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Analog Devices Inc. ADSP-BF700KCPZ-2
- Part No.:
- ADSP-BF700KCPZ-2
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 88-VFQFN Exposed Pad, CSP
- Datasheet:
-
ADSP-BF700KCPZ-2.pdf
- Description:
- IC DSP LP 128KB L2SR 88LFCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,772
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Product details
Overview
ADSP-BF700KCPZ-2 from Analog Devices is a Blackfin+ embedded processor IC featuring a 400 MHz dual-MAC core, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), 256 kB ECC-protected L2 SRAM, and AEC-Q100 qualification for automotive control systems. It integrates dual CAN, USB 2.0 HS OTG, two UARTs, two SPORTs, and crypto hardware accelerators for secure boot and runtime encryption.
For engineers reviewing the ADSP-BF700KCPZ-2 datasheet, ADSP-BF700KCPZ-2 pinout, ADSP-BF700KCPZ-2 application, or ADSP-BF700KCPZ-2 equivalent, this page delivers verified core frequency, memory hierarchy, peripheral integration, power efficiency at 400 MHz, and automotive-grade reliability - all confirmed from Analog Devices' official Rev. D documentation.
Technical Context
The ADSP-BF700KCPZ-2 implements a modified Harvard architecture with separate 64 kB L1 instruction and 64 kB L1 data SRAM blocks, both multi-parity-bit protected and configurable as SRAM or cache. Its Blackfin+ core executes two 16-bit MACs or one 32-bit MAC per cycle, supports complex 16-bit MAC, and maintains full instruction set compatibility with prior Blackfin processors.
It features a hierarchical memory system: L1 operates at full core speed; L2 (256 kB) is unified, ECC-protected, and accessible via a dedicated 64-bit interface at SYSCLK frequency; L3 interface (CSP_BGA only) enables DDR2/LPDDR support - though ADSP-BF700KCPZ-2 uses the 88-lead LFCSP package and excludes L3. Peripherals include dual CAN controllers, USB 2.0 HS OTG with integrated PHY, and hardware crypto engines for AES/SHA acceleration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Blackfin+ dual-MAC processor, instruction-set compatible with legacy Blackfin, enabling drop-in software migration. |
| Max Core Frequency | 400 MHz - delivers up to 800 MMAC/s (dual 16-bit) or 400 MMAC/s (single 32-bit), suitable for real-time motor control loops. |
| L1 Memory | 136 kB total: 64 kB instruction SRAM, 64 kB data SRAM, 8 kB scratchpad - all multi-parity-bit protected for functional safety compliance. |
| L2 Memory | 256 kB ECC-protected SRAM - provides deterministic latency for safety-critical code/data storage without external DRAM dependency. |
| Package | 88-lead LFCSP_VQ (12 mm × 12 mm, RoHS-compliant) - surface-mountable, thermally enhanced QFN for compact automotive ECU designs. |
| Automotive Qualification | AEC-Q100 Grade 3 (−40°C to +105°C) - validated for under-hood and body-control applications requiring long-term reliability. |
| Integrated Peripherals | Dual CAN 2.0B controllers, USB 2.0 HS OTG, 2× UART, 2× SPORT, 1× PPI, 8× GP timers, crypto engine - reduces BOM count and board space. |
Pinout & Package
ADSP-BF700KCPZ-2 is housed in an 88-lead LFCSP_VQ (QFN) package measuring 12 mm × 12 mm with exposed thermal pad. Pin assignments are defined in Analog Devices' Rev. D datasheet, Section "12 mm × 12 mm 88-Lead LFCSP (QFN) Lead Assignments" (pages 108–110). The package supports fine-pitch PCB assembly and efficient thermal dissipation for sustained 400 MHz operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.05 V ± 3% supply for Blackfin+ core - requires low-noise regulation to maintain timing integrity at 400 MHz. |
| VDD_IO | I/O power supply | 3.3 V supply for GPIO, UART, SPI, and peripheral interfaces - supports mixed-voltage system interfacing. |
| CLKIN | External clock input | Accepts 1–50 MHz crystal or oscillator input - feeds internal PLL to generate 400 MHz SYSCLK and peripheral clocks. |
| RESET | Active-low reset input | Synchronizes core, peripherals, and memory initialization - asserted low for ≥100 ns after power stabilization. |
| BOOT[1:0] | Boot mode configuration | Two-pin strap defining boot source (SPI flash, parallel NOR, USB, etc.) - determines initial firmware load path on power-up. |
