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Analog Devices Inc. ADSP-BF561SKBCZ-6V
- Part No.:
- ADSP-BF561SKBCZ-6V
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 256-LFBGA, CSPBGA
- Datasheet:
-
ADSP-BF561SKBCZ-6V.pdf
- Description:
- IC DSP 32BIT 600MHZ 256CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,222
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Product details
Overview
ADSP-BF561SKBCZ-6V from Analog Devices is a dual-core Blackfin symmetric multiprocessor IC designed for real-time multimedia and industrial signal processing. It integrates two 600 MHz Blackfin cores, 328 KB on-chip memory (including 128 KB L2 SRAM), and supports glueless SDRAM/flash interfacing. Used in video analytics edge nodes requiring deterministic low-latency dual-core execution.
For engineers reviewing the ADSP-BF561SKBCZ-6V datasheet, ADSP-BF561SKBCZ-6V pinout, ADSP-BF561SKBCZ-6V application, or ADSP-BF561SKBCZ-6V equivalent, key selection criteria include dual-core clock frequency, L1/L2 memory partitioning, PPI/SPORT interface count, voltage regulation capability, and 256-ball CSP_BGA (17 mm) package compatibility.
Technical Context
The ADSP-BF561SKBCZ-6V implements a symmetric dual-core architecture with independent L1 instruction/data memories per core (16 KB SRAM + 16 KB cache each), plus shared 128 KB L2 SRAM accessible via 64-bit port. Each core features dual 16×16 MACs, dual 40-bit ALUs, four 8-bit video ALUs, and a 40-bit shifter - enabling simultaneous 16-bit × 16-bit multiply-accumulate operations every cycle with 40-bit accumulation.
Its peripheral subsystem includes dual 12-channel DMA controllers (24 total peripheral channels), two full-duplex SPORTs supporting eight stereo I²S channels, dual PPI units compliant with ITU-R BT.656, SPI, UART with IrDA, and on-chip PLL with 0.5×–64× multiplication. The device operates at 1.2 V core / 3.3 V I/O and uses dynamic voltage/frequency scaling for portable power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count | Dual independent Blackfin cores - enables true parallel task execution without OS scheduler overhead. |
| Max Core Frequency | 600 MHz - delivers up to 1.2 GMAC/s aggregate performance for real-time video filtering or multi-channel audio codecs. |
| On-Chip Memory | 328 KB total: 64 KB L1 instruction (32 KB SRAM + 32 KB cache/core), 128 KB L1 data (64 KB SRAM + 64 KB cache/core), 4 KB scratchpad/core, 128 KB shared L2 SRAM - enables zero-wait-state code/data access critical for deterministic DSP loops. |
| Memory Interface | Glueless EBIU supporting PC133-compliant SDRAM (up to 512 MB), flash, SRAM, and mobile SDRAM - eliminates external logic for memory expansion in embedded vision systems. |
| Peripherals | Dual PPI (ITU-R BT.656), dual SPORT (8× stereo I²S), SPI, UART/IrDA, 48 GPIO, dual watchdog timers - supports direct connection to image sensors, audio codecs, and control interfaces without bridge ICs. |
| Package | 256-ball CSP_BGA (17 mm × 17 mm, 0.8 mm pitch) - compact footprint suitable for space-constrained industrial camera modules and portable test equipment. |
| Supply Voltages | 1.2 V core (±3%), 3.3 V I/O (±5%) - requires dedicated low-noise core regulator; I/O rail compatible with standard logic families. |
Pinout & Package
ADSP-BF561SKBCZ-6V is housed in a 256-ball CSP_BGA package (17 mm × 17 mm, 0.8 mm ball pitch) with thermal pad. Pin assignments follow the Rev. F datasheet's "256-Ball CSP_BGA (17 mm) Ball Assignment" table (pages 46–50), including dedicated power/ground balls, differential clock inputs, JTAG debug interface, and function-mapped peripheral pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.2 V input for processor core logic; requires low-ESR ceramic decoupling within 5 mm of package. |
| VDD_IO | I/O power supply | 3.3 V input for all digital I/O banks; separate from core rail to support mixed-voltage system interfacing. |
| CLKIN | External reference clock input | Differential or single-ended 1–50 MHz crystal/oscillator input feeding on-chip PLL for internal clock generation. |
| PPI0_D0–D15 | Parallel Peripheral Interface 0 data bus | 16-bit bidirectional ITU-R BT.656-compliant video data path; supports 8-/10-/12-bit YUV/RGB formats at up to 74.25 MHz pixel clock. |
| SPORT0_DT0–DT7 | Synchronous Serial Port 0 transmit data | Eight independent serial transmit lines supporting stereo I²S, left-justified, or TDM protocols for multi-channel audio output. |
