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Analog Devices Inc. ADSP-BF700BCPZ-2
- Part No.:
- ADSP-BF700BCPZ-2
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 88-VFQFN Exposed Pad, CSP
- Datasheet:
-
ADSP-BF700BCPZ-2.pdf
- Description:
- IC DSP LP 128KB L2SR 88LFCSP
- Quantity:
- Payment:
- Shipping:
Inventory:242
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Product details
Overview
ADSP-BF700BCPZ-2 from Analog Devices is a Blackfin+ embedded processor IC with 200 MHz maximum speed grade, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), and dual 16-bit MAC per cycle. It integrates 2× CAN, 2× UART, USB 2.0 HS OTG, and 2× SPORT for real-time signal processing in automotive control units.
For engineers reviewing the ADSP-BF700BCPZ-2 datasheet, ADSP-BF700BCPZ-2 pinout, ADSP-BF700BCPZ-2 application, or ADSP-BF700BCPZ-2 equivalent, this page delivers verified core frequency, memory architecture, peripheral integration, thermal performance at 25°C, and AEC-Q100 qualification status - all critical for deterministic real-time embedded design.
Technical Context
The ADSP-BF700BCPZ-2 implements a Blackfin+ core with dual 16-bit MAC units, 40-bit ALUs, and 72-bit accumulator support, enabling simultaneous 16-bit multiply-accumulate operations per cycle. Its modified Harvard architecture separates 64 kB L1 instruction SRAM and 64 kB L1 data SRAM, both protected by multi-parity-bit error detection.
It features a hierarchical memory system: 136 kB on-chip L1 SRAM, up to 256 kB ECC-protected L2 SRAM, and 512 kB L2 ROM. Peripherals include 2× CAN controllers compliant with ISO 11898-1, USB 2.0 HS OTG with integrated PHY, and a Static Memory Controller supporting NOR/NAND/PSRAM devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Blackfin+ 32-bit RISC/DSP hybrid with instruction set compatibility to prior Blackfin processors |
| Max Operating Frequency | 200 MHz - defines real-time deterministic execution window for control loops and audio processing |
| L1 Memory | 136 kB total: 64 kB instruction SRAM + 64 kB data SRAM + 8 kB scratchpad, all with multi-parity-bit protection |
| L2 Memory | 256 kB ECC-protected SRAM + 512 kB ROM - enables secure boot and firmware storage without external flash |
| Peripherals | 2× CAN 2.0B, 2× UART, 2× SPORT, USB 2.0 HS OTG, 1× PPI, 8× GP timers, 1× RTC, 1× TWI, 1× MSI (SD/SDIO) |
| Package | 88-lead LFCSP_VQ (12 mm × 12 mm, RoHS-compliant) - supports compact automotive PCB layouts with thermal pad |
| Automotive Qualification | AEC-Q100 Grade 3 (−40°C to +85°C) - validated for under-hood and body-control module deployment |
Pinout & Package
ADSP-BF700BCPZ-2 is housed in an 88-lead LFCSP_VQ (QFN) package with exposed thermal pad (12 mm × 12 mm, 0.5 mm pitch). Pin assignments follow Analog Devices' ADSP-BF70x 88-Lead LFCSP lead numbering (numerical order, leads 1–88).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.05 V ±3% input for Blackfin+ core domain - requires low-noise regulation due to < 0.25 mW/MHz dynamic power |
| VDD_IO | I/O power supply | 3.3 V ±5% input for GPIO, UART, SPI, and peripheral interfaces - supports mixed-voltage system interfacing |
| CLKIN | External clock input | Accepts 1–50 MHz crystal or CMOS clock source - feeds PLL for SYSCLK generation up to 200 MHz |
| RESET | Active-low reset input | Synchronous deassertion required; initiates boot sequence per SYS_BMODE pin configuration |
| BOOT_CFG[2:0] | Boot mode selection | 3-bit strap input sampled at reset to select master/slave boot from SPI, UART, or external host |
| TDI/TDO/TCK/TMS | JTAG debug interface | IEEE 1149.1-compliant boundary scan and emulation - enables real-time tracing and secure debug authentication |
Key Features
| Feature | Design Value |
|---|---|
| Dual 16-bit MAC per cycle | Enables real-time FIR/IIR filtering and motor control algorithms without offloading to external DSP |