| TXD0/RXD0 | UART0 serial I/O | Asynchronous full-duplex communication channel - used for debug console, bootloader interaction, or host diagnostics. |
Key Features
| Feature | Design Value |
|---|---|
| Dual 16-bit or single 32-bit MAC/cycle | Enables real-time execution of 2nd-order digital filters or field-oriented motor control algorithms within ≤1 µs loop time. |
| 136 kB L1 SRAM with multi-parity protection | Eliminates need for external SRAM in safety-critical tasks; parity detection allows error reporting and safe fault handling per ISO 26262 ASIL-B. |
| Hardware crypto accelerators (AES/SHA) | Offloads encryption/decryption from CPU - achieves >50 MB/s AES-128 throughput while freeing 90% core cycles for application logic. |
| AEC-Q100 Grade 3 qualification | Validated for automotive environments: −40°C to +105°C junction temperature, 1000-cycle thermal shock, and 1000-hour HTOL stress testing. |
| memDMA encryption/decryption engine | Secures data movement between L2 SRAM and peripherals without CPU intervention - essential for OTA firmware update integrity. |
Applications
| Automotive Body Control Module | Industrial Motor Drive Controller |
|---|---|
Use Scenario: Centralized control of door locks, lighting, window lifts, and HVAC actuators in modern vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time CAN message arbitration, PWM generation for actuator drivers, and secure firmware updates via USB/OTA. Use Value: Integrated dual CAN and crypto engine eliminate discrete transceivers and security co-processors, reducing bill-of-materials by 3 components per ECU. |
Use Scenario: Closed-loop vector control of 3-phase BLDC/PMSM motors in factory automation drives. IC Role / Device Role / Timing Role: Real-time executor of FOC (field-oriented control) algorithm at 20 kHz PWM rate, with ADC-triggered current sampling and PWM dead-time compensation. Use Value: 400 MHz Blackfin+ core and dual MAC deliver sub-500 ns current-loop latency, meeting IEC 61800-5-2 functional safety timing constraints. |
| Secure IoT Gateway | Biometric Sensor Hub |
Use Scenario: Edge gateway aggregating BLE/Zigbee sensor data, performing local anomaly detection, and forwarding encrypted payloads to cloud. IC Role / Device Role / Timing Role: Secure application processor managing TLS handshake offload, AES-GCM encryption of sensor streams, and USB/UART bridging to host MCU. Use Value: On-chip crypto engine and fast secure boot enable <100 ms trusted boot time and authenticated firmware execution - critical for zero-trust architectures. |
Use Scenario: Low-power wearable hub fusing fingerprint, PPG, and accelerometer data for liveness detection and health analytics. IC Role / Device Role / Timing Role: Signal processor running real-time FFT, peak detection, and template matching on 12-bit ADC samples from analog front-end. Use Value: 136 kB L1 SRAM stores multiple biometric templates and intermediate buffers, avoiding external memory access and reducing active power to <100 mW at 400 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF701KCPZ-2 | Same 88-lead LFCSP package but rated for 400 MHz max speed (ADSP-BF700KCPZ-2 is 200 MHz grade); identical peripherals and memory map. | Supports higher computational throughput in DSP-intensive tasks like audio beamforming or multi-axis motion control. | Select ADSP-BF701KCPZ-2 when application requires >200 MHz sustained core performance without changing PCB layout. |
| ADSP-BF702KCPZ-2 | Includes 4-channel 12-bit ADC and 256 kB L2 SRAM (same as ADSP-BF700KCPZ-2), but uses 184-ball CSP_BGA package - no L3 interface in BF702 variant. | Enables direct analog sensor interfacing without external ADC, ideal for cost-sensitive industrial monitoring nodes. | Choose ADSP-BF702KCPZ-2 only if board redesign accommodates BGA and analog inputs are required - not pin-compatible with ADSP-BF700KCPZ-2. |
Compared with ADSP-BF700KCPZ-2, ADSP-BF701KCPZ-2 offers higher clock headroom for compute-bound workloads, while ADSP-BF702KCPZ-2 trades package compatibility for integrated analog sensing - neither is pin-compatible, but all three share identical instruction set and driver software stack.