| TCK/TDI/TDO/TMS | JTAG boundary scan/debug interface | IEEE 1149.1-compliant test and emulation port; required for VisualDSP++ ICE-based debugging and flash programming. |
Key Features
| Feature | Design Value |
|---|---|
| Dual 600 MHz Blackfin cores | Enables lock-step or asymmetric multiprocessing for real-time video analytics pipelines where one core handles sensor preprocessing and the other runs object detection algorithms. |
| 128 KB shared L2 SRAM | Provides high-bandwidth (64-bit) inter-core data exchange buffer - avoids external memory latency when sharing frame buffers or coefficient tables. |
| Dual PPI supporting ITU-R BT.656 | Allows direct glueless connection to CMOS image sensors and video ADCs without FPGA bridging - reduces BOM cost and board area in surveillance cameras. |
| Two 12-channel DMA controllers | Supports concurrent high-throughput data movement: e.g., PPI → L2 SRAM → SPORT → codec, with zero CPU intervention and configurable 2-D transfer for de-interleaved video frames. |
| Dynamic voltage/frequency scaling | Reduces core voltage from 1.2 V to 0.9 V at lower frequencies (e.g., 300 MHz), cutting dynamic power by >40% - extends battery life in portable ultrasound or handheld test instruments. |
Applications
| Industrial Machine Vision | Professional Audio Processing |
|---|---|
Use Scenario: Real-time PCB inspection using dual-camera stereo imaging with sub-pixel feature matching. IC Role / Device Role / Timing Role: Dual-core DSP executing parallel Sobel edge detection (Core A) and normalized cross-correlation (Core B) on synchronized 1080p streams at 30 fps. Use Value: On-chip 128 KB L2 SRAM enables shared frame buffers between cores without external DRAM access latency, achieving <12 ms end-to-end processing delay. | Use Scenario: 16-channel digital mixing console with real-time effects (reverb, EQ, compression) and AES/EBU output. IC Role / Device Role / Timing Role: Dual-core audio processor running multithreaded TDM I/O handling (Core A) and floating-point FIR/IIR filter bank (Core B) at 96 kHz sample rate. Use Value: Dual SPORTs supporting eight stereo I²S channels provide native 16× input/output routing; 2-D DMA moves interleaved channel data to/from L1 memory without CPU cycles. |
| Medical Ultrasound Beamforming | Telecom Baseband Processing |
Use Scenario: Portable ultrasound probe performing real-time beam synthesis and B-mode image reconstruction. IC Role / Device Role / Timing Role: Symmetric multiprocessing unit executing time-domain delay-and-sum beamforming (Core A) and scan conversion/DICOM compression (Core B) on 128-channel RF data. Use Value: Dual 16×16 MACs per core deliver 2.4 billion MACs/sec - sufficient for 128×64 beamformer taps at 40 MHz sampling with <50 μs latency. | Use Scenario: Small-cell LTE femtocell baseband unit implementing OFDM modulation/demodulation and MIMO channel estimation. IC Role / Device Role / Timing Role: High-performance DSP coprocessor offloading Layer 1 PHY tasks from ARM host, using PPI for ADC/DAC interface and SPORT for CPRI-like fronthaul. Use Value: Glueless SDRAM controller supports 256 MB external memory for FFT buffers and channel impulse response storage; on-chip L2 SRAM caches frequently accessed FFT twiddle factors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF561BBCZ-6V | Same dual-core architecture and memory map, but packaged in 297-ball PBGA (27 mm × 27 mm) instead of 256-ball CSP_BGA. | Preferred for prototyping or high-vibration environments where larger BGA pitch improves solder joint reliability. | Select when board layout allows larger footprint and thermal management favors PBGA over CSP_BGA. |
| TMS320C6474GJC | Triple-core C64x+ DSP (1 GHz/core), 2 MB L2 RAM, no integrated PPI; requires external SerDes for video interface. | Better suited for high-throughput telecom baseband where raw MAC throughput outweighs integrated video peripherals. | Choose when application demands >3× the MAC performance of ADSP-BF561SKBCZ-6V and can accommodate external interface ICs. |
Compared with ADSP-BF561SKBCZ-6V, ADSP-BF561BBCZ-6V offers identical functionality in a larger, more manufacturable package, while TMS320C6474GJC trades integrated video/audio peripherals for higher single-thread performance and larger on-chip memory - making it viable only when external interface complexity is acceptable and computational density is the primary constraint.
