561SKBCZ-5V include on-chip memory for program and data storage?
Yes, the ADSP-BF561SKBCZ-5V integrates 328 KB of on-chip memory: 64 KB L1 instruction memory (32 KB cache + 32 KB SRAM) and 128 KB L1 data memory (64 KB cache + 64 KB SRAM) per core, plus 8 KB scratchpad SRAM per core, and 128 KB shared L2 SRAM. All L1 memory operates at full 600 MHz core speed, while L2 SRAM runs at 300 MHz with unified instruction/data addressing.
What package type and ball count does the ADSP-BF561SKBCZ-5V use?
The ADSP-BF561SKBCZ-5V uses a 256-ball CSP_BGA package measuring 17 mm × 17 mm with 0.8 mm ball pitch and an exposed thermal pad. This package variant is explicitly listed in the Analog Devices Ordering Guide (Rev. F, Page 63) and differs from the 297-ball PBGA option (ADSP-BF561BBCZ-5V). Ball assignments are documented on Pages 46–50 of the datasheet.
Can the ADSP-BF561SKBCZ-5V interface directly with SDRAM without external logic?
Yes, the ADSP-BF561SKBCZ-5V includes a glueless External Bus Interface Unit (EBIU) that supports PC133-compliant SDRAM across up to four banks. The SDRAM controller handles all timing parameters, refresh cycles, and bank management internally. No external address latches, buffers, or timing logic are required - enabling direct connection to standard 64M–512M SDRAM components.
How many independent DMA controllers does the ADSP-BF561SKBCZ-5V have, and what is their capability?
The ADSP-BF561SKBCZ-5V contains two independent DMA controllers supporting 24 peripheral DMA channels, two memory-to-memory DMA channels, and one internal memory DMA controller. Each supports 1-D and 2-D transfers with arbitrary row/column dimensions up to 64K × 64K and step sizes up to ±32K - essential for real-time video frame deinterleaving and multi-dimensional filter bank processing in the ADSP-BF561SKBCZ-5V.
ADSP-BF561SKBCZ-5V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 256-LFBGA, CSPBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Fixed Point
- Interface:
- SPI, SSP, UART
- Clock Rate:
- 533MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 328kB
- Voltage - I/O:
- 2.50V, 3.30V
- Voltage - Core:
- 1.25V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CSPBGA (12x12)
ADSP-BF561SKBCZ-5V FAQ
1.How can I place an order for ADSP-BF561SKBCZ-5V through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF561SKBCZ-5V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF561SKBCZ-5V reliable?
The price and inventory of ADSP-BF561SKBCZ-5V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF561SKBCZ-5V is usually 5 days.
3.What payment methods are accepted for ADSP-BF561SKBCZ-5V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF561SKBCZ-5V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF561SKBCZ-5V?
ADSP-BF561SKBCZ-5V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF561SKBCZ-5V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF561SKBCZ-5V?
For technical support, including ADSP-BF561SKBCZ-5V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF561SKBCZ-5V requirements.
6.How does Aetrix verify that ADSP-BF561SKBCZ-5V is sourced from the original manufacturer or authorized distributors?
All ADSP-BF561SKBCZ-5V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF561SKBCZ-5V meets industry standards.
7.What is the process for return or replacement of ADSP-BF561SKBCZ-5V?
All ADSP-BF561SKBCZ-5V units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF561SKBCZ-5V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF561SKBCZ-5V part is unused and in its original packaging.
Return procedure for ADSP-BF561SKBCZ-5V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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