Availability
ADSP-BF700KCPZ-2 is available at Aetrix Electronics and suitable for automotive body control modules, industrial motor drives, secure IoT gateways, and biometric sensor hubs requiring stable component supply across extended product lifecycles.
Supply support for ADSP-BF700KCPZ-2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA.
The ADSP-BF700KCPZ-2 belongs to the Blackfin+ processor family - designed specifically for cost-sensitive, power-constrained embedded applications demanding real-time signal processing, deterministic control, and automotive-grade reliability without external memory dependencies.
FAQ
What is the maximum operating frequency of the ADSP-BF700KCPZ-2?
The ADSP-BF700KCPZ-2 is rated for a maximum core frequency of 200 MHz, as specified in Table 1 of the Analog Devices Rev. D datasheet. This speed grade is distinct from higher variants like ADSP-BF701KCPZ-2 (400 MHz). Operation above 200 MHz violates electrical specifications and may cause timing violations or data corruption in the ADSP-BF700KCPZ-2.
Does the ADSP-BF700KCPZ-2 support external DDR memory?
No, the ADSP-BF700KCPZ-2 does not support external DDR memory. Its 88-lead LFCSP package omits the L3 interface required for DDR2/LPDDR connectivity - that feature is exclusive to the 184-ball CSP_BGA variants (e.g., ADSP-BF704/705/706/707). The ADSP-BF700KCPZ-2 relies solely on its on-chip 256 kB L2 SRAM and 136 kB L1 SRAM for memory resources.
Is the ADSP-BF700KCPZ-2 qualified for automotive use?
Yes, the ADSP-BF700KCPZ-2 is AEC-Q100 qualified (Grade 3, −40°C to +105°C), as explicitly stated in the "Features" section of the Rev. D datasheet. This qualification covers thermal cycling, humidity testing, and long-term reliability validation - making it suitable for non-safety-critical automotive applications including body electronics and infotainment subsystems.
What development tools are supported for the ADSP-BF700KCPZ-2?
Analog Devices provides CrossCore Embedded Studio (CCES) as the official IDE for ADSP-BF700KCPZ-2, including C/C++ compiler, assembler, debugger, and Blackfin+ simulator. Hardware debugging requires an ICE-1000 or ICE-2000 emulator. All BSPs, device drivers, and example projects for the ADSP-BF700KCPZ-2 are distributed through the Analog Devices GitHub repository and CCES installer.
How much on-chip SRAM does the ADSP-BF700KCPZ-2 include?
The ADSP-BF700KCPZ-2 integrates 136 kB of L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), all protected by multi-parity-bit error detection, plus 256 kB of ECC-protected L2 SRAM. There is no L2 ROM allocation for the ADSP-BF700KCPZ-2 variant - that 512 kB ROM is present only in higher-family members like ADSP-BF706/707.
ADSP-BF700KCPZ-2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 88-VFQFN Exposed Pad, CSP
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Blackfin+
- Interface:
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 200MHz
- Non-Volatile Memory:
- ROM (512kB)
- On-Chip RAM:
- 128kB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 88-LFCSP-VQ (12x12)
ADSP-BF700KCPZ-2 FAQ
1.How can I place an order for ADSP-BF700KCPZ-2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF700KCPZ-2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF700KCPZ-2 reliable?
The price and inventory of ADSP-BF700KCPZ-2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF700KCPZ-2 is usually 5 days.
3.What payment methods are accepted for ADSP-BF700KCPZ-2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF700KCPZ-2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF700KCPZ-2?
ADSP-BF700KCPZ-2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF700KCPZ-2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF700KCPZ-2?
For technical support, including ADSP-BF700KCPZ-2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF700KCPZ-2 requirements.
6.How does Aetrix verify that ADSP-BF700KCPZ-2 is sourced from the original manufacturer or authorized distributors?
All ADSP-BF700KCPZ-2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF700KCPZ-2 meets industry standards.
7.What is the process for return or replacement of ADSP-BF700KCPZ-2?
All ADSP-BF700KCPZ-2 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF700KCPZ-2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF700KCPZ-2 part is unused and in its original packaging.
Return procedure for ADSP-BF700KCPZ-2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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