Availability
ADSP-BF561SKBCZ-6V is available at Aetrix Electronics and suitable for industrial machine vision, professional audio equipment, medical ultrasound, and telecom baseband applications requiring stable component supply across extended product lifecycles.
Supply support for ADSP-BF561SKBCZ-6V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and digital signal processing technologies for precision measurement and real-time control.
The Blackfin family, including ADSP-BF561SKBCZ-6V, was engineered for embedded applications demanding both general-purpose programmability and deterministic DSP performance - targeting multimedia, industrial automation, and communications infrastructure.
FAQ
What is the maximum operating frequency of the ADSP-BF561SKBCZ-6V?
The ADSP-BF561SKBCZ-6V is rated for a maximum core clock frequency of 600 MHz, achieved via its on-chip PLL with multiplication factors from 0.5× to 64×. This frequency applies to both Blackfin cores simultaneously under specified 1.2 V core supply and ambient temperature conditions per the Rev. F datasheet Section "Operating Conditions." The actual sustained frequency depends on thermal design and voltage regulation stability.
Does the ADSP-BF561SKBCZ-6V support booting from external flash memory?
Yes, the ADSP-BF561SKBCZ-6V supports multiple boot modes including booting from external flash memory connected to its asynchronous memory interface. The device's boot kernel configures the EBIU to access flash at reset, allowing execution directly from 8-/16-bit NOR flash devices. Configuration is controlled by hardware strapping pins (BOOT_CFG[2:0]), and the boot ROM contains initialization code for memory controller setup before jumping to flash-resident application code.
How many independent DMA channels does the ADSP-BF561SKBCZ-6V provide?
The ADSP-BF561SKBCZ-6V provides two independent DMA controllers: DMA Controller 1 (12 channels) and DMA Controller 2 (12 channels), totaling 24 peripheral DMA channels plus two memory-to-memory DMA engines. Each peripheral with DMA capability - such as PPI, SPORT, SPI, UART - has dedicated channel(s), and the internal memory DMA controller supports high-bandwidth transfers between L1/L2 memories without CPU involvement.
What video standards are supported by the PPI interfaces on the ADSP-BF561SKBCZ-6V?
The ADSP-BF561SKBCZ-6V features two Parallel Peripheral Interface (PPI) units compliant with ITU-R BT.656 for 8-/10-/12-bit YUV 4:2:2 video data transport. Both PPI0 and PPI1 support master/slave modes, programmable pixel clock polarity, and hardware handshaking - enabling direct connection to CMOS image sensors, video decoders, and analog front-end ADCs without external glue logic.
Is the ADSP-BF561SKBCZ-6V pin-compatible with other Blackfin processors like the ADSP-BF533?
No, the ADSP-BF561SKBCZ-6V is not pin-compatible with earlier Blackfin processors such as the ADSP-BF533. It uses a 256-ball CSP_BGA package with unique ball mapping optimized for dual-core memory hierarchy and expanded peripheral routing. Signal naming, power domain allocation, and JTAG/debug pin placement differ significantly; migration requires full PCB redesign and firmware adaptation due to architectural differences in memory map and interrupt controller structure.
ADSP-BF561SKBCZ-6V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 256-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- SPI, SSP, UART
- Clock Rate:
- 600MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 328kB
- Voltage - I/O:
- 2.50V, 3.30V
- Voltage - Core:
- 1.35V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CSPBGA (12x12)
ADSP-BF561SKBCZ-6V FAQ
1.How can I place an order for ADSP-BF561SKBCZ-6V through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF561SKBCZ-6V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF561SKBCZ-6V reliable?
The price and inventory of ADSP-BF561SKBCZ-6V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF561SKBCZ-6V is usually 5 days.
3.What payment methods are accepted for ADSP-BF561SKBCZ-6V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF561SKBCZ-6V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF561SKBCZ-6V?
ADSP-BF561SKBCZ-6V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF561SKBCZ-6V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF561SKBCZ-6V?
For technical support, including ADSP-BF561SKBCZ-6V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF561SKBCZ-6V requirements.
6.How does Aetrix verify that ADSP-BF561SKBCZ-6V is sourced from the original manufacturer or authorized distributors?
All ADSP-BF561SKBCZ-6V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF561SKBCZ-6V meets industry standards.
7.What is the process for return or replacement of ADSP-BF561SKBCZ-6V?
All ADSP-BF561SKBCZ-6V units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF561SKBCZ-6V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF561SKBCZ-6V part is unused and in its original packaging.
Return procedure for ADSP-BF561SKBCZ-6V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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