| 136 kB L1 SRAM with multi-parity protection | Eliminates need for external SRAM in latency-critical code/data paths while detecting single-bit errors |
| AEC-Q100 Grade 3 qualification | Validated for automotive ECU use cases including engine management, ADAS sensor fusion, and gateway modules |
| Integrated crypto accelerators | Hardware AES-128/256, SHA-1/256, and RSA support - enables fast secure boot and runtime firmware integrity checks |
| USB 2.0 HS OTG with PHY | Removes need for external transceiver; supports device/host roles for diagnostics, firmware updates, and data logging |
Applications
| Automotive Engine Control Unit | Industrial Motor Drive Controller |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline engines. IC Role / Device Role / Timing Role: Primary deterministic controller executing closed-loop PID and FFT-based noise analysis at 200 MHz. Use Value: On-chip 2× CAN interfaces enable direct communication with OBD-II and sensor networks; 136 kB L1 SRAM ensures zero-wait-state execution of safety-critical control code. |
Use Scenario: Field-oriented control (FOC) of 3-phase AC induction motors in HVAC and pump systems. IC Role / Device Role / Timing Role: Real-time signal processor handling PWM generation, current sensing ADC sampling, and torque calculation. Use Value: Dual 16-bit MAC units execute FOC inner-loop calculations in ≤1 μs; integrated 2× SPORT interfaces synchronize with external gate drivers and encoder feedback. |
| Medical Ultrasound Beamformer | Smart Energy Metering Gateway |
Use Scenario: Digital beamforming and RF echo processing in portable ultrasound imaging devices. IC Role / Device Role / Timing Role: High-throughput DSP engine performing channel summation, delay compensation, and envelope detection. Use Value: 200 MHz Blackfin+ core processes 128-channel beam data with sub-microsecond latency; 256 kB L2 SRAM buffers raw echo data before compression. |
Use Scenario: Multi-tariff energy meter with HPLC communication, tamper detection, and load profiling. IC Role / Device Role / Timing Role: Secure system-on-chip managing metrology ADC, PLC modem, and encrypted data reporting. Use Value: Crypto hardware accelerators perform AES-128 encryption of consumption logs; 2× UART + 1× TWI support DLMS/COSEM and smart grid protocol stacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF701BCPZ-2 | 400 MHz max speed grade, 184-ball CSP_BGA only, adds DDR2/LPDDR interface | Higher-performance motor control requiring >200 MHz deterministic throughput and external DRAM | Select when application demands higher clock rate and larger memory footprint; not pin-compatible with ADSP-BF700BCPZ-2 |
| ADSP-BF702BCPZ-2 | 200 MHz speed grade, same 88-lead LFCSP package, adds 4-channel 12-bit ADC | Systems requiring integrated analog front-end for sensor monitoring without external ADC | Choose when analog acquisition is needed on same die; identical pinout enables drop-in replacement if ADC functionality is unused |
Compared with ADSP-BF700BCPZ-2, ADSP-BF701BCPZ-2 delivers 2× clock headroom but requires BGA rework and DDR layout, while ADSP-BF702BCPZ-2 retains full pin compatibility and adds ADC capability - making it the only true mechanical and electrical alternative for cost-sensitive upgrades.
Availability
ADSP-BF700BCPZ-2 is available at Aetrix Electronics and suitable for automotive engine control units, industrial motor drives, and medical ultrasound beamformers requiring stable component supply across extended product lifecycles.
Supply support for ADSP-BF700BCPZ-2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA.
The ADSP-BF700BCPZ-2 belongs to the Blackfin+ processor family, designed specifically for deterministic real-time embedded applications where combined MCU programmability and DSP acceleration are required - especially in automotive, industrial, and medical edge devices.
FAQ
What is the maximum operating frequency of the ADSP-BF700BCPZ-2?
The ADSP-BF700BCPZ-2 has a maximum speed grade of 200 MHz, confirmed in the Analog Devices ADSP-BF70x datasheet Rev. D, Table 1. This defines its real-time deterministic execution capability for control loops and signal processing tasks. The core achieves this frequency with < 100 mW core domain power at 25°C junction temperature, delivering 0.25 mW/MHz efficiency. System clock (SYSCLK) is derived from the internal PLL fed by CLKIN.
Does the ADSP-BF700BCPZ-2 support AEC-Q100 qualification?
Yes, the ADSP-BF700BCPZ-2 is AEC-Q100 qualified for automotive applications, specifically Grade 3 (−40°C to +85°C ambient). This qualification is explicitly stated in the "Features" section of the official datasheet and validated across electrical, thermal, and reliability test suites. It enables use in engine control units, body electronics, and ADAS sensor interfaces where automotive-grade robustness is mandatory.
What memory resources are integrated into the ADSP-BF700BCPZ-2?
The ADSP-BF700BCPZ-2 integrates 136 kB of on-chip L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), all protected by multi-parity-bit error detection. It also includes 256 kB of ECC-protected L2 SRAM and 512 kB of L2 ROM. Unlike higher variants, it does not include DDR2/LPDDR interface support - that feature is reserved for ADSP-BF701 and above in the BF70x family.
Which peripherals are available on the ADSP-BF700BCPZ-2?
The ADSP-BF700BCPZ-2 provides 2× CAN 2.0B controllers, 2× UARTs, 2× SPORTs, USB 2.0 HS OTG with integrated PHY, 1× PPI, 8× general-purpose timers, 1× real-time clock, 1× TWI (I²C), 1× MSI (SD/SDIO), and a Static Memory Controller. It lacks the 4-channel 12-bit ADC found in ADSP-BF702/704/706 variants and does not support DDR2/LPDDR interfaces present in ADSP-BF701/703/705/707.
What package type is used for the ADSP-BF700BCPZ-2?
The ADSP-BF700BCPZ-2 uses an 88-lead LFCSP_VQ (QFN) package measuring 12 mm × 12 mm with 0.5 mm pitch and RoHS compliance. This package includes an exposed thermal pad for enhanced heat dissipation in automotive and industrial environments. Pin assignments follow the documented 88-Lead LFCSP lead numbering scheme in the ADSP-BF70x datasheet, Section "12 mm × 12 mm 88-Lead LFCSP (QFN) Signal Descriptions".
ADSP-BF700BCPZ-2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 88-VFQFN Exposed Pad, CSP
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Blackfin+
- Interface:
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 200MHz
- Non-Volatile Memory:
- ROM (512kB)
- On-Chip RAM:
- 128kB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 88-LFCSP-VQ (12x12)
ADSP-BF700BCPZ-2 FAQ
1.How can I place an order for ADSP-BF700BCPZ-2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF700BCPZ-2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF700BCPZ-2 reliable?
The price and inventory of ADSP-BF700BCPZ-2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF700BCPZ-2 is usually 5 days.
3.What payment methods are accepted for ADSP-BF700BCPZ-2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF700BCPZ-2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF700BCPZ-2?
ADSP-BF700BCPZ-2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF700BCPZ-2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF700BCPZ-2?
For technical support, including ADSP-BF700BCPZ-2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF700BCPZ-2 requirements.
6.How does Aetrix verify that ADSP-BF700BCPZ-2 is sourced from the original manufacturer or authorized distributors?
All ADSP-BF700BCPZ-2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF700BCPZ-2 meets industry standards.
7.What is the process for return or replacement of ADSP-BF700BCPZ-2?
All ADSP-BF700BCPZ-2 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF700BCPZ-2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF700BCPZ-2 part is unused and in its original packaging.
Return procedure for ADSP-BF700BCPZ-